Abstract: Methods, systems, and devices for wireless communications are described. In some systems, devices use machine learning (ML) models to support wireless communications. For example, a user equipment (UE) may download ML model information from a network to determine an ML model. The network may additionally configure a status reporting procedure, a fallback procedure, or both for the ML model. In some examples, based on a configuration, the UE may transmit a status report to a base station according to a reporting periodicity, a UE-based trigger, a network-based trigger, or some combination thereof. Additionally or alternatively, the UE may determine to fallback from operating using the ML model to operating in a second mode based on a fallback trigger. In some examples, to restore operating using a downloaded ML model, the UE may download an updated ML model or receive iterative updates to a previously downloaded ML model.

Abstract: Disclosed are techniques for wireless positioning. In an aspect, a first network node receives, from a second network node, a positioning reference signal having a first reception time at the first network node, receives, from a first user equipment (UE), a first uplink positioning reference signal having a second reception time at the first network node, receives, from a second UE, a second uplink positioning reference signal having a third reception time at the first network node, and enables a first reference signal time difference (RSTD) measurement to be calculated for the first UE and a second RSTD measurement to be calculated for the second UE based on the first reception time, the second reception time, the third reception time, and other measurements.

Abstract: Certain aspects of the present disclosure provide techniques for remote interference mitigation between base stations using reference signals. Certain aspects provide a method for wireless communication by a first base station (BS). The method includes receiving a reference signal (RS) from a second BS. The method further includes performing interference measurement corresponding to interference from the second BS based on the RS being associated with the second BS.

Abstract: A determination of a position of a target mobile device in a wireless communication network employing time-division duplexing (TDD) can use a wireless reference signal from another mobile device with a known position. The other mobile device can be configured to transmit the wireless reference signal using cross-link interference (CLI), where the target mobile device receives the signal during a period in which the target mobile device is configured to receive downlink (DL) communication. The target mobile device then transmits another wireless reference signal, which is received by a base station, which also receives the wireless reference signal from the other mobile device. The timing of these various signals received at the target mobile device and base station can be used to determine the location of the mobile device.

Abstract: The disclosure discloses Oscillospiraceae sp. LBM10036 capable of utilizing multiple substrates and application thereof, and belongs to the fields of microbial technology and Baijiu brewing. The microorganism Oscillospiraceae sp. LBM10036 of the disclosure was preserved in the Guangdong Microbial Culture Collection Center on Sept. 21, 2020, with the preservation number GDMCC No. 61202. The Oscillospiraceae sp. LBM10036 of the disclosure has the capability to utilize diverse substrates and high product specificity, adapts to low pH, and can efficiently synthesize caproic acid under a pH of 5.0-5.5. The strain used in the disclosure can be used for strengthening microorganisms in pit mud, and improving the quality of degraded pit mud, to improve the quality of Strong aroma-type Baijiu, and also can be used for producing caproic acid from a variety of sugars and lactic acid by microbial fermentation.

Abstract: In some aspects, a base station may transmit, to a user equipment (UE), an instruction that triggers the UE to transmit an uplink random access channel (RACH) message, the instruction identifying a RACH preamble index corresponding to a RACH preamble to be used for the uplink RACH message; transmit, to a plurality of neighbor base stations, information that identifies the RACH preamble index; receive the uplink RACH message from the UE; receive, from the plurality of neighbor base stations, feedback that indicates respective timings with which the uplink RACH message was received by the plurality of neighbor base stations; and estimate a position of the UE based at least in part on a timing with which the uplink RACH message was received by the base station and at least two of the respective timings with which the uplink RACH message was received by the plurality of neighbor base stations.

Abstract: A user equipment (UE) may receive a resource configuration indicating cross link interference (CLI) measurement resources, measure receive strength signal indicator (RSSI) values on the CLI measurement resources, respectively, and determine whether one or more RSSI values of the multiple of RSSI values exceed an RSSI threshold, the one or more RSSI values being respectively associated with one or more CLI measurement resources of the CLI measurement resources. The UE may measure at least one reference signal received power (RSRP) value respectively on at least one CLI measurement resource of the one or more CLI measurement resources in response to determining that the one or more RSSI values exceed the RSSI threshold. The UE may transmit an RSRP measurement report, the RSRP measurement report including the at least one RSRP value and at least one resource index respectively indicating the at least one CLI measurement resource.

Abstract: The described techniques relate to improved methods, systems, devices, and apparatuses that support interference mitigation for remote devices. A first wireless device (e.g., a base station) may detect remote interference with its communications caused by a second wireless device (e. g., a second, remote base station) based on, for example, a measured interference over thermal noise level exceeding a threshold. The first wireless device may identify a set of time-frequency resources for remote interference reference signals and a data transmission for a user equipment (UE) that is in communication with the first wireless device. The first wireless device may transmit a remote interference signal to a second wireless device (e. g., a second base station) via the set of time-frequency resources. The first wireless device may further signal a resource allocation to the UE for the UE to use for transmitting uplink transmissions to the first wireless device.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a base station may detect interference, in a remote interference management (RIM) scenario, in a set of sub-bands of a plurality of sub-bands of a bandwidth portion. The base station may transmit, to identify the set of sub-bands in which interference is detected, a set of reference signals configured to indicate the set of sub-bands in which the interference is detected. Numerous other aspects are provided.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers; and at least one via configured for solder attachment to a connector lead of a surface mount connector, the at least one via including a conductive element that extends from an upper surface of the printed circuit board through one or more of the plurality of layers, the conductive element having a recess in a surface thereof. The recess is configured to receive a tip portion of the connector lead of the surface mount connector. The printed circuit board may have via patterns including signal vias and ground vias.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.

Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.