Abstract: A lens driving device and a driving method thereof are provided. The lens driving device includes a lens frame, a magnetic group, a driving element group and a control device. The lens frame carries at least one optical element. The magnetic group includes a plurality of pairs of magnetic elements. The driving element group includes at least two coils. The control device supplies power to the driving element group so that the lens frame is driven by the driving element group to move. The driving element group is disposed on the lens frame, and the amount of the lens frame is equal to that of the driving element group. The control device in a first driving state supplies the power to the coils in sequence so that the driving element group is moved from a pair of magnetic elements to another pair of magnetic elements.

Abstract: A lens driving device and a driving method thereof are provided. The lens driving device includes a lens frame, a magnetic group, a driving element group and a control device. The lens frame carries at least one optical element. The magnetic group includes a plurality of pairs of magnetic elements. The driving element group includes at least two coils. The control device supplies power to the driving element group so that the lens frame is driven by the driving element group to move. The driving element group is disposed on the lens frame, and the amount of the lens frame is equal to that of the driving element group. The control device in a first driving state supplies the power to the coils in sequence so that the driving element group is moved from a pair of magnetic elements to another pair of magnetic elements.

Abstract: A heat-dissipating module including a board-type heat-pipe and a heat-conductive construction connected therewith. The heat-conductive construction has a connecting end in contact with the board-type heat-pipe. Via the connecting end, the heat-conductive construction is connected to a predetermined section of the board-type heat-pipe. The other section of the heat-conductive construction forms an open end. The board-type heat-pipe is composed of multiple independent heat-pipe units not communicating with each other. The heat generated by a heat-generating element can be quickly and uniformly transferred through the heat-pipe units to the heat-conductive construction for dissipating the heat at high efficiency.

Abstract: A complex printed circuit board structure including a flexible printed wiring board and a heat-dissipating substrate bonded with the flexible printed wiring board. Parts of surface material of the flexible printed wiring board is removed to form depressions or through holes for laying electronic elements therein. The surfaces of the electronic elements can at least partially get closer to or directly contact the heat-dissipating substrate through the depressions or through holes of the flexible printed wiring board. Therefore, the heat generated by the electronic elements can be more quickly and directly conducted to the heat-dissipating substrate and dissipated at high efficiency.

Abstract: A printed circuit board structure including a carrier face on which a conductive layer is for connecting with electronic elements and a heat pipe texture arranged inside and along the printed circuit board structure. The printed circuit board is made of a material with good thermal conductivity, whereby the heat generated by the electronic elements can be quickly conducted to the heat pipe texture and quickly dissipated.