Patents by Inventor Huihui Yu

Huihui Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11652147
    Abstract: Disclosed is a metal-semiconductor contact structure based on two-dimensional (2D) semimetal electrodes, including a semiconductor module and a metal electrode module, where the semiconductor module is a 2D semiconductor material, and the metal electrode module is a 2D semimetal material with no dangling bonds on its surface; the 2D semiconductor material and the 2D semimetal material are interfaced with a Van der Waals interface with a surface roughness of 0.01-1 nanometer (nm) and no dangling bonds on the surface, the 2D semiconductor material and the 2D semimetal material are spaced less than 1 nm apart.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: May 16, 2023
    Assignee: UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING
    Inventors: Yue Zhang, Xiankun Zhang, Zheng Zhang, Huihui Yu, Mengting Huang, Wenhui Tang, Li Gao, Xiaofu Wei
  • Patent number: 10257961
    Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: April 9, 2019
    Assignee: Coriant Operations, Inc.
    Inventors: Zhen Lei, Qinzhen Ba, Zongxian Duan, HuiHui Yu
  • Patent number: 9976191
    Abstract: The present invention provides a rice whole genome breeding chip and the application thereof. The rice whole genome breeding chip of the present invention is Rice60K, an SNP chip manufactured based on Infinium technique. Each chip can detect 24 samples simultaneously and contains 58,290 SNP sites. The marker sites have DNA sequences represented by SEQ ID NO.1-58290. The chip can be used in molecular marker fingerprint analysis of the rice variety resources, in genotype identification of the hybrid progeny population, in identification of the variety authenticity, in analysis and screening of the genetic background of the breeding materials, and in association analysis of the agronomic traits, having wide application prospects.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: May 22, 2018
    Assignees: China National Seed Group Co., Ltd., Frontier Laboratories of Systems Crop Design Co., Ltd., Huazhong Agricultural University, Shenzhen Institute of Molecular Crop Design
    Inventors: Fasong Zhou, Haodong Chen, Weibo Xie, Hang He, Huihui Yu, Xiaoyan Tang, Jing Li, Junli Zhou, Yuqing He, Wei Chen, Qifa Zhang, Xingwang Deng
  • Publication number: 20170273217
    Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.
    Type: Application
    Filed: June 8, 2017
    Publication date: September 21, 2017
    Inventors: Zhen Lei, Qinzhen Ba, Zongxian Duan, HuiHui Yu
  • Patent number: 9681583
    Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: June 13, 2017
    Assignee: Coriant Operations Inc.
    Inventors: Zhen Lei, Qinzhen Ba, Zongxian Duan, Huihui Yu
  • Publication number: 20160153056
    Abstract: The present invention provides a rice whole genome breeding chip and the application thereof. The rice whole genome breeding chip of the present invention is Rice60K, an SNP chip manufactured based on Infinium technique. Each chip can detect 24 samples simultaneously and contains 58,290 SNP sites. The marker sites have DNA sequences represented by SEQ ID NO.1-58290. The chip can be used in molecular marker fingerprint analysis of the rice variety resources, in genotype identification of the hybrid progeny population, in identification of the variety authenticity, in analysis and screening of the genetic background of the breeding materials, and in association analysis of the agronomic traits, having wide application prospects.
    Type: Application
    Filed: February 7, 2013
    Publication date: June 2, 2016
    Applicants: CHINA NATIONAL SEED GROUP CO., LTD., HUAZHONG AGRICULTURAL UNIVERSITY, SHENZHEN INSTITUTE OF MOLECULAR CROP DESIGN, Frontier Laboratories of Systems Crop Design Co., Ltd.
    Inventors: Fasong ZHOU, Haodong CHEN, Weibo XIE, Hang HE, Huihui YU, Xiaoyan TANG, Jing LI, Junli ZHOU, Yuqing HE, Wei CHEN, Qifa ZHANG, Xingwang DENG
  • Publication number: 20160021787
    Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 21, 2016
    Inventors: Zhen Lei, Qinzhen Ba, Zongxian Duan, Huihui Yu