Patents by Inventor Huining WANG
Huining WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12255269Abstract: A light-emitting device includes a light-emitting laminated structure, a first electrode, and a second electrode. The first electrode has a reflection layer, an intermediate layer, and an electrically conductive layer. The intermediate layer includes a barrier layer having a first repeating paired layer unit and a second repeating paired layer unit, each of which has a platinum layer. The first repeating paired layer unit is closer to the electrically conductive layer than the second repeating paired layer unit, and a thickness of the platinum layer of the first repeating paired layer unit is greater than a thickness of the platinum layer of the second repeating paired layer unit.Type: GrantFiled: July 18, 2022Date of Patent: March 18, 2025Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.Inventors: Huining Wang, Hongwei Xia, Quanyang Ma, Jiali Zhuo, Weibin Shi, Su-Hui Lin, Renlong Yang, Chung-Ying Chang
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Publication number: 20230343903Abstract: A face-up light-emitting device includes a substrate, a semiconductor stacked structure, and a first insulating stacked structure. The substrate has a first surface and a second surface opposite to the first surface. The semiconductor stacked structure is disposed on the first surface and is capable of emitting light. The first insulating stacked structure is disposed on the semiconductor stacked structure and includes first material layers each of which has a refractive index, and second material layers each of which has a refractive index higher than that of each of the first material layers. The first insulating stacked structure has a geometric thickness ranging from 500 nm to 1000 nm. The first material layers and the second material layers are stacked alternately. A display device including the face-up light-emitting device is also disclosed.Type: ApplicationFiled: April 12, 2023Publication date: October 26, 2023Inventors: Qing WANG, Huining WANG, Hongwei XIA, Peng LIU, Chao LU, Ling-Yuan HONG, Chung-Ying CHANG
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Publication number: 20230231075Abstract: A light-emitting device includes an epitaxial structure that includes a first semiconductor layer, an active layer and a second semiconductor layer. The light-emitting device further has a transparent current spreading unit, a first electrode and a second electrode. The transparent current spreading unit includes a first transparent current spreading layer and a second transparent current spreading layer. The first transparent current spreading layer is doped with aluminum and has a thickness that accounts for 0.5% to 33% of a thickness of the transparent current spreading unit. The second transparent current spreading layer has a thickness greater than that of the first transparent current spreading layer. A light-emitting apparatus includes a circuit control component, and a light source that is coupled to the circuit control component and that includes the aforesaid light-emitting device.Type: ApplicationFiled: November 22, 2022Publication date: July 20, 2023Inventors: Huining Wang, Hongwei Xia, Quanyang Ma, Shiwei Liu, Jiali Zhuo, Shuo Yang, Su-Hui Lin, Chung-Ying Chang
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Publication number: 20230132270Abstract: An LED device includes an epitaxial layered structure that includes a first semiconductor layer, a light emitting layer and a second semiconductor layer, first and second electrodes that are disposed on the epitaxial layered structure, and an insulating structure. The first electrode includes a first body portion and a first extending portion connected together. The first extending portion includes a first part and multiple second parts. A projection of the first part on the first semiconductor layer does not overlap a projection of the insulating structure on the first semiconductor layer. The first part has a first sub-part and multiple second sub-parts. A projection of the first sub-part on the first semiconductor layer has a first length, and a projection of each of the second sub-parts on the first semiconductor layer independently has a second length measured in the same direction. The first length is greater than the second length.Type: ApplicationFiled: October 24, 2022Publication date: April 27, 2023Inventors: Huining WANG, Linhua CAO, Hongwei XIA, Chunlan HE, Lili JIANG, Su-Hui LIN, Renlong YANG, Chung-Ying CHANG
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Publication number: 20230026786Abstract: A light-emitting device includes a light-emitting laminated structure, a first electrode, and a second electrode. The first electrode has a reflection layer, an intermediate layer, and an electrically conductive layer. The intermediate layer includes a barrier layer having a first repeating paired layer unit and a second repeating paired layer unit, each of which has a platinum layer. The first repeating paired layer unit is closer to the electrically conductive layer than the second repeating paired layer unit, and a thickness of the platinum layer of the first repeating paired layer unit is greater than a thickness of the platinum layer of the second repeating paired layer unit.Type: ApplicationFiled: July 18, 2022Publication date: January 26, 2023Inventors: Huining WANG, Hongwei XIA, Quanyang MA, Jiali ZHUO, Weibin SHI, Su-Hui LIN, Renlong YANG, Chung-Ying CHANG
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Publication number: 20220059610Abstract: A light-emitting diode (LED) device includes multiple LED chips, a first protecting layer, and first and second electrical connection structures. The LED chips are separated from each other by a trench. Each LED chip is formed in a mesa structure, and includes first and second semiconductor layers and an active layer sandwiched therebetween. The first protecting layer covers a trench-defining wall of the trench, and the mesa structure of each LED chip. The first and second electrical connection structures penetrate through the first protecting layer to electrically and respectively connect in parallel with the first and second semiconductor layer of each LED chip.Type: ApplicationFiled: August 13, 2021Publication date: February 24, 2022Inventors: Su-Hui LIN, Huining WANG, Anhe HE, Kang-Wei PENG, Yu-Chieh HUANG
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Publication number: 20200220048Abstract: An electrically conductive layered structure includes a lower transparent conductive layer having a bottom surface, an upper transparent conductive layer formed on the lower transparent conductive layer opposite to the bottom surface, and at least one hole extending from the top surface to the bottom surface. The at least one hole has a first diameter at a first side adjacent to the top surface and a second diameter at a second side opposite to the first side. The first diameter is smaller than the second diameter. A light-emitting diode device including the electrically conductive layered structure and a method for manufacturing the electrically conductive layered structure are also disclosed.Type: ApplicationFiled: March 16, 2020Publication date: July 9, 2020Inventors: Huining WANG, Sheng-Hsien HSU, Ling-yuan HONG, Kang-Wei PENG, Su-hui LIN, Chen-ke HSU
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Patent number: 10205061Abstract: A light-emitting diode includes from bottom to up: a substrate; a light-emitting epitaxial layer laminated by semiconductor material layers over the substrate; a current spreading layer doped with conductive metal nanomaterial groups over the light-emitting epitaxial layer; and metal nanomaterial groups with high visible light transmittance over the current spreading layer. The conductive metal nanomaterial groups dispersed inside the ITO current spreading layer can reduce horizontal resistance of the current spreading layer and improve horizontal spreading uniformity of current; and metal nanomaterial groups with high visible light transmittance are distributed over the upper surface of the current expansion layer for roughening and increasing light extract efficiency.Type: GrantFiled: November 19, 2017Date of Patent: February 12, 2019Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Huining Wang, Sheng-hsien Hsu, Kang-wei Peng, Su-hui Lin, Chen-ke Hsu
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Publication number: 20180102461Abstract: A light-emitting diode includes from bottom to up: a substrate; a light-emitting epitaxial layer laminated by semiconductor material layers over the substrate; a current spreading layer doped with conductive metal nanomaterial groups over the light-emitting epitaxial layer; and metal nanomaterial groups with high visible light transmittance over the current spreading layer. The conductive metal nanomaterial groups dispersed inside the ITO current spreading layer can reduce horizontal resistance of the current spreading layer and improve horizontal spreading uniformity of current; and metal nanomaterial groups with high visible light transmittance are distributed over the upper surface of the current expansion layer for roughening and increasing light extract efficiency.Type: ApplicationFiled: November 19, 2017Publication date: April 12, 2018Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventors: Huining WANG, Sheng-hsien HSU, Kang-wei PENG, Su-hui LIN, Chen-ke HSU