Patents by Inventor Hun-Neng Chen

Hun-Neng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MAGNETIC COMPONENT
    Publication number: 20240029936
    Abstract: A magnetic component includes a core, at least one coil and a thermal conductive filler. The core includes an inner leg, at least two outer legs and at least one non-bonding region. The at least one coil is wound around the inner leg or the at least two outer legs. The thermal conductive filler covers a part of the core. At least one part of the at least one non-bonding region is not covered by the thermal conductive filler.
    Type: Application
    Filed: July 18, 2023
    Publication date: January 25, 2024
    Applicant: CYNTEC CO., LTD.
    Inventors: Hsin-Jung Cheng, Po-Hsiu Chien, Yung-Shou Hsu, Hun-Neng Chen, Hsieh-Shen Hsieh