Abstract: An integrated circuit (IC) device includes a master latch circuit having a first clock input and a data output, a slave latch circuit having a second clock input and a data input electrically coupled to the data output of the master latch circuit, and a clock circuit. The clock circuit is electrically coupled to the first clock input by a first electrical connection configured to have a first time delay between the clock circuit and the first clock input. The clock circuit is electrically coupled to the second clock input by a second electrical connection configured to have a second time delay between the clock circuit and the second clock input. The first time delay is longer than the second time delay.

Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.

Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.

Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Abstract: A pump device adapted to be mounted on a liquid container includes a nozzle head formed on a top portion of a piston reciprocatively held in a liquid accumulator mounted on the liquid container, a restoring spring resiliently retained between the nozzle head and a fastening ring which is secured on an upper portion of the accumulator, a container cap secured on a top portion of the liquid container and fastened between the fastening ring and a flange of the accumulator, a suction tube connected to the accumulator and inserted in the liquid container for sucking liquid into the accumulator; characterized in that the restoring spring is disposed around a piston rod outside an interior of the pump and of the accumulator to prevent contamination of the liquid by the spring or to prevent corrosion of the spring by the liquid.

Abstract: An improved pump-head structure, which has a valve annulus mounted on the inlet to the lower end of a liquid accumulator of the pump-head structure to prevent leakage of a liquid from the liquid accumulator. A plunger valve is connected to the valve annulus via a spring piece, which exerts a downward force on the plunger valve and thus maintains the inlet of the lower end of the liquid accumulator forcedly and tightly closed under normal conditions by the downward action of the plunger valve.