Abstract: The present disclosure provides a method for improving an induction rate of a luffa embryoid by radiation mutagenesis. The present disclosure belongs to the technical field of crop tissue culture and breeding. In the present disclosure, the method includes conducting radiation of pollens, conducting pollination of radiated pollens, conducting disinfection, and conducting cultivation. The method of the present disclosure provides a technical support for luffa haploid breeding and further improves a breeding efficiency.

Abstract: Disclosed is a hole wall thickness gauge. In the technical solution, a deburring function and a measurement function are integrated, and measurement is completed while deburring is completed. The hole wall thickness gauge is ingenious in design, flexible and high in efficiency and has a quite high practical application value.

Abstract: The disclosure discloses a double-station wheel deburring device consisting of two major systems. One is a wheel double-station exchange system responsible for feeding and discharging of two wheels, switching between a first working table and a second working table, switching between an upper station and a lower station, and rotation of the wheels. The other is a cutter feeding system responsible for feeding of a rim deburring blade, a riser deburring blade and brushes. The device can simultaneously remove burrs on outer rims, risers and valve holes of two wheels. Through the interactive double-station working tables, the feeding and discharging operation and the deburring operation are simultaneously carried out at separate stations. The device can be applied to deburring of wheels of different specifications. The disclosure also discloses a double-station wheel deburring method.

Abstract: Techniques are provided herein for forming thin film transistor (TFT) structures having one or more doped contact regions. The addition of certain dopants can be used to increase conductivity and provide higher thermal stability in the contact regions of the TFT. Memory structures having TFT structures are arranged in a two-dimensional array within one or more interconnect layers and stacked in a vertical direction such that multiple tiers of memory structure arrays are formed within the interconnect region. Any of the TFT structures within the memory structures may include one or more contacts that are doped with additional elements. The doping profile of the contacts can be tuned to optimize performance, stability, and reliability of the TFT structure. Furthermore, additional doping may be performed within the area beneath the contacts and extending into the semiconductor region.

Abstract: An integrated circuit includes a first layer, and a second layer above the first layer. A third layer is between a first section of the first layer and a first section of the second layer. A fourth layer is laterally adjacent to the third layer, the fourth layer between a second section of the first layer and a second section of the second layer. In an example, a first dielectric material of the third layer is different (e.g., one or both of compositionally different and structurally different) from a second dielectric material of the fourth layer. In an example, the third and fourth layers are etch stop layers. In some cases, the third and fourth layers are coplanar with each other with respect to their top surfaces, or their bottom surfaces, or both their top and bottom surfaces.

Abstract: An integrated circuit includes a first layer comprising dielectric material. One or both of an interconnect feature and a device are within the dielectric material of the first layer. The integrated circuit further includes a second layer above the first layer, where the second layer includes dielectric material. A third layer is between the first layer and the second layer. In an example, the third layer can be, for example, an etch stop layer or a liner layer or barrier layer. In an example, an impurity is within the first layer and the third layer. In an example, the impurity has a detectable implant depth profile such that a first distribution of the impurity is within the first layer and a second distribution of the impurity is within the third layer.

Abstract: The present disclosure belongs to the field of machining of chamfers of holes. The hole chamfering device includes blades in bilateral symmetry and a blade distance adjusting, through the blade distance adjusting, the distance between the blades on the left side and the right side can be adjusted, thus, after the blades on the left side and the right side of the hole chamfering device process chamfers on the front face of a hole, the distance between the blades is reduced to enable the blades to pass through the hole to process chamfers on the back face of the hole, after processing of the chamfers on the back face of the hole is completed, the distance between the blades is reduced, the hole chamfering device not only can chamfer the front face of the hole, but also can chamfer the back face of the hole.

Abstract: A memory device includes a first electrode, a conductive layer including iridium above the first electrode and a magnetic junction directly on the conductive layer. The magnetic junction further includes a pinning structure above the conductive layer, a fixed magnet above the pinning structure, a tunnel barrier on the fixed magnet, a free magnet on the tunnel barrier layer and a second electrode above the free magnet. The conductive layer including iridium and the pinning structure including iridium provide switching efficiency.

Abstract: The present disclosure provides an adjustable device for removing burrs of a back cavity of a wheel. The adjustable device for removing the burrs of the back cavity of the wheel includes a frame provided with a rotary table inside, a support frame is fixedly connected to the rotary table, and a left rotary table and a right rotary table are arranged on the support frame. The device is ingenious in design, novel in conception, high in universality, short in cycle time and high in efficiency, and is suitable for removing burrs of wheels in different specifications.

Abstract: The present disclosure belongs to the technical field of hole machining equipment, and provides a hole chamfering device including blades in bilateral symmetry and a blade posture adjusting assembly. The hole chamfering device not only can be fed from the front face of a hole to complete chamfering work on the front face of the hole, but also can solve the problem of chamfering the back face of the hole under the condition that a chamfering tool cannot be directly fed from the back face of the hole. The hole chamfering device can be fed from the front face of the hole to complete chamfering work on the front face and the back face of the hole, and meanwhile, can remove burrs in the hole, thereby meeting the machining requirement of conventional chamfering of the hole.

Abstract: A device for removing wheel burrs with first brushes and second brushes includes a wheel positioning and pressing system configured to position and press of the wheel, a center cap mouth burr removing system configured to remove burrs of the wheel cap mouth with the second brushes, and a wheel spoke back cavity burr removing system configured to remove burrs of the wheel spoke back cavity with the first brushes. The first brushes are mounted on an expandable first capsule and the second brushes are mounted on an expandable second conical capsule, and filling the expandable first capsule and the expandable second conical capsule with air and removing air from the expandable first capsule and the expandable second conical capsule change the shapes of the first brushes and the second brushes to accommodate wheels with different shape and size for deburring.

Abstract: A fucosylated chondroitin sulfate oligosaccharide having the structure as shown in J, and further disclosed is a method for preparing the fucosylated chondroitin sulfate oligosaccharide: using a chondroitin sulfate A salt as a raw material, sequentially performing enzymolysis, a group protection operation, and glycosylation to synthesize the oligosaccharide compound; the certainty of the described structure allows said oligosaccharide to be applied to the medical field.

Abstract: Wheel machining equipment is provided, including a first-stage turning system used for carrying out first-stage turning of a wheel, a high-precision connection system used for carrying out high-precision positioning conversion from first-stage turning to second-stage turning, and a second-stage turning system used for carrying out second-stage turning of the wheel. A wheel machining method is also provided.

Abstract: A machined wheel post-processing equipment includes a wheel inlet roller way, a lower machine frame, lower guide posts, lower air cylinders, a supporting plate, guide sleeves, a lifting table, guide rails, a clamping cylinder, a left sliding plate, a right sliding plate, a rack and pinion, servomotors, a lifting roller way, clamping wheels, a first servomotor, and a overturning platform.

Abstract: The present application provides an adjustable mandrel and a fixture. The adjustable mandrel comprises an outer-diameter adjusting assembly and a height adjusting assembly, wherein the external diameter and the height of the mandrel can be adjusted according to wheels in different specifications, the wheels in different specifications are clamped, and the radial positioning of the wheel and the axial positioning of the wheel during second-step processing are realized. Two adjusting systems supplement each other, so that the structure is novel, the concept is ingenious, the universality is high, the application range is wide, and the machining cost is reduced.

Abstract: The wheel outer rim groove polishing device includes three major systems, which are a wheel rotation system which is used for positioning, clamping and rotating of a wheel, thereby polishing all grooves in the circumferential direction of the wheel, a left polishing system for reciprocally polishing groove tool grains in the longitudinal direction, and a right polishing system for reciprocally polishing groove tool grains in the transverse direction; and three systems cooperate with each other and are combined orderly to jointly complete the polishing of tool grains on the wheel outer rim grooves. The present disclosure can meet the requirements for polishing the tool grains on the wheel outer rim grooves. Compared with artificial polishing, the device improves the polishing effect, improves the work efficiency, and reduces the risk of rim deformation. The device has the characteristics of high efficiency, practicality, easy manufacture, flexible operation and the like.

Abstract: Disclosed is a hole wall thickness gauge. In the technical solution, a deburring function and a measurement function are integrated, and measurement is completed while deburring is completed. The hole wall thickness gauge is ingenious in design, flexible and high in efficiency and has a quite high practical application value.

Abstract: The present disclosure belongs to the field of machining of chamfers of holes. The hole chamfering device includes blades in bilateral symmetry and a blade distance adjusting, through the blade distance adjusting, the distance between the blades on the left side and the right side can be adjusted, thus, after the blades on the left side and the right side of the hole chamfering device process chamfers on the front face of a hole, the distance between the blades is reduced to enable the blades to pass through the hole to process chamfers on the back face of the hole, after processing of the chamfers on the back face of the hole is completed, the distance between the blades is reduced, the hole chamfering device not only can chamfer the front face of the hole, but also can chamfer the back face of the hole.

Abstract: The present disclosure belongs to the technical field of hole machining equipment, and provides a hole chamfering device including blades in bilateral symmetry and a blade posture adjusting assembly. The hole chamfering device not only can be fed from the front face of a hole to complete chamfering work on the front face of the hole, but also can solve the problem of chamfering the back face of the hole under the condition that a chamfering tool cannot be directly fed from the back face of the hole. The hole chamfering device can be fed from the front face of the hole to complete chamfering work on the front face and the back face of the hole, and meanwhile, can remove burrs in the hole, thereby meeting the machining requirement of conventional chamfering of the hole.

Abstract: A high-strength A356 alloy and a preparation method thereof are disclosed. Modifiers Ba and Zr are added to improve the as-cast structure of the alloy. The high-pressure solidified A356 alloy prepared by a high-pressure solidification technology has finer grains, and the elements such as Mg and Si have higher supersaturated solubility in a matrix.