Patents by Inventor Humberto Mercado

Humberto Mercado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for integrated circuit packaging
    Publication number: 20050206040
    Abstract: According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfaces form the upper and lower surfaces of a mold cavity when the first and second mold press die are engaged. The mold tool also includes a bright TiN coating disposed on the first non-planar surface. The bright TiN coating operates to decrease residue on the first non-planar surface from a mold compound.
    Type: Application
    Filed: June 1, 2005
    Publication date: September 22, 2005
    Inventor: Humberto Mercado
  • Method and system for integrated circuit packaging
    Publication number: 20050046004
    Abstract: According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfaces form the upper and lower surfaces of a mold cavity when the first and second mold press die are engaged. The mold tool also includes a bright TiN coating disposed on the first non-planar surface. The bright TiN coating operates to decrease residue on the first non-planar surface from a mold compound.
    Type: Application
    Filed: August 29, 2003
    Publication date: March 3, 2005
    Inventor: Humberto Mercado