Abstract: The present disclosure relates to a method for preparing polyorganosiloxanes, comprising the following steps: a) reacting together a hydroxyl-terminated polysiloxane and a dialkoxysilane or an oligomer thereof in the presence of Catalyst 1, and b) reacting the product of Step a) with an endcapper in the presence of Catalyst 2 to form the polyorganosiloxane. According to this method, poly-organosiloxanes with an appropriate degree of the polymerization and viscosity are prepared by the polycondensation and equilibration reactions sequentially, and can significantly reduce the viscosity, and improve the flowability and thermal conductivity of the resulting silicone compositions, compared with other polysiloxanes at the same high thermally conductive filler loading.

Abstract: The present disclosure relates to a polyorganosiloxane comprising the following structural formula: X—[Si(R1)2O]—[Si(R2)2O]m—[SiR2CaH2a+1O]n—[Si(R1)2]—X, where a is an arbitrary integer between 6 and 18, n is an arbitrary number between 0.7 and 20, m is an arbitrary number between 10 and 1500, m/n is an arbitrary number greater than 20, R1 or R2 is a C1-C5 alkyl group, X represents one or more groups selected from among C2-C6 alkenyl, alkoxy, hydroxyl and hydrogen. The polyorganosiloxane can significantly lower the viscosity, and improve the flowability and processability, of the resulting silicone composition, compared with other polyorganosiloxanes at the same thermally conductive filler loading. Meanwhile, for thermally conductive silicone compositions with the same viscosity, the polyorganosiloxane used as the base polymer can accept a significantly higher level of the thermally conductive fillers, thereby improving their thermal conductivity.

Abstract: The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

Abstract: The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.

Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

Abstract: The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.

Abstract: The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

Abstract: Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si—O—Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si—O—Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si—O—Si linkages, wherein the linking portion is of a formula selected from the group consisting of: —[CH2]a— where a is an integer from 1 to 10 and —[CH2]bCONH[CH2]c— where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.

Abstract: A coated substrate includes a sapphire substrate and an anti-reflective coating comprising a silicon-based material, wherein the anti-reflective coating has refractive index of 1.23 to 1.45 and a Mohs hardness of at least 4. A method of coating a sapphire substrate with an anti-reflective coating includes applying a liquid formulation to a sapphire substrate to form a coated substrate, and curing the coated substrate at a temperature of at least 500° C. to form an anti-reflective layer on the sapphire substrate.

Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

Abstract: A coated substrate includes a sapphire substrate and an anti-reflective coating comprising a silicon-based material, wherein the anti-reflective coating has refractive index of 1.23 to 1.45 and a Mohs hardness of at least 4. A method of coating a sapphire substrate with an anti-reflective coating includes applying a liquid formulation to a sapphire substrate to form a coated substrate, and curing the coated substrate at a temperature of at least 500° C. to form an anti-reflective layer on the sapphire substrate.

Abstract: Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si—O—Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si—O—Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si—O—Si linkages, wherein the linking portion is of a formula selected from the group consisting of: —[CH2]a— where a is an integer from 1 to 10 and —[CH2]bCONH[CH2]c— where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.