Patents by Inventor HuiZhu Yang

HuiZhu Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230168045
    Abstract: A heat pipe and a geothermal energy collecting device. The heat pipe includes a sealing member which is provided with channels; a first pipe body, one end of the first pipe body has an opening, and an other end of the first pipe body is sealed by the sealing member, which has a first chamber, first heat transfer members which are connected to the sealing member and located at one side of the sealing member, each of the first heat transfer members has a first cavity; and second heat transfer members which are connected to the sealing member and located at an other side of the sealing member, each of second heat transfer members has a second cavity configured to communicate with the first cavity of a corresponding one of the first heat transfer members via a respective one of the channels.
    Type: Application
    Filed: July 23, 2021
    Publication date: June 1, 2023
    Inventors: Yonggang ZHU, Yongyao LI, Huizhu YANG, Chuanwen LV
  • Publication number: 20220373266
    Abstract: A flat-plate heat pipe and a preparation method thereof, and a heat exchanger are provided. The flat-plate heat pipe includes an upper shell (11) and a lower shell (12); the upper shell (11) and the lower shell (12) are assembled with each other to form a flat-plate shell (10) with a sealed cavity; the sealed cavity is filled with a phase change working medium; a capillary wick (20) is arranged in the flat-plate shell (10); and a surface of the capillary wick (20) has a micro-nano structure. By means of the arrangement of the above capillary wick having the micro-nano structure on the surface thereof, the flat-plate heat pipe has excellent heat conductivity and high resistance to gravity, and is flexible in use and arrangement.
    Type: Application
    Filed: July 23, 2021
    Publication date: November 24, 2022
    Inventors: YongGang Zhu, YongYao Li, HuiZhu Yang, ChuanWen Lv