Patents by Inventor Hun-Yong Lee

Hun-Yong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250125784
    Abstract: Provided is a surface acoustic wave device and a method of manufacturing the same. The surface acoustic wave device includes: a semiconductor support substrate; a modified substrate surface layer formed on a surface of the support substrate; a low acoustic velocity layer formed on the modified substrate surface layer; a piezoelectric layer formed on the low acoustic velocity layer; and a plurality of IDT electrodes disposed on the piezoelectric layer, wherein surface roughness of one side of the modified substrate surface layer is 0.2nm or lower.
    Type: Application
    Filed: September 22, 2024
    Publication date: April 17, 2025
    Inventors: Hun Yong LEE, Tae Hyun KIM, Yoshikazu KIHARA
  • Publication number: 20250125787
    Abstract: The present invention relates to a surface acoustic wave filter with connected bar pistons, the filter comprising: on a substrate where a support substrate, an energy confinement layer, and a piezoelectric layer are sequentially laminated, an IDT electrode unit including a first bus bar and a second bus bar extended in a first direction and spaced apart from each other in a second direction perpendicular to the first direction, and a plurality of first IDT electrodes and a plurality of second IDT electrodes alternately extended from the first bus bar and the second bus bar in the second direction, and spaced apart from each other in the first direction; and lower and upper bar pistons formed in a shape of a strip extended in the first direction to cover tips of the plurality of first IDT electrodes and the plurality of second IDT electrodes, wherein the upper bar piston and the lower bar piston are connected by bar piston connection units in an area excluding the IDT electrode unit.
    Type: Application
    Filed: September 24, 2024
    Publication date: April 17, 2025
    Inventors: Hun Yong LEE, Yoshikazu KIHARA
  • Publication number: 20250070755
    Abstract: The present disclosure relates to: a surface acoustic wave filter comprising: a substrate on which a support substrate, an energy confinement layer, and a piezoelectric layer are sequentially stacked; a first bus bar and a second bus bar each extending on the substrate in a first direction and spaced apart from each other in a second direction perpendicular to the first direction; a plurality of first interdigital transducer (IDT) electrodes and a plurality of second IDT electrodes alternately disposed to extend from the first and second bus bars in the second direction and spaced apart from each other in the first direction; a second dummy electrode extending from the second bus bar to face an end portion of each of the plurality of first IDT electrodes extending from the first bus bar; and a first dummy electrode extending from the first bus bar to face an end portion of each of the plurality of second IDT electrodes extending from the second bus bar, wherein an acoustic velocity at the first and second dum
    Type: Application
    Filed: August 15, 2024
    Publication date: February 27, 2025
    Inventors: Hun Yong LEE, Sang Hoon MYEONG
  • Publication number: 20250038732
    Abstract: The present invention provides a surface acoustic wave filter with a mass addition film formed on a plurality of electrodes. The surface acoustic wave filter includes a substrate on which a support substrate, an energy confinement layer, and a piezoelectric layer are sequentially stacked; first and second bus bars extended in a first direction on the substrate and spaced apart from each other in a second direction perpendicular to the first direction; a plurality of IDT electrodes alternately extended from the first and second bus bars in the second direction and spaced apart from each other in the first direction; and a mass addition film extended in the first direction to cover the top surface of the plurality of IDT electrodes and the top surface of the substrate exposed between the plurality of IDT electrodes.
    Type: Application
    Filed: July 21, 2024
    Publication date: January 30, 2025
    Inventors: Hun Yong LEE, Hae Kwan OH, Sung Hyun LEE
  • Publication number: 20250030397
    Abstract: A Surface Acoustic Wave (SAW) device having improved Q performance and high reliability of a bonding unit and a method of manufacturing the same are provided. The surface acoustic wave device includes a support substrate; a high sound velocity layer formed on the support substrate; a first low sound velocity layer formed on the high sound velocity layer; a second low sound velocity layer formed on the first low sound velocity layer; a piezoelectric plate formed on the second low sound velocity layer; and a plurality of IDT electrode fingers formed on the piezoelectric plate, and the sound velocity of the first low sound velocity layer and the sound velocity of the second low sound velocity layer are different from each other.
    Type: Application
    Filed: July 7, 2024
    Publication date: January 23, 2025
    Inventors: Yoshikazu KIHARA, Hun Yong LEE, Chang Min LEE
  • Publication number: 20250023544
    Abstract: A surface acoustic wave device with suppressed excitation of spurious waves. The surface acoustic wave device comprises: a support substrate; a piezoelectric layer formed on the support substrate; and an IDT electrode on the piezoelectric layer, wherein when a wavelength of a surface acoustic wave excited at the IDT electrode is ?, thickness of the piezoelectric layer is 2.4? or less.
    Type: Application
    Filed: July 1, 2024
    Publication date: January 16, 2025
    Inventors: Yoshikazu KIHARA, Hun Yong LEE, Tae Hyun KIM
  • Patent number: 12199587
    Abstract: A surface acoustic wave (SAW) device according to the present invention includes: a substrate; an intermediate layer formed on an upper surface of the substrate; a piezoelectric layer formed on an upper surface of the intermediate layer; and an inter-digital transducer (IDT) electrode formed on an upper surface of the piezoelectric layer to generate a SAW, wherein an upper portion of the substrate is deformed by a predetermined thickness by ion implantation to form an ion trap layer and the intermediate layer is formed on an upper surface of the ion trap layer.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: January 14, 2025
    Assignee: WISOL CO., LTD.
    Inventors: Tae Hyun Kim, Chul Hwa Lee, Hun Yong Lee, Kihara Yoshikazu
  • Publication number: 20240396522
    Abstract: Provided are a surface acoustic wave device including IDT electrodes having an oxide electrode layer formed therein, and a method for fabricating the same. The surface acoustic wave device include a piezoelectric substrate and a plurality of IDT electrodes formed on the piezoelectric substrate, wherein each of the plurality of IDT electrodes includes: a main electrode layer formed on the upper surface of the piezoelectric substrate; an upper electrode layer formed on the main electrode layer; and an oxide electrode layer formed on the upper surface of the upper electrode layer by oxidation of the upper electrode layer, and wherein the thickness (te) of each of the plurality of IDT electrodes satisfies 0.011?to/te?0.333 with respect to the thickness (to) of the oxide electrode layer.
    Type: Application
    Filed: May 22, 2024
    Publication date: November 28, 2024
    Inventors: Hun Yong LEE, Sang Hoon MYEONG, Chang Min LEE, Min Hyeong LEE
  • Publication number: 20240364303
    Abstract: A surface acoustic wave filter formed on a substrate with a multi-layer substrate and a method of fabricating the same are provided.
    Type: Application
    Filed: April 22, 2024
    Publication date: October 31, 2024
    Inventors: Hun Yong LEE, Tae Hyun KIM, Yoshikazu KIHARA
  • Publication number: 20240333252
    Abstract: Provided are a SAW resonator having an electrode structure with improved performance and a method of manufacturing the same. The SAW resonator includes a piezoelectric substrate; and a plurality of IDT electrodes formed on the piezoelectric substrate, wherein each of the plurality of IDT electrodes includes: a seed layer stacked on a surface of the piezoelectric material; and a main electrode layer formed on the seed layer, and an amorphous layer is formed on a top surface of the piezoelectric substrate.
    Type: Application
    Filed: March 20, 2024
    Publication date: October 3, 2024
    Inventors: Hun Yong LEE, Kang Ho KIM, Sang Hoon MYEONG, Min Hyeong LEE
  • Publication number: 20210211114
    Abstract: A surface acoustic wave (SAW) device according to the present invention includes: a substrate; an intermediate layer formed on an upper surface of the substrate; a piezoelectric layer formed on an upper surface of the intermediate layer; and an inter-digital transducer (IDT) electrode formed on an upper surface of the piezoelectric layer to generate a SAW, wherein an upper portion of the substrate is deformed by a predetermined thickness by ion implantation to form an ion trap layer and the intermediate layer is formed on an upper surface of the ion trap layer.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 8, 2021
    Inventors: Tae Hyun KIM, Chul Hwa LEE, Hun Yong LEE, Kihara YOSHIKAZU
  • Publication number: 20180269853
    Abstract: Disclosed is a surface acoustic wave wafer level package including a substrate, an interdigital transducer (IDT) electrode formed on the substrate, a connecting electrode formed on the substrate and electrically connected to the IDT electrode, a printed circuit board (PCB) with a through hole formed at a position corresponding to the connecting electrode, a hollow to accommodate the IDT electrode, and a bottom partially adhered to the substrate, and a connecting terminal electrically connected to the connecting electrode through the through hole.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 20, 2018
    Inventors: Hun Yong LEE, Jung Hoon HAN
  • Patent number: 7215358
    Abstract: The present invention relates to a motor-less automatic retraction device that can insert a vision tube capable of monitoring the inside of a furnace to mange the internal state of the furnace and control the temperature of the furnace into the furnace and retract the vision tube from the furnace in a motor-less manner. A conventional retraction device is disadvantageous in that it is expensive, voluminous, difficult to install, thus requiring expert's help to install, and difficult to repair at the time of breakdown, and requires expensive repairing costs. In order to overcome the above-described disadvantages, an object of the present invention is to develop a motor-less automatic retraction device that can insert the vision tube into the furnace and retract the vision tube from the furnace using a spring, so the device is easily to install due to its small size and lightweight, is easy to repair, and allows repairing costs to be reduced.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: May 8, 2007
    Assignee: Youngkook Electronics
    Inventor: Hun-Yong Lee
  • Publication number: 20040212675
    Abstract: The present invention relates to a motor-less automatic retraction device that can insert a vision tube capable of monitoring the inside of a furnace to mange the internal state of the furnace and control the temperature of the furnace into the furnace and retract the vision tube from the furnace in a motor-less manner. A conventional retraction device is disadvantageous in that it is expensive, voluminous, difficult to install, thus requiring expert's help to install, and difficult to repair at the time of breakdown, and requires expensive repairing costs.
    Type: Application
    Filed: February 27, 2004
    Publication date: October 28, 2004
    Inventor: Hun-Yong Lee