Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: The present invention discloses a bone void filler and a method for manufacturing the same by natural calcium-containing waste, which comprises steps of mixing 5-20 wt % of a calcium-containing waste powder, 5-20 wt % of acetic acid and a remaining weight percentage of water uniformly to obtain a mixing solution; adding 5-20 vol % of a diammonium hydrogen phosphate solution to the mixing solution to obtain a suspension; controlling a pH value of the suspension to obtain an alkaline solution; leaving the alkaline solution at room temperature for precipitation for 0.1 to 72 hours, centrifuging or suction filtrating the alkaline solution to obtain a precipitate, drying and grinding the precipitate to obtain hydroxyapatite; and mixing 30-60 wt % of a pore former and 30-60 wt % of the hydroxyapatite and a remaining weight percentage of a binder uniformly to form a mixture, compression molding the mixture in a mold and sintering the compression-molded mixture.

Abstract: The present invention discloses a bone void filler and a method for manufacturing the same by natural calcium-containing waste, which comprises steps of mixing 5-20 wt % of a calcium-containing waste powder, 5-20 wt % of acetic acid and a remaining weight percentage of water uniformly to obtain a mixing solution; adding 5-20 vol % of a diammonium hydrogen phosphate solution to the mixing solution to obtain a suspension; controlling a pH value of the suspension to obtain an alkaline solution; leaving the alkaline solution at room temperature for precipitation for 0.1 to 72 hours, centrifuging or suction filtrating the alkaline solution to obtain a precipitate, drying and grinding the precipitate to obtain hydroxyapatite; and mixing 30-60 wt % of a pore former and 30-60 wt % of the hydroxyapatite and a remaining weight percentage of a binder uniformly to form a mixture, compression molding the mixture in a mold and sintering the compression-molded mixture.

Abstract: A method of delivering antigenic peptide into the endoplasmic reticulum by the fusion protein includes: (a) preparing a fusion protein with a Tat-derived peptide, a (His)6 peptide, a ubiquitin, and an antigenic peptide provided in turn from the N-terminal end to the C-terminal end; (b) delivering the fusion protein across the cell membrane into the cytosol through the Tat-derived peptide; (c) cleaving the antigenic peptide from the fusion protein by cytosolic ubiquitin C-terminal hydrolases; and (d) transporting the antigenic peptide into the endoplasmic reticulum (ER) by a TAP1/2 transporter on the ER membrane.

Abstract: A stove structure includes a stove body. The stove body has a heat source portion and a wall portion. The wall portion has an inner wall and an outer wall. The inner wall and the outer wall are connected by a plurality of cross-section conducting members. Between the inner wall, the outer wall and the cross-section conducting members is provided with a low conductivity coefficient member. The cross-section conducting members extend the heat conduction distance and decrease the contact area of heat conduction. The lower conductivity coefficient member and the cross-section conducting members lower the heat conduction rate. The temperature of the outer wall is lowered to a second temperature and the temperature in the heating portion of the stove body is kept at the first high temperature.

Abstract: A circular cylindrical broil apparatus includes an outer cylinder and a core part. The outer cylinder has an upper opening at the top thereof and is provided with a lower recess at an outer wall thereof and the lower recess is inserted with a movable heat initiating plate. The core part has the bottom thereof being provided with a lower net and extends upward a plurality of circular heating cages from the lower net to form a central broil zone. Each of the heating cages has an open top and providing a core wall next to the central broil zone with a plurality of perforations. Once the heating cages are filled with fuel and placed in the outer cylinder and the initiating plate inserted into the lower recess is ignited for the fuel being burned or the heating cages are placed with a plurality of electrical heating plates and the electrical heating plates are powered on, broiled stuff, which is placed in the broil zone, can be broiled effectively.