Patents by Inventor Huiting Chai

Huiting Chai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10444160
    Abstract: A defects evaluation system and method are provided in the present invention. Based on the principle of the microscopic scattering dark-field imaging, the present invention implements a sub-aperture scanning for the surface of spherical optical components and then obtains surface defects information with image processing. Firstly, the present invention takes full advantage of the characteristic that the surface defects of spherical optical components can generate scattering light when an annular illumination beam irradiates on the surface, to implement the sub-aperture scanning and imaging that covers the entire spherical surface. Then, a series of procedures such as the global correction of sub-apertures, the 3D stitching, the 2D projection and the digital feature extraction are taken to inspect spherical surface defects. Finally, actual size and position information of defects are evaluated quantitatively with the defects calibration data.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: October 15, 2019
    Assignee: ZHEJIANG UNIVERSITY
    Inventors: Yongying Yang, Dong Liu, Yang Li, Huiting Chai, Pin Cao, Fan Wu
  • Publication number: 20170292916
    Abstract: A defects evaluation system and method are provided in the present invention. Based on the principle of the microscopic scattering dark-field imaging, the present invention implements a sub-aperture scanning for the surface of spherical optical components and then obtains surface defects information with image processing. Firstly, the present invention takes full advantage of the characteristic that the surface defects of spherical optical components can generate scattering light when an annular illumination beam irradiates on the surface, to implement the sub-aperture scanning and imaging that covers the entire spherical surface. Then, a series of procedures such as the global correction of sub-apertures, the 3D stitching, the 2D projection and the digital feature extraction are taken to inspect spherical surface defects. Finally, actual size and position information of defects are evaluated quantitatively with the defects calibration data.
    Type: Application
    Filed: September 9, 2015
    Publication date: October 12, 2017
    Inventors: Yongying Yang, Dong Liu, Yang Li, Huiting Chai, Pin Cao, Fan Wu