Abstract: A package structure includes: a substrate, where a plurality of welding pads are disposed on a surface of the substrate, each of the plurality of welding pads includes a bottom layer welding pad and a top layer welding pad which are stacked onto one another, and at least two of peripheral surfaces of the top layer welding pad are protruded relative to peripheral surfaces of the bottom layer welding pad; a chip located on the substrate and spaced apart from the substrate; and a plurality of solder balls, where the plurality of solder balls are welded to the substrate and the chip, and the plurality of solder balls wrap the top layer welding pads.

Abstract: Embodiments relate to the field of semiconductors, and provide a semiconductor device and a storage system. The semiconductor device includes a first printed circuit board and a capacitor structure positioned on the first printed circuit board. The first printed circuit board includes a plurality of memories arranged in sequence along a first direction, and each of the memories has a first power terminal and a first ground terminal. The capacitor structure includes a plurality of capacitors, and each of the capacitors has a second power terminal corresponding to the first power terminal and a second ground terminal corresponding to the first ground terminal, wherein the first power terminal is electrically connected to the second power terminal, and the first ground terminal is electrically connected to the second ground terminal. The semiconductor device can at least solve a problem of capacitor arrangement space, which is advantageous to optimizing power quality.