Abstract: A battery pack assembly configured to be coupled to a battery housing for an electrified vehicle includes a battery case and an air column assembly. The battery case has a bottom surface, a forward wall, a rearward wall, a first sidewall and a second sidewall. The air column assembly is supported within the battery case and includes a first, second and third plurality of air columns. The first plurality of air columns are positioned along the bottom surface of the battery case. The second plurality of air columns are positioned outboard of the first plurality of air columns. The third plurality of air columns are positioned outboard of the second plurality of air columns and engage the forward wall, rearward wall, first sidewall and second sidewall of the battery case in an installed position. The battery case assembly mitigates impact damage to the battery housing in the installed position.

Abstract: Systems and methods for an adapter for a high voltage (HV) battery system of an electrified vehicle (EV) involve an adapter housing configured to physically interface between (i) a battery module-side low voltage (LV) connector and (ii) a cell monitoring circuit (CMC) harness-side LV connector and a plurality of connector pins disposed within the adapter housing and being configured to, at their first ends, electrically connect to the module-side LV connector, at their opposing second ends, electrically connect to the harness-side LV connector, and act as a fuse such that at least one of the plurality of connector pins breaks an electrical connection therethrough in response to a current spike. In response to a blown fuse malfunction, the adapter could be replaced by a new adapter having a new adapter housing with a new plurality of connector pins disposed therein.

Abstract: A high voltage interlock bypass connector for use with a female high voltage connector having an interlock is provided and includes a metal connector pin having a substantially U-shape with a connected end and a pair of terminal ends; and a handle formed around and enclosing the connected end of the connector pin opposite the terminal ends such that the terminal ends extend beyond the handle. The handle is configured to provide insulation from a voltage carried by the metal pin and is transparent such that the connected end of the metal pin enclosed by the handle is visible within the handle. The interlock bypass connector is configured to be inserted into the interlock to complete a high voltage interlock circuit without having to connect a corresponding male high voltage connector having integrated interlock pins.

Abstract: Disclosed is a cross flow heat transfer apparatus for combined arrangement with an electronic display and integrated circuit chamber. The cross flow heat transfer apparatus comprising external heatsink configured to be arranged between electronic display and integrated circuit chamber, wherein external heatsink, with plurality of vertically-oriented fins, is configured to mediate cross flow heat transfer mechanism between electronic display and integrated circuit chamber. The cross flow heat transfer mechanism has internal flow driven by set of internal fans associated with internal heatsink coupled with integrated circuit chamber, wherein internal flow is directed transversally towards electronic display from the integrated circuit chamber, and external flow driven by plurality of vertically-oriented fins of external heatsink based on temperature gradient.

Abstract: A display substrate and a display device are provided. The display substrate includes a base substrate, sub-pixels and an isolation structure, each sub-pixel includes a light-emitting functional layer including film layers. The isolation structure is between adjacent sub-pixels, the isolation structure includes a first sub-isolation structure and a second sub-isolation structure, the first sub-isolation structure is between the second sub-isolation structure and the base substrate, and the size of the first sub-isolation structure is smaller than that of the second sub-isolation structure, the second sub-isolation structure includes a protruding portion; or, a slope angle of a side surface of the first sub-isolation structure is greater than 60 degrees and less than 120 degrees, and/or, a slope angle of a side surface of the second sub-isolation structure is greater than 60 degrees and less than 120 degrees; and at least one film layer is disconnected at the isolation structure.

Abstract: Disclosed are a display substrate and a method for manufacturing same, and a display apparatus.

Abstract: Provided is a display substrate. The display substrate includes: a base substrate, provided with a display region; a plurality of pixel units, disposed in the display region; a barrier structure; surrounding the display region; a first organic film layer, disposed on one side of the base substrate; and at least one first power line, disposed on a side, proximal to the base substrate, of the first organic film layer, wherein one end of the first power line is disposed on a side, distal from the display region, of the harrier structure and configured to receive a first power signal, and the other end of the first power line is disposed on a side, proximal to the display region of the barrier structure and connected to the plurality of pixel units.

Abstract: The present disclosure provides a display substrate, including: a base substrate having an opening region, a transition region surrounding the opening region and a pixel region surrounding the opening region; at least one ink-jet printing dam in the transition region and surrounding the opening region; and at least one conductive film layer in the transition region, where an orthographic projection of the conductive film layer on the base substrate is overlapped with an orthographic projection of the ink-jet printing dam on the base substrate. In the technical solution of the present disclosure, the conductive film layer is intended to absorb and conduct heat, so as to reduce the heat on the ink-jet printing dam.

Abstract: The disclosure provides a display substrate motherboard, a manufacturing method thereof, a display panel motherboard and a manufacturing method of a display substrate. The display substrate motherboard includes a base substrate including multiple substrate areas, each substrate area including a display region and a pad region; a display structure layer located on the base substrate and including a pixel defining layer and multiple film layers located between the pixel defining layer and the base substrate, a blocking region is arranged between any two adjacent substrate areas; a portion of the display structure layer in the blocking region has a first groove therein, a portion of the display structure layer between the first groove and the pad region adjacent thereto constitutes a first spacer region; a thickness of the portion of the display structure layer in the first spacer region is less than that in the display region.

Abstract: The disclosure provides a display substrate motherboard, a manufacturing method thereof, a display panel motherboard and a manufacturing method of a display substrate. The display substrate motherboard includes a base substrate including multiple substrate areas, each substrate area including a display region and a pad region; a display structure layer located on the base substrate and including a pixel defining layer and multiple film layers located between the pixel defining layer and the base substrate, a blocking region is arranged between any two adjacent substrate areas; a portion of the display structure layer in the blocking region has a first groove therein, a portion of the display structure layer between the first groove and the pad region adjacent thereto constitutes a first spacer region; a thickness of the portion of the display structure layer in the first spacer region is less than that in the display region.