Patents by Inventor Hui-Chen Yang

Hui-Chen Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit manufacturing system
    Patent number: 8689434
    Abstract: An ICs modeling manufacturing procedure is disclosed. A first pattern is printed on a first surface of a printed circuit board (PCB). The first pattern includes a first barcode and a plurality of production codes. A plurality of elements are disposed on the first surface of the PCB. The PCB is heated to fix the elements on the first surface and secure the first pattern on the first surface of the PCB. When the first pattern is read, a first production information is obtained.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: April 8, 2014
    Assignee: Nanya Technology Corporation
    Inventor: Hui-Chen Yang
  • INTEGRATED CIRCUITS MODELING MANUFACTURING PROCEDURE AND MANUFACTURING SYSTEM UTILIZING THE SAME
    Publication number: 20110087359
    Abstract: An ICs modeling manufacturing procedure is disclosed. A first pattern is printed on a first surface of a printed circuit board (PCB). The first pattern includes a first barcode and a plurality of production codes. A plurality of elements are disposed on the first surface of the PCB. The PCB is heated to fix the elements on the first surface and secure the first pattern on the first surface of the PCB. When the first pattern is read, a first production information is obtained.
    Type: Application
    Filed: October 14, 2009
    Publication date: April 14, 2011
    Applicant: NANYA TECHNOLOGY CORPORATION
    Inventor: Hui-Chen Yang