Patents by Inventor Huiqin Guo

Huiqin Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926675
    Abstract: Disclosed is an antibody that specifically binds CD24, or an antigen binding portion thereof. A nucleic acid molecule encoding the antibody or antigen binding portion thereof, an expression vector and a host cell comprising the nucleic acid molecule, a method for expressing the antibody or antigen binding portion thereof, and a method for treating a disease associated with CD24 signaling using the antibody or antigen binding portion thereof are also provided.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: March 12, 2024
    Assignee: IMMUNEONCO BIOPHARMACEUTICALS (SHANGHAI) INC.
    Inventors: Wenzhi Tian, Song Li, Dianze Chen, Huiqin Guo
  • Publication number: 20230110607
    Abstract: Disclosed is an antibody that specifically binds CD24, or an antigen binding portion thereof. A nucleic acid molecule encoding the antibody or antigen binding portion thereof, an expression vector and a host cell comprising the nucleic acid molecule, a method for expressing the antibody or antigen binding portion thereof, and a method for treating a disease associated with CD24 signaling using the antibody or antigen binding portion thereof are also provided.
    Type: Application
    Filed: March 3, 2022
    Publication date: April 13, 2023
    Inventors: Wenzhi TIAN, Song LI, Dianze CHEN, Huiqin GUO
  • Publication number: 20230112123
    Abstract: Disclosed is an antibody that specifically binds CD70, or an antigen binding portion thereof. A nucleic acid molecule encoding the antibody or antigen binding portion thereof, an expression vector and a host cell comprising the nucleic acid molecule, a method for expressing the antibody or antigen binding portion thereof, and a method for treating a disease associated with CD70 signaling using the antibody or antigen binding portion thereof are also provided.
    Type: Application
    Filed: March 3, 2022
    Publication date: April 13, 2023
    Inventors: Wenzhi TIAN, Song LI, Dianze CHEN, Huiqin GUO
  • Patent number: 11613584
    Abstract: Disclosed is an antibody that specifically binds CD70, or an antigen binding portion thereof. A nucleic acid molecule encoding the antibody or antigen binding portion thereof, an expression vector and a host cell comprising the nucleic acid molecule, a method for expressing the antibody or antigen binding portion thereof, and a method for treating a disease associated with CD70 signaling using the antibody or antigen binding portion thereof are also provided.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: March 28, 2023
    Assignee: IMMUNEONCO BIOPHARMACEUTICALS (SHANGHAI) INC.
    Inventors: Wenzhi Tian, Song Li, Dianze Chen, Huiqin Guo