Patents by Inventor Hun Gyu PARK
Hun Gyu PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776753Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.Type: GrantFiled: September 28, 2022Date of Patent: October 3, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Patent number: 11665825Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal electrodes; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.Type: GrantFiled: October 4, 2021Date of Patent: May 30, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chui Shin, Ji Hong Jo
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Publication number: 20230013554Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.Type: ApplicationFiled: September 28, 2022Publication date: January 19, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil PARK, Se Hun PARK, Hun Gyu PARK, Woo Chul SHIN, Ji Hong JO
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Patent number: 11488778Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.Type: GrantFiled: January 30, 2020Date of Patent: November 1, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Patent number: 11309133Abstract: The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular.Type: GrantFiled: April 28, 2020Date of Patent: April 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Hun Gyu Park, Se Hun Park, Gu Won Ji
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Publication number: 20220030719Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.Type: ApplicationFiled: October 4, 2021Publication date: January 27, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Patent number: 11166376Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.Type: GrantFiled: April 13, 2020Date of Patent: November 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Patent number: 11133132Abstract: A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.Type: GrantFiled: April 21, 2020Date of Patent: September 28, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Tae Hoon Kim, Gu Won Ji
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Publication number: 20210202175Abstract: The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular.Type: ApplicationFiled: April 28, 2020Publication date: July 1, 2021Inventors: Heung Kil PARK, Hun Gyu PARK, Se Hun PARK, Gu Won JI
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Publication number: 20210076499Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2?SA1/BW1?0.5 and 0.2?SA2/BW2?0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.Type: ApplicationFiled: April 13, 2020Publication date: March 11, 2021Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Publication number: 20210065983Abstract: A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.Type: ApplicationFiled: April 21, 2020Publication date: March 4, 2021Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Tae Hoon Kim, Gu Won Ji
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Publication number: 20210020366Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.Type: ApplicationFiled: January 30, 2020Publication date: January 21, 2021Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo
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Patent number: 9815086Abstract: There are provided a vibrator and an electronic device including the same. The vibrator includes: a housing having an internal space; an elastic member having both ends fixed to the housing so as to be disposed in the internal space in a state in which elastic deformation is possible; and a piezoelectric element mounted on one surface of the elastic member, wherein the piezoelectric element is fixed to the elastic member by soldering.Type: GrantFiled: December 30, 2014Date of Patent: November 14, 2017Assignee: MPLUS CO., LTD.Inventors: Sang Hun Han, Sung Chan Park, Hun Gyu Park, So Jung Cho
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Publication number: 20150214467Abstract: There are provided a vibrator and an electronic device including the same. The vibrator includes: a housing having an internal space; an elastic member having both ends fixed to the housing so as to be disposed in the internal space in a state in which elastic deformation is possible; and a piezoelectric element mounted on one surface of the elastic member, wherein the piezoelectric element is fixed to the elastic member by soldering.Type: ApplicationFiled: December 30, 2014Publication date: July 30, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hun HAN, Sung Chan PARK, Hun Gyu PARK, So Jung CHO