Patents by Inventor Huiping BAO

Huiping BAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Super-junction schottky diode
    Patent number: 9929285
    Abstract: The present invention relates to the field of semiconductor technology, particularly to a super-junction schottky diode. According to the present invention, the effective area of schottky junction is increased by forming the schottky junction in the trench located in the body of the device. Therefore, the current capacity of this novel schottky diode can be greatly improved. In addition, a super-junction structure is used to improve the device's reverse breakdown voltage and reduce the reverse leakage current. The super-junction schottky diode provided in the present invention can achieve a larger forward current, a lower on-resistance and a better reverse breakdown characteristic.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: March 27, 2018
    Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Min Ren, Yuci Lin, Huiping Bao, Lei Luo, Zehong Li, Bo Zhang
  • SUPER-JUNCTION SCHOTTKY DIODE
    Publication number: 20180026143
    Abstract: The present invention relates to the field of semiconductor technology, particularly to a super-junction schottky diode. According to the present invention, the effective area of schottky junction is increased by forming the schottky junction in the trench located in the body of the device. Therefore, the current capacity of this novel schottky diode can be greatly improved. In addition, a super-junction structure is used to improve the device's reverse breakdown voltage and reduce the reverse leakage current. The super-junction schottky diode provided in the present invention can achieve a larger forward current, a lower on-resistance and a better reverse breakdown characteristic.
    Type: Application
    Filed: May 23, 2017
    Publication date: January 25, 2018
    Applicant: University of Electronic Science and Technology of China
    Inventors: Min REN, Yuci LIN, Huiping BAO, Lei LUO, Zehong LI, Bo ZHANG