Patents by Inventor Hui-Mei Yu

Hui-Mei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating pad redistribution layer
    Patent number: 7122458
    Abstract: A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. A patterned mask layer is then formed over the seed layer to expose a portion thereof over the bonding pad, and a metal layer is then formed thereon. A sacrificial layer is then formed over the substrate and the sacrificial layer over the patterned mask layer is removed. The conductive film exposed by the metal layer and the remaining sacrificial layer is then removed, leaving a pad redistribution layer for the bonding pad.
    Type: Grant
    Filed: July 22, 2004
    Date of Patent: October 17, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Jen Cheng, Hui-Mei Yu, Li-Hsin Tseng, Tzu-Han Lin, Ching-Chiang Wu, Chun-Yen Lo, Li-Chuan Huang, Boe Su
  • Method for fabricating pad redistribution layer
    Publication number: 20060019480
    Abstract: A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. A patterned mask layer is then formed over the seed layer to expose a portion thereof over the bonding pad, and a metal layer is then formed thereon. A sacrificial layer is then formed over the substrate and the sacrificial layer over the patterned mask layer is removed. The conductive film exposed by the metal layer and the remaining sacrificial layer is then removed, leaving a pad redistribution layer for the bonding pad.
    Type: Application
    Filed: July 22, 2004
    Publication date: January 26, 2006
    Inventors: Chia-Jen Cheng, Hui-Mei Yu, Li-Hsin Tseng, Tzu-Han Lin, Ching-Chiang Wu, Chun-Yen Lo, Li-Chuan Huang, Boe Su