Patents by Inventor Hun Jae JANG
Hun Jae JANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862457Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.Type: GrantFiled: January 18, 2023Date of Patent: January 2, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: SeongKeun Cho, Young Hoo Kim, Seung Min Shin, Tae Min Earmme, Kun Tack Lee, Hun Jae Jang, Eun Hee Jeang
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Publication number: 20230343613Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.Type: ApplicationFiled: June 26, 2023Publication date: October 26, 2023Inventors: Yong Jun CHOI, Seok Hoon KIM, Young-Hoo KIM, In Gi KIM, Sung Hyun PARK, Seung Min SHIN, Kun Tack LEE, Jinwoo LEE, Hun Jae JANG, Ji Hoon CHA
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Publication number: 20230249230Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.Type: ApplicationFiled: April 12, 2023Publication date: August 10, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Seung Min SHIN, Hun Jae Jang, Seok Hoon Kim, Young-Hoo Kim, In Gi Kim, Tae-Hong Kim, Kun Tack Lee, Ji Hoon Cha, Yong Jun Choi
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Patent number: 11721565Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.Type: GrantFiled: November 21, 2019Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Jun Choi, Seok Hoon Kim, Young-Hoo Kim, In Gi Kim, Sung Hyun Park, Seung Min Shin, Kun Tack Lee, Jinwoo Lee, Hun Jae Jang, Ji Hoon Cha
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Publication number: 20230154743Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.Type: ApplicationFiled: January 18, 2023Publication date: May 18, 2023Inventors: SeongKeun CHO, Young Hoo KIM, Seung Min SHIN, Tae Min EARMME, Kun Tack LEE, Hun Jae JANG, Eun Hee JEANG
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Patent number: 11648594Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.Type: GrantFiled: June 2, 2020Date of Patent: May 16, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung Min Shin, Hun Jae Jang, Seok Hoon Kim, Young-Hoo Kim, In Gi Kim, Tae-Hong Kim, Kun Tack Lee, Ji Hoon Cha, Yong Jun Choi
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Patent number: 11605545Abstract: A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.Type: GrantFiled: November 22, 2019Date of Patent: March 14, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hun Jae Jang, Seung Min Shin, Seok Hoon Kim, In Gi Kim, Tae-Hong Kim, Kun Tack Lee, Jinwoo Lee, Ji Hoon Cha, Yong Jun Choi
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Patent number: 11581182Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.Type: GrantFiled: September 17, 2021Date of Patent: February 14, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seongkeun Cho, Young Hoo Kim, Seung Min Shin, Tae Min Earmme, Kun Tack Lee, Hun Jae Jang, Eun Hee Jeang
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Publication number: 20220262621Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.Type: ApplicationFiled: September 17, 2021Publication date: August 18, 2022Inventors: Seongkeun CHO, Young Hoo KIM, Seung Min SHIN, Tae Min EARMME, Kun Tack LEE, Hun Jae JANG, Eun Hee JEANG
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Patent number: 11400219Abstract: Disclosed is drug delivery system for effectively administering a drug into a human or animal body tissue.Type: GrantFiled: July 27, 2017Date of Patent: August 2, 2022Assignee: SNU R&DB FOUNDATIONInventors: Jai-Ick Yoh, Hun Jae Jang
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Patent number: 11369741Abstract: Provided is a micro-jet drug injection device comprising: a pressure chamber having a pressure driving liquid hermetically filled therein; a drug chamber having a micro nozzle defined in a wall; an elastic membrane elastically expandable and restorable and to separate the pressure chamber from the drug chamber; an energy-focusing unit concentrating energy on the pressure driving liquid in the pressure chamber; and the storage unit supplying the drug solution therein into the drug chamber through a drug supply channel. The drug chamber has a partial inner space defined therein. The partial inner space is in fluid communication with the drug supply channel and is partially defined by the membrane. A nozzle closure is disposed inside or outside the drug chamber. The nozzle closure blocks inflow of air outside the micro-nozzle into the partial inner space after the elastic membrane has expanded and before elastic recovery of the membrane is completed.Type: GrantFiled: November 28, 2017Date of Patent: June 28, 2022Assignee: SNU R&DB FOUNDATIONInventors: Jai-Ick Yoh, Hwi-Chan Ham, Hun Jae Jang
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Publication number: 20220084812Abstract: A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.Type: ApplicationFiled: May 12, 2021Publication date: March 17, 2022Inventors: Sung Hyun Park, Seo Hyun Kim, Seung Ho Kim, Young Chan Kim, Young-Hoo Kim, Tae-Hong Kim, Hyun Woo Nho, Seung Min Shin, Kun Tack Lee, Hun Jae Jang
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Publication number: 20210060625Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.Type: ApplicationFiled: June 2, 2020Publication date: March 4, 2021Applicant: Samsung Electronics Co., Ltd.Inventors: Seung Min SHIN, Hun Jae JANG, Seok Hoon KIM, Young-Hoo KIM, In Gi KIM, Tae-Hong KIM, Kun Tack LEE, Ji Hoon CHA, Yong Jun CHOI
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Publication number: 20200343113Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.Type: ApplicationFiled: November 21, 2019Publication date: October 29, 2020Inventors: Yong Jun CHOI, Seok Hoon KIM, Young-Hoo KIM, In Gi KIM, Sung Hyun PARK, Seung Min SHIN, Kun Tack LEE, Jinwoo LEE, Hun Jae JANG, Ji Hoon CHA
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Publication number: 20200335361Abstract: A wafer cleaning equipment includes a housing to be positioned adjacent to a wafer, a hollow region in the housing, a laser module that outputs a laser beam having a profile of the laser beam includes a first region having a first intensity and a second region having a second intensity greater than the first intensity, the laser beam being output into the hollow region, and a transparent window that covers an upper part of the hollow region and transmits the laser beam to be incident on an entirety of a lower surface of the wafer.Type: ApplicationFiled: November 22, 2019Publication date: October 22, 2020Inventors: Hun Jae JANG, Seung Min Shin, Seok Hoon Kim, In Gi Kim, Tae-Hong Kim, Kun Tack Lee, Jinwoo Lee, Ji Hoon Cha, Yong Jun Choi
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Publication number: 20190255253Abstract: Disclosed is drug delivery system for effectively administering a drug into a human or animal body tissue.Type: ApplicationFiled: July 27, 2017Publication date: August 22, 2019Inventors: Jai-Ick YOH, Hun Jae JANG
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Publication number: 20180154082Abstract: Provided is a micro-jet drug injection device comprising: a pressure chamber having a pressure driving liquid hermetically filled therein; a drug chamber having a micro nozzle defined in a wall; an elastic membrane elastically expandable and restorable and to separate the pressure chamber from the drug chamber; an energy-focusing unit concentrating energy on the pressure driving liquid in the pressure chamber; and the storage unit supplying the drug solution therein into the drug chamber through a drug supply channel. The drug chamber has a partial inner space defined therein. The partial inner space is in fluid communication with the drug supply channel and is partially defined by the membrane. A nozzle closure is disposed inside or outside the drug chamber. The nozzle closure blocks inflow of air outside the micro-nozzle into the partial inner space after the elastic membrane has expanded and before elastic recovery of the membrane is completed.Type: ApplicationFiled: November 28, 2017Publication date: June 7, 2018Inventors: Jai-Ick YOH, Hwi-Chan HAM, Hun Jae JANG