Abstract: A bonding tool and a bonding method are provided. The method includes attaching a semiconductor die to a bonding tool having a first surface, wherein the bonding tool comprises a bending member movably arranged in a trench of the bonding tool, and the bending member protrudes from the first surface and bends the semiconductor die; moving the semiconductor die toward a semiconductor wafer to cause a retraction of the bending member and a partial bonding at a portion of the semiconductor die and the semiconductor wafer; and causing a full bonding between the semiconductor die and the semiconductor wafer subsequent to the partial bonding.

Abstract: A touch panel module includes a frame, a base plate, a touch material layer, a transmission cable and a first attaching layer. The frame with an opening and a breach connected to the opening formed therein is disposed on a casing. The base plate is disposed on the casing and located inside the opening. The touch material layer is disposed on the base plate, and a peripheral portion of the touch material layer is attached to the frame for sealing the base plate inside the opening. The transmission cable is connected to the touch material layer in a position near the peripheral portion and passes through the casing via the breach. The first attaching layer attaches the frame and the casing for sealing a gap between the frame and the casing, so as to prevent liquids from entering the opening and the breach from the gap.