Patents by Inventor Huihua Liu

Huihua Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12002206
    Abstract: A system and a method for automatically identifying mitosis in H&E stained breast cancer pathological images are provided, belonging to the technical field of digital image processing, and including an input image preprocessing module: cutting an original picture according to a predetermined patch size, and performing a data enhancement by means of picture flipping, rotation, and the like; and a segmentation module: training a segmentation network by cutting patches in a training set, cutting data of a test set according to a corresponding size and sending to the segmentation network to obtain a patch-level segmentation result, and then reconstructing a segmented result into an image belonging to an original size according to patch coordinate information intercepted in a preprocessing stage of it.
    Type: Grant
    Filed: June 9, 2023
    Date of Patent: June 4, 2024
    Assignee: GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY
    Inventors: Xipeng Pan, Xinjun Bian, Yinghua Lu, Zhenbing Liu, Zujun Qin, Rushi Lan, Huihua Yang, Huadeng Wang, Lingqiao Li, Zimin Wang, Jijun Cheng, Zhizhen Wang, Zhengyun Feng, Shilong Song
  • Publication number: 20150287891
    Abstract: Disclosed is an LED packaging structure using a distant fluorescent powder layer and a manufacturing method thereof. A fluorescent powder layer (10) with a recessed cavity cover structure is used in the packaging structure. A group of dies for manufacturing the fluorescent powder layer are specifically designed in the present invention. The fluorescent powder layer manufactured by using the dies has a regular structure and an even thickness. The fluorescent powder layer and a substrate (30) form a closed cavity for accommodating a chip (20) on the substrate, the cavity is vacuum, and the effect of distant fluorescent powder coating can be achieved. The manufacturing method can be also used for batch manufacturing of the fluorescent powder layers, and repeated adhesive dispensing for each chip in the traditional batch packaging process of the fluorescent powder layers is avoided, thereby improving the LED packaging efficiency.
    Type: Application
    Filed: November 25, 2013
    Publication date: October 8, 2015
    Applicant: HKUST LED-FPD TECHNOLOGY R&D CENTER AT FOSHAN
    Inventors: Huihua Liu, Chichuen Lo, Rong Zhang, Shiwei Lee