Patents by Inventor Huihui Hu

Huihui Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure, display substrate, display apparatus and method for packaging display device
    Patent number: 11917851
    Abstract: Provided is a packaging structure for packaging a display device, the packaging structure comprising: at least one composite film layer, wherein the composite film layer comprises an inorganic pattern and an organic pattern, the inorganic pattern comprises a plurality of curved structures arranged at intervals, the organic pattern comprises a first organic sub-pattern, and the first organic sub-pattern and the inorganic pattern are located in a same layer and are complementary in position; and wherein an orthographic projection of the composite film layer onto the display device at least covers a display area of the display device. A display substrate, a display apparatus, and a method for packaging a display device are also provided.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: February 27, 2024
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Youyuan Hu, Mengyu Luan, Xinfeng Wu, Bowen Liu, Xinzhu Wang, Fei Li, Huihui Li
  • Power over data line (PoDL) board design method to improve data channel performance
    Patent number: 11277581
    Abstract: Aspects of the disclosure provide for a system for a power over data line (PoDL) system. The system includes a ground plane that has a cutout. In addition, an alternating current (AC) capacitor pad configured to establish a bidirectional data channel. The AC capacitor pad is positioned in the cutout of the ground plane. Similarly, a PoDL pad connected to one or more inductors and a direct current (DC) power source is positioned in the cutout of the ground plane and is in series with the AC capacitor pad.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: March 15, 2022
    Assignee: Waymo LLC
    Inventors: Huihui Hu, Min Wang
  • POWER OVER DATA LINE (PODL) BOARD DESIGN METHOD TO IMPROVE DATA CHANNEL PERFORMANCE
    Publication number: 20200014875
    Abstract: Aspects of the disclosure provide for a system for a power over data line (PoDL) system. The system includes a ground plane that has a cutout. In addition, an alternating current (AC) capacitor pad configured to establish a bidirectional data channel. The AC capacitor pad is positioned in the cutout of the ground plane. Similarly, a PoDL pad connected to one or more inductors and a direct current (DC) power source is positioned in the cutout of the ground plane and is in series with the AC capacitor pad.
    Type: Application
    Filed: September 4, 2019
    Publication date: January 9, 2020
    Inventors: Huihui Hu, Min Wang
  • Power over data line (PODL) board design method to improve data channel performance
    Patent number: 10447959
    Abstract: Aspects of the disclosure provide for a system for a power over data line (PoDL) system. The system includes a ground plane that has a cutout. In addition, an alternating current (AC) capacitor pad configured to establish a bidirectional data channel. The AC capacitor pad is positioned in the cutout of the ground plane. Similarly, a PoDL pad connected to one or more inductors and a direct current (DC) power source is positioned in the cutout of the ground plane and is in series with the AC capacitor pad.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 15, 2019
    Assignee: Waymo LLC
    Inventors: Huihui Hu, Min Wang
  • POWER OVER DATA LINE (PODL) BOARD DESIGN METHOD TO IMPROVE DATA CHANNEL PERFORMANCE
    Publication number: 20190158773
    Abstract: Aspects of the disclosure provide for a system for a power over data line (PoDL) system. The system includes a ground plane that has a cutout. In addition, an alternating current (AC) capacitor pad configured to establish a bidirectional data channel. The AC capacitor pad is positioned in the cutout of the ground plane. Similarly, a PoDL pad connected to one or more inductors and a direct current (DC) power source is positioned in the cutout of the ground plane and is in series with the AC capacitor pad.
    Type: Application
    Filed: November 20, 2017
    Publication date: May 23, 2019
    Inventors: Huihui Hu, Min Wang