Patents by Inventor Hui-Ming Chen
Hui-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240152187Abstract: A foldable electronic device including a first body, a second body, a hinge module, and a cover is provided. The hinge module is connected to the first body and the second body, such that the first body and the second body are rotated relatively to be folded or unfolded via the hinge module. The hinge module has a protruding rod eccentric to a rotation center of the hinge module. The cover is pivoted to the second body and located on a moving path of the protruding rod. The hinge module drives the cover to be rotated relative to the second body via the protruding rod.Type: ApplicationFiled: October 24, 2023Publication date: May 9, 2024Applicant: Acer IncorporatedInventors: Chun-Hung Wen, Chun-Hsien Chen, Hui-Ping Sun, Wen-Neng Liao, Yu-Ming Lin, Kuan-Lin Chen
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Publication number: 20240098932Abstract: A foldable electronic device, including a first body, a second body, an air valve movably disposed in the first body, at least one triggering member, and a hinge connecting the first body and the second body, is provided. The first body has multiple openings respectively located at two opposite surfaces. The triggering member is movably disposed in the first body and has a part exposed outside the first body. The air valve and the triggering member are mutually on moving paths of each other. The first body and the second body are rotated to be folded or unfolded relative to each other by the hinge. A part of the triggering member is suitable for bearing a force such that the triggering member drives the air valve, so that the air valve opens or closes the openings.Type: ApplicationFiled: July 19, 2023Publication date: March 21, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Yu-Ming Lin, Chun-Hsien Chen
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Patent number: 11923405Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.Type: GrantFiled: May 23, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen
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Patent number: 11916077Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.Type: GrantFiled: May 24, 2021Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
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Patent number: 10855162Abstract: The present invention provides a secondary side of a linear motor, which mainly includes a base, a combining mechanism and multiple magnetic members, wherein the base has multiple plates that are sequentially stacked into a block; the combining mechanism is configured to combine the plate-shaped bodies; and the magnetic members are disposed on the base in a separated manner.Type: GrantFiled: November 30, 2016Date of Patent: December 1, 2020Assignee: HIWIN MIKROSYSTEM CORP.Inventors: Cheng-Te Chi, Chao-Chin Teng, Hui-Ming Chen
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Publication number: 20200071398Abstract: Antibodies and antibody fragments that specifically bind to LILRB3 are disclosed. Also provided herein are compositions comprising antibodies and antibody fragments that specifically bind to LILRB3 and methods of use thereof.Type: ApplicationFiled: December 22, 2017Publication date: March 5, 2020Inventors: Shu-Hsia Chen, Ping-Ying Pan, Hui-ming Chen, William van der Touw
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Publication number: 20200036275Abstract: A linear motor includes a magnet seat, a magnet unit, a coil seat and a coil unit. The magnet unit is disposed on the magnet seat, and includes a plurality of magnet sets each including two magnets. The coil unit is disposed on the coil seat, and includes a plurality of coil sets each including two coils. The magnets of each of the magnet sets are aligned with each other in a direction different from that in which the coils of each of the coil sets are aligned.Type: ApplicationFiled: July 27, 2018Publication date: January 30, 2020Applicant: HIWIN MIKROSYSTEM CORP.Inventors: Hui-Ming CHEN, Sheng-Yu TSENG, Cheng-Te CHI, Chao-Chin TENG
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Publication number: 20180152092Abstract: The present invention provides a secondary side of a linear motor, which mainly includes a base, a combining mechanism and multiple magnetic members, wherein the base has multiple plates that are sequentially stacked into a block; the combining mechanism is configured to combine the plate-shaped bodies; and the magnetic members are disposed on the base in a separated manner.Type: ApplicationFiled: November 30, 2016Publication date: May 31, 2018Inventors: Cheng-Te Chi, Chao-Chin TENG, Hui-Ming CHEN
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Publication number: 20070025416Abstract: A clinical thermometer is disclosed. The thermometer comprises a housing, circuit board, base seat, humming plate and spring characterized in that the base seat has a speaker box slot and a speaker cover plate with the humming plate mounted therein, circuit connection is formed between the humming plate and the circuit board by the spring, and the length of the base seat is shorter than the circuit board such that the electronic components which are required to be inspected are exposed outside the base seat, thereby minimizing the inspection time and replacement time of the components.Type: ApplicationFiled: July 27, 2005Publication date: February 1, 2007Inventor: Hui-Ming Chen
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Patent number: 6136515Abstract: A method for removing photoresist in a metallization process according to the invention is able to completely remove a photoresist residue remaining on the surface of a metal layer and avoids corrosion of the metal layer. In the method, a heat treatment is performed after patterning the metal layer and before removing the photoresist layer, thereby removing materials which corrode the metal layer. Therefore, corrosion to the metal layer is prevented. Next, the photoresist layer is removed by a wet strip process instead of an oxygen plasma process. As a result, the photoresist residue remaining on the surface of the metal layer cannot be oxidized into an insoluble oxide and can be completely removed.Type: GrantFiled: August 19, 1998Date of Patent: October 24, 2000Assignee: United Integrated Circuits Corp.Inventor: Hui-Ming Chen
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Patent number: 6074090Abstract: An electronic clinical thermometer including a thermistor, a probing bar, a main body, an electronic device, a display, an inner shell and a buzzing device. The probing bar is highly flexible to minimize discomfort or irritation arising from the measurement of the body temperature of a person. The electronic device can be easily joined with the inner shell such that the electronic device is held securely by the retainers of the inner shell.Type: GrantFiled: June 2, 1998Date of Patent: June 13, 2000Inventor: Hui-Ming Chen