Patents by Inventor Humio Horii

Humio Horii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7442445
    Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: October 28, 2008
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hideyuki Sagawa, Hiromitsu Kuroda, Kazuma Kuroki, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama, Shigeru Okamoto
  • Publication number: 20060166028
    Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.
    Type: Application
    Filed: December 23, 2005
    Publication date: July 27, 2006
    Inventors: Hideyuki Sagawa, Hiromitsu Kuroda, Kazuma Kuroki, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama, Shigeru Okamoto