Patents by Inventor Hun Do Kim

Hun Do Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for filling contact holes with metal by two-step deposition
    Patent number: 5683938
    Abstract: Method for filling contact holes with metals by two-step deposition of selective tungsten layer is disclosed. The selective tungsten thin films are deposited in two steps, thus maximizing the contact filling with tungsten, gaining a stability of metal wires with better step coverage, and enhancing the reliability on semiconductor element.
    Type: Grant
    Filed: October 24, 1994
    Date of Patent: November 4, 1997
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Sang Young Kim, Yung Wook Song, Hun Do Kim