Patents by Inventor Hung-Bin Chan

Hung-Bin Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating a heat pipe structure in a radiating plate
    Patent number: 6647625
    Abstract: A method for fabricating a heat pipe structure in a radiating plate is provided. A tunneling means is used to form a plurality of radiating channels in the radiating plate. Each of the plurality of radiating channels has only one opening. Then, only one of the openings of the radiating channels is left unsealed, while sealing the other openings of the radiating channels. Working fluid is injected into the radiating channels via the unsealed opening. The radiating channels are vacuated and the unsealed opening is sealed.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: November 18, 2003
    Inventors: Wei Te Wang, Hung-Bin Chan
  • Method for fabricating a heat pipe structure in a radiating plate
    Publication number: 20030110631
    Abstract: A method for fabricating a heat pipe structure in a radiating plate is provided. A tunneling means is used to form a plurality of radiating channels in the radiating plate. Each of the plurality of radiating channels has only opening. Then, only one of the openings of the radiating channels is not sealed, while sealing the other openings of the radiating channels. Working fluid is injected into the radiating channels via the reserved opening. Radiating channels is vacuated and the reserved opening is sealed.
    Type: Application
    Filed: December 13, 2001
    Publication date: June 19, 2003
    Inventors: Wei Te Wang, Hung-Bin Chan