Abstract: Provided is a dielectric composite material for a fingerprint sensor induction layer and a preparation method therefor, wherein the dielectric composite material is made from the following components: an epoxy resin, a phenolic resin, a first type of dielectric inorganic filler, a second type of dielectric inorganic filler, a curing agent, an adhesion promoter, a mould releasing agent and a flame retardant. The dielectric composite material has a high dielectric constant, a small dielectric loss, very stable dielectric properties which change very little with the test frequency, non-transparency and high hardness, such that the fingerprint sensor induction layer prepared therefrom satisfies the requirements of reliability and stability while reaching the thickness requirement, and can be used in various portable electronic products. The dielectric composite material for the fingerprint sensor induction layer is free of heavy metal lead, and is green and environmentally friendly.