Patents by Inventor Humberto Quezada Mercado

Humberto Quezada Mercado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7402270
    Abstract: According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfaces form the upper and lower surfaces of a mold cavity when the first and second mold press die are engaged. The mold tool also includes a bright TiN coating disposed on the first non-planar surface. The bright TiN coating operates to decrease residue on the first non-planar surface from a mold compound.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: July 22, 2008
    Assignee: Texas Instruments Incorporated
    Inventor: Humberto Quezada Mercado
  • Patent number: 6919629
    Abstract: According to one embodiment of the invention, a mold tool for packaging integrated circuits includes a first mold press die including a first non-planar surface and a second mold press die including a second non-planar surface. The first and second non-planar surfaces form the upper and lower surfaces of a mold cavity when the first and second mold press die are engaged. The mold tool also includes a bright TiN coating disposed on the first non-planar surface. The bright TiN coating operates to decrease residue on the first non-planar surface from a mold compound. The mold compound is distributed into the mold cavity to form a package operable to encapsulate an integrated circuit.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: July 19, 2005
    Assignee: Texas Instruments Incorporated
    Inventor: Humberto Quezada Mercado