Patents by Inventor Hui-Wen WU

Hui-Wen WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163947
    Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 16, 2024
    Inventors: Cheng-Ying WU, Wei-Wen LIN, Shu-Min CHENG, Hui-Ping TSENG, Chi-Han HUANG, Chih-Chun KUO, Yang-Hung PENG, Hao-Hua KANG
  • Patent number: 11942420
    Abstract: A semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure, disposed above the first gate structure, that extends along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure, disposed between the first gate structure and the first interconnect structure, that electrically couples the first gate structure to the first portion of the first interconnect structure. The second interconnect structure includes a recessed portion that is substantially aligned with the first gate structure and the dielectric structure along a vertical direction.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Hui-Zhong Zhuang, Chih-Liang Chen, Cheng-Chi Chuang, Shang-Wen Chang, Yi-Hsun Chiu
  • Patent number: 9450336
    Abstract: A combination includes an electronic device and an electrical connector. The electronic device includes a device housing with a mating area, and a device terminal set formed in the mating area. The electrical connector includes a connector casing with a mating region, a connector terminal set to mate with the device terminal set, and an auxiliary unit with an abutment part covering a part of the mating region of the connector casing. When the mating region of the electrical connector mates with the mating area of the electronic device, the abutment part of the auxiliary unit abuts against the device housing such that the electrical connector is stabilized and prevented from moving relative to the electronic device.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: September 20, 2016
    Assignee: Wistron Crop.
    Inventor: Hui-Wen Wu
  • Publication number: 20160064861
    Abstract: A combination includes an electronic device and an electrical connector. The electronic device includes a device housing with a mating area, and a device terminal set formed in the mating area. The electrical connector includes a connector casing with a mating region, a connector terminal set to mate with the device terminal set, and an auxiliary unit with an abutment part covering a part of the mating region of the connector casing. When the mating region of the electrical connector mates with the mating area of the electronic device, the abutment part of the auxiliary unit abuts against the device housing such that the electrical connector is stabilized and prevented from moving relative to the electronic device.
    Type: Application
    Filed: July 6, 2015
    Publication date: March 3, 2016
    Inventor: Hui-Wen WU