Patents by Inventor Huiwu Chen

Huiwu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10914428
    Abstract: A LED light apparatus includes a substrate, LED modules, a driver circuit, a fluorescent layer, a connector and a light passing shell. The LED modules are mounted on the substrate. The fluorescent layer covers the driver circuit and the LED modules. The connector has a first end electrically connecting to the driver circuit. The light passing shell encapsulates the substrate, the plurality of first LED modules, the driver circuit, the first fluorescent layer and at least a part of the connector. The connector has a second end connecting to an external power source.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: February 9, 2021
    Assignee: XIAMEN ECO LIGHTING CO. LTD.
    Inventors: Qiyuan Wang, Liangliang Cao, Hongkui Jiang, Huiwu Chen, Wei Liu, Feihua He, Yanzeng Gao
  • Publication number: 20200332962
    Abstract: A lighting apparatus includes a first flexible filament with a first elongated flexible substrate. The first elongated flexible substrate is mounted with a first set of LED modules. The first set of LED modules includes LED modules of multiple colors. The second flexible filament with a second elongated flexible substrate. The second elongated flexible substrate is mounted with a second set of LED modules. The second set of LED modules include LED modules of multiple color temperatures.
    Type: Application
    Filed: April 13, 2020
    Publication date: October 22, 2020
    Inventors: Yanbiao Chen, Hongkui Jiang, Huiwu Chen
  • Publication number: 20200212014
    Abstract: An LED filament assembly includes a frame, a first electrode disposed on a first end of the frame, and a second electrode disposed on a second end of the frame. The LED filament assembly includes a first group of LED chips capable of emitting a first color, a second group of LED chips capable of emitting a second color, and a third group of LED chips capable of emitting a third color. The first group of LED chips is disposed on the frame along a longitudinal axis, connected in series, and electrically connected to the first electrode and the second electrode. Similarly, the second and the third group of LED chips are also disposed on the frame along the longitudinal axis, connected in series, and electrically connected to the first electrode and the second electrode. A lamp including such an LED filament assembly is also disclosed.
    Type: Application
    Filed: December 18, 2019
    Publication date: July 2, 2020
    Inventors: Yanbiao CHEN, Qiyuan WANG, Huiwu CHEN, Hongkui JIANG, Liangliang CAO, Yongshu ZHENG
  • Publication number: 20200166204
    Abstract: A light bulb apparatus has a bulb shell, LED modules, a light source plate, an inner tube and an outer cup. The light source plate has a substrate plate. The substrate plate and the inner tube are made of heat dissipation material like metal material. There is a pressing portion of a lateral side of the substrate plate pressing against an inner side of the inner tube part and there is a spacing portion of the lateral side of the substrate plate not engaging the inner side of the inner tube. The outer cup part has top part and a bottom part. The inner cup is placed inside the top part of the outer cup and pressing against the outer cup.
    Type: Application
    Filed: November 29, 2019
    Publication date: May 28, 2020
    Inventors: Maojin Zeng, Qiyuan Wang, Liangliang Cao, Yongjun Bao, Wenchang Huang, Liping Lin, Yunnan Lin, Bin Liu, Huiwu Chen, Liu, Wei Liu, Wei
  • Publication number: 20200161511
    Abstract: A LED light tube includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Application
    Filed: January 22, 2020
    Publication date: May 21, 2020
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Publication number: 20200149688
    Abstract: A LED bulb apparatus includes a main body, a light source, two end covers, and two connectors. The main body is a hollow structure. The light source module is disposed inside the main body. The light source module has a base plate, a driver and a light source. The driver and the light source being are mounted on the base plate. The two end covers are fixed on two ends of the main body for closing the hollow structure for forming a closed container for storing the light source module and a heat dissipation gas.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 14, 2020
    Inventors: Qiyuan Wang, Liangliang Cao, Hongkui Jiang, Wei Liu, Huiwu Chen, Feihua He
  • Patent number: 10609779
    Abstract: An LED circuit with color temperature adjustment comprises a first LED string, a resistor, and a second LED string. The first LED string has a first color temperature. The resistor is connected in series with the first string. The second LED string has a second color temperature. The first LED string is connected in parallel with the second LED string. The second color temperature is higher than the first color temperature. The integrated color temperature of the first LED string and the second LED string increases when the total current of the first LED string and the second LED string increases. The present disclosure not only can provide an LED circuit with color temperature adjustment, but also can provide an LED circuit which can adjust the color temperature by the combinations of the LED strings connected in parallel or series.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: March 31, 2020
    Assignee: XIAMEN ECO LIGHTING CO. LTD.
    Inventors: Qiyuan Wang, Wenchang Huang, Guangai Chen, Huiwu Chen
  • Patent number: 10580945
    Abstract: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 3, 2020
    Assignee: LEEDARSON LIGHTING CO. LTD.
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Publication number: 20200002606
    Abstract: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Application
    Filed: September 13, 2019
    Publication date: January 2, 2020
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Patent number: 10450504
    Abstract: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: October 22, 2019
    Assignee: LEEDARSON LIGHTING CO. LTD.
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Publication number: 20190257478
    Abstract: A LED light apparatus includes a substrate, LED modules, a driver circuit, a fluorescent layer, a connector and a light passing shell. The LED modules are mounted on the substrate. The fluorescent layer covers the driver circuit and the LED modules. The connector has a first end electrically connecting to the driver circuit. The light passing shell encapsulates the substrate, the plurality of first LED modules, the driver circuit, the first fluorescent layer and at least a part of the connector. The connector has a second end connecting to an external power source.
    Type: Application
    Filed: September 10, 2018
    Publication date: August 22, 2019
    Inventors: Qiyuan Wang, Liangliang Cao, Hongkui Jiang, Huiwu Chen, Wei Liu, Feihua He, Yanzeng Gao
  • Publication number: 20190218454
    Abstract: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Application
    Filed: February 19, 2019
    Publication date: July 18, 2019
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Publication number: 20190221726
    Abstract: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Application
    Filed: February 26, 2019
    Publication date: July 18, 2019
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Publication number: 20190221723
    Abstract: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Application
    Filed: August 6, 2018
    Publication date: July 18, 2019
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Publication number: 20190221725
    Abstract: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Application
    Filed: February 4, 2019
    Publication date: July 18, 2019
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Publication number: 20190198739
    Abstract: An LED chip module includes a first electrode plate and a second electrode plate. A first set of LED chip and a second set of LED chip are respectively set on the first electrode plate and the second electrode plate. The second set of LED chip is electrically connected to the first set of LED chip. A plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding to make the first electrode plate and the second electrode plate keep a predetermined space between each other and make a lower surface of the first electrode plate and a lower surface of the second electrode plate be respectively connected to two different polarity terminals of the power supply to drive the first set of LED chip and the second set of LED chip to emit light.
    Type: Application
    Filed: March 4, 2019
    Publication date: June 27, 2019
    Inventors: Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Publication number: 20190139948
    Abstract: A LED lighting apparatus includes a driver, a substrate, LED chips, a first fluorescent layer and a second fluorescent layer. The driver converts an external power source to a driving current. The substrate is mounted with two electrodes electrically connected to the driver for getting the driving current. The plurality of LED chips are mounted on a first side of the substrate. The first fluorescent layer is disposed on the first side of the substrate covering the plurality of LED chips. The second fluorescent layer is disposed on a second side of the substrate. A part of a light emitted from the plurality of LED chips passing through the first fluorescent layer and then exciting the second fluorescent layer to emit a second light.
    Type: Application
    Filed: May 29, 2018
    Publication date: May 9, 2019
    Inventors: Yanzeng Gao, Hongkui Jiang, Yanbiao Chen, Huiwu Chen, Liangliang Cao
  • Publication number: 20190132925
    Abstract: An LED circuit with color temperature adjustment comprises a first LED string, a resistor, and a second LED string. The first LED string has a first color temperature. The resistor is connected in series with the first string. The second LED string has a second color temperature. The first LED string is connected in parallel with the second LED string. The second color temperature is higher than the first color temperature. The integrated color temperature of the first LED string and the second LED string increases when the total current of the first LED string and the second LED string increases. The present disclosure not only can provide an LED circuit with color temperature adjustment, but also can provide an LED circuit which can adjust the color temperature by the combinations of the LED strings connected in parallel or series.
    Type: Application
    Filed: December 27, 2018
    Publication date: May 2, 2019
    Inventors: Qiyuan Wang, Wenchang Huang, Guangai Chen, Huiwu Chen
  • Patent number: 10270022
    Abstract: An LED chip module includes a first electrode plate and a second electrode plate. A first set of LED chip and a second set of LED chip are respectively set on the first electrode plate and the second electrode plate. The second set of LED chip is electrically connected to the first set of LED chip. A plastic shell is fixedly connected to the first electrode plate and the second electrode plate by injection molding to make the first electrode plate and the second electrode plate keep a predetermined space between each other and make a lower surface of the first electrode plate and a lower surface of the second electrode plate be respectively connected to two different polarity terminals of the power supply to drive the first set of LED chip and the second set of LED chip to emit light.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: April 23, 2019
    Assignee: XIAMEN ECO LIGHTING CO. LTD.
    Inventors: Liangliang Cao, Huiwu Chen, Qiyuan Wang
  • Patent number: 10256376
    Abstract: A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: April 9, 2019
    Assignee: LEEDARSON LIGHTING CO. LTD.
    Inventors: Yanbiao Chen, Liangliang Cao, Huiwu Chen, Qiyuan Wang