Patents by Inventor Huiyun Liu
Huiyun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11946349Abstract: A downhole throttling device based on wireless control includes an inlet nozzle, a throttling assembly, an electrical sealing cylinder, a gas guide cylinder, a lower adapter sleeve, an end socket, a female sleeve, and electrical components. The inlet nozzle is connected to the throttling assembly, the throttling assembly is connected to the electrical sealing cylinder and the gas guide cylinder, the electrical sealing cylinder and the gas guide cylinder are both connected to the lower adapter sleeve, the lower adapter sleeve is respectively connected to the end socket and the female sleeve, and the electrical components are arranged in the electrical sealing cylinder. A throttling effect is achieved by detecting the temperature and pressure in a tube by a temperature/pressure sensor in the electrical components and controlling a motor to rotate a movable valve in the throttling assembly by a circuit control assembly, thereby achieving wireless control over downhole throttling.Type: GrantFiled: September 15, 2020Date of Patent: April 2, 2024Assignees: PetroChina Company Limited, Sichuan Shengnuo Oil. And Gas Engineering Technology Service Co., LtdInventors: Jun Xie, Huiyun Ma, Jian Yang, Chenggang Yu, Yukun Fu, Qiang Yin, Kui Li, Yuan Jiang, Dezheng Yi, Yanyan Liu, Haifeng Zhong, Xiaodong Liu
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Patent number: 11447784Abstract: The present invention provides a method for improving transformation efficiency of a plant. The method according to the present invention comprises the use of a nucleic acid encoding the amino acid sequence set forth in SEQ ID NO: 2 or 4, or a nucleic acid encoding a polypeptide comprising an amino acid sequence having at least 85% identity with the amino acid sequence set forth in SEQ ID NO: 2 or 4, and having a function of improving transformation efficiency of a plant.Type: GrantFiled: June 7, 2018Date of Patent: September 20, 2022Assignees: INSTITUTE OF CROP SCIENCE, CHINESE ACADEMY OF AGRICULTURAL SCIENCES, KANEKA CORPORATIONInventors: Xingguo Ye, Ke Wang, Yuji Ishida, Chizu Yanagihara, Huiyun Liu, Kunyang Wang, Lei Shi, Lipu Du, Jing Wang, Zhishan Lin
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Publication number: 20220255297Abstract: A semiconductor device for use in an optoelectronic integrated circuit; the device comprising: a group four substrate, a waveguide, and a group III/V multilayer stack; wherein the group III/V multilayer stack comprises a quantum component for producing light for the waveguide; wherein the waveguide comprises a material with a deposition temperature below 550 degrees Celsius and a refractive index of any value between 1.3 and 3.8.Type: ApplicationFiled: July 27, 2020Publication date: August 11, 2022Inventors: Frederic GARDES, Alwyn John SEEDS, Huiyun LIU, Siming CHEN
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Publication number: 20220102935Abstract: Disclosed herein is a semiconductor device comprising: a silicon substrate; a germanium layer; and a buffer layer comprised of at least one layer of III-V compound, formed directly on silicon; at least one layer containing III-V compound quantum dots wherein one or more facets are formed using focused ion beam etching such that the angle between the plane of the facet is normal to the plane of growth.Type: ApplicationFiled: October 5, 2021Publication date: March 31, 2022Inventors: Siming CHEN, Mengya LIAO, Suguo HUO, Mingchu TANG, Jiang WU, Alwyn SEEDS, Huiyun LIU
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Publication number: 20220006264Abstract: A semiconductor device comprising a nominally or exactly or equivalent orientation silicon substrate on which is grown directly a <100 nm thick nucleation layer (NL) of a III-V compound semiconductor, other than GaP, followed by a buffer layer of the same compound, formed directly on the NL, optionally followed by further III-V semiconductor layers, followed by at least one layer containing III-V compound semiconductor quantum dots, optionally followed by further III-V semiconductor layers. The NL reduces the formation and propagation of defects from the interface with the silicon, and the resilience of quantum dot structures to dislocations enables lasers and other semiconductor devices of improved performance to be realized by direct epitaxy on nominally or exactly or equivalent orientation silicon.Type: ApplicationFiled: July 13, 2021Publication date: January 6, 2022Inventors: Mingchu TANG, Mengya LIAO, Siming CHEN, Jiang WU, Alwyn SEEDS, Huiyun LIU
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Publication number: 20200231977Abstract: The present invention provides a method for improving transformation efficiency of a plant. The method according to the present invention comprises the use of a nucleic acid encoding the amino acid sequence set forth in SEQ ID NO: 2 or 4, or a nucleic acid encoding a polypeptide comprising an amino acid sequence having at least 85% identity with the amino acid sequence set forth in SEQ ID NO: 2 or 4, and having a function of improving transformation efficiency of a plant.Type: ApplicationFiled: June 7, 2018Publication date: July 23, 2020Applicants: INSTITUTE OF CROP SCIENCE, CHINESE ACADEMY OF AGRICULTURAL SCIENCES, JAPAN TOBACCO INC.Inventors: Xingguo YE, Ke WANG, Yuji ISHIDA, Chizu YANAGIHARA, Huiyun LIU, Kunyang WANG, Lei SHI, Lipu DU, Jing WANG, Zhishan LIN
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Publication number: 20200028317Abstract: Disclosed herein is a semiconductor device comprising: a silicon substrate; a germanium layer; and a buffer layer comprised of at least one layer of III-V compound, formed directly on silicon; at least one layer containing III-V compound quantum dots wherein one or more facets are formed using focused ion beam etching such that the angle between the plane of the facet is normal to the plane of growth.Type: ApplicationFiled: January 30, 2018Publication date: January 23, 2020Inventors: Siming CHEN, Mengya LIAO, Suguo HUO, Mingchu TANG, Jiang WU, Alwyn SEEDS, Huiyun LIU
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Publication number: 20190326730Abstract: A semiconductor device comprising a nominally or exactly or equivalent orientation silicon substrate on which is grown directly a <100 nm thick nucleation layer (NL) of a III-V compound semiconductor, other than GaP, followed by a buffer layer of the same compound, formed directly on the NL, optionally followed by further III-V semiconductor layers, followed by at least one layer containing III-V compound semiconductor quantum dots, optionally followed by further III-V semiconductor layers. The NL reduces the formation and propagation of defects from the interface with the silicon, and the resilience of quantum dot structures to dislocations enables lasers and other semiconductor devices of improved performance to be realized by direct epitaxy on nominally or exactly or equivalent orientation silicon.Type: ApplicationFiled: December 7, 2017Publication date: October 24, 2019Inventors: Mingchu TANG, Mengya LIAO, Siming CHEN, Jiang WU, Alwyn SEEDS, Huiyun LIU
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Patent number: 9793686Abstract: A semiconductor device comprising a silicon substrate on which is grown a <100 nm thick epilayer of AlAs or related compound, followed by a compound semiconductor other than GaN buffer layer. Further III-V compound semiconductor structures can be epitaxially grown on top. The AlAs epilayer reduces the formation and propagation of defects from the interface with the silicon, and so can improve the performance of an active structure grown on top.Type: GrantFiled: April 15, 2016Date of Patent: October 17, 2017Assignee: UCL Business PLCInventors: Huiyun Liu, Andrew David Lee, Alwyn John Seeds
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Patent number: 9788178Abstract: A method for acquiring recommending information, a terminal and a server are provided. In the method, a first terminal receives a second telephone number affiliated with a second terminal sent by a recommender using a third terminal. The first terminal sends a request for recommending information to a server according to the first telephone number of the first terminal, a telephone number of the recommender, and the second telephone number, so that the server generates recommending information according to the request for recommending information, and pushes the recommending information to the second terminal affiliated with the second telephone number.Type: GrantFiled: September 28, 2015Date of Patent: October 10, 2017Assignee: Xiaomi Inc.Inventors: Huiyun Liu, Guangjian Wang, Zhiyong Wang
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Publication number: 20170188211Abstract: A method for acquiring recommending information, a terminal and a server are provided. In the method, a first terminal receives a second telephone number affiliated with a second terminal sent by a recommender using a third terminal. The first terminal sends a request for recommending information to a server according to the first telephone number of the first terminal, a telephone number of the recommender, and the second telephone number, so that the server generates recommending information according to the request for recommending information, and pushes the recommending information to the second terminal affiliated with the second telephone number.Type: ApplicationFiled: March 10, 2017Publication date: June 29, 2017Applicant: Xiaomi Inc.Inventors: Huiyun LIU, Guangjian WANG, Zhiyong WANG
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Publication number: 20160233647Abstract: A semiconductor device comprising a silicon substrate on which is grown a <100 nm thick epilayer of AlAs or related compound, followed by a compound semiconductor other than GaN buffer layer. Further III-V compound semiconductor structures can be epitaxially grown on top. The AlAs epilayer reduces the formation and propagation of defects from the interface with the silicon, and so can improve the performance of an active structure grown on top.Type: ApplicationFiled: April 15, 2016Publication date: August 11, 2016Inventors: Huiyun LIU, Andrew David LEE, Alwyn John SEEDS
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Patent number: 9401404Abstract: A semiconductor device is disclosed comprising: a substrate having a surface comprising germanium; a layer of gallium on said surface; and a layer of gallium arsenide on the gallium covered surface. The semiconductor heterostructure of gallium arsenide on germanium is fabricated by the steps of: protecting by a shutter a surface comprising germanium in an environment having a partial pressure of arsenic less than 10?8torr; epitaxially growing a layer of gallium on the said surface immediately after exposure of said surface; and epitaxially growing a layer of gallium arsenide on the gallium covered surface.Type: GrantFiled: February 24, 2012Date of Patent: July 26, 2016Assignee: UCL BUSINESS PLCInventors: Huiyun Liu, Alwyn John Seeds, Francesca Pozzi
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Publication number: 20160150388Abstract: A method for acquiring recommending information, a terminal and a server are provided. In the method, a first terminal receives a second telephone number affiliated with a second terminal sent by a recommender using a third terminal The first terminal sends a request for recommending information to a server according to the first telephone number of the first terminal, a telephone number of the recommender, and the second telephone number, so that the server generates recommending information according to the request for recommending information, and pushes the recommending information to the second terminal affiliated with the second telephone number.Type: ApplicationFiled: September 28, 2015Publication date: May 26, 2016Applicant: Xiaomi Inc.Inventors: Huiyun Liu, Guangjian Wang, Zhiyong Wang
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Patent number: 9343874Abstract: A semiconductor device comprising a silicon substrate on which is grown a <100 nm thick epilayer of AlAs or related compound, followed by a compound semiconductor other than GaN buffer layer. Further III-V compound semiconductor structures can be epitaxially grown on top. The AlAs epilayer reduces the formation and propagation of defects from the interface with the silicon, and so can improve the performance of an active structure grown on top.Type: GrantFiled: July 30, 2013Date of Patent: May 17, 2016Assignee: UCL BUSINESS PLCInventors: Huiyun Liu, Andrew David Lee, Alwyn John Seeds
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Publication number: 20160094713Abstract: A message recognition method and corresponding device are provided. In the method, the device receives a message, which includes text content and a number associated with a sender of the message. The device analyzes the text content of the message and acquires a user name corresponding to the number associated with the sender. The device determines the user name as the communication message sender's name and displays the sender's name in the message.Type: ApplicationFiled: September 28, 2015Publication date: March 31, 2016Applicant: Xiaomi Inc.Inventors: Huiyun LIU, Guangjian WANG, Zhiyong WANG
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Publication number: 20150311072Abstract: The present invention provides a reproducible preliminary in-situ oxide removal step for patterned self-assisted III-V semiconductor nanowire growth. Here “in-situ” means located within the same treatment environment or apparatus as the nanowire growth process, e.g. with a molecular beam epitaxy (MBE) apparatus or the like. Providing an in-situ process may prevent the formation of a thin oxide layer during transfer of the substrate into the nanowire growth apparatus.Type: ApplicationFiled: April 21, 2015Publication date: October 29, 2015Applicants: UCL Business PLC, Gasp Solar ApSInventors: Martin Aagesen, Yunyan Zhang, Jiang Wu, Huiyun Liu
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Publication number: 20150244151Abstract: A semiconductor device comprising a silicon substrate on which is grown a <100 nm thick epilayer of AlAs or related compound, followed by a compound semiconductor other than GaN buffer layer. Further III-V compound semiconductor structures can be epitaxially grown on top. The AlAs epilayer reduces the formation and propagation of defects from the interface with the silicon, and so can improve the performance of an active structure grown on top.Type: ApplicationFiled: July 30, 2013Publication date: August 27, 2015Inventors: Huiyun Liu, Andrew David Lee, Alwyn John Seeds
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Publication number: 20140016659Abstract: A semiconductor device is disclosed comprising: a substrate having a surface comprising germanium; a layer of gallium on said surface; and a layer of gallium arsenide on the gallium covered surface. The semiconductor heterostructure of gallium arsenide on germanium is fabricated by the steps of: protecting by a shutter a surface comprising germanium in an environment having a partial pressure of arsenic less than 10?8torr; epitaxially growing a layer of gallium on the said surface immediately after exposure of said surface; and epitaxially growing a layer of gallium arsenide on the gallium covered surface.Type: ApplicationFiled: February 24, 2012Publication date: January 16, 2014Applicant: UCL BUSINESS PLCInventors: Huiyun Liu, Alwyn John Seeds, Francesca Pozzi