Patents by Inventor Huiyuan Pei

Huiyuan Pei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9349606
    Abstract: A method for forming conductive contacts in a dielectric layer is provided. Partial vias are etched into the dielectric layer through a via mask. Trenches are etched into the dielectric layer through a trench mask, wherein the etching the trenches completes and over etches the vias to widen bottoms of the vias. Tops of the trenches or vias are rounded.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: May 24, 2016
    Assignee: Lam Research Corporation
    Inventors: Yu Cheng, Junwen Huang, Huiyuan Pei, Jiangang Liu, Youngjin Choi, Liang Wang
  • Publication number: 20150179472
    Abstract: A method for forming conductive contacts in a dielectric layer is provided. Partial vias are etched into the dielectric layer through a via mask. Trenches are etched into the dielectric layer through a trench mask, wherein the etching the trenches completes and over etches the vias to widen bottoms of the vias. Tops of the trenches or vias are rounded.
    Type: Application
    Filed: May 2, 2012
    Publication date: June 25, 2015
    Inventors: Yu Cheng, Junwen Huang, Huiyuan Pei, Jiangang Liu, Youngjin Choi, Liang Wang