Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a memory cell overlying a substrate and comprising a top electrode. A sidewall spacer structure is disposed along sidewalls of the memory cell. The sidewall spacer structure comprises a first spacer layer on the memory cell, a second spacer layer around the first spacer layer, and a third spacer layer around the second spacer layer. The second spacer layer comprises a lateral segment adjacent to a vertical segment. The lateral segment abuts the top electrode and has a top surface aligned with or disposed below a top surface of the top electrode. A first conductive structure overlies the memory cell and contacts the lateral segment and the top electrode.

Abstract: In some examples, a mount includes a mounting plate. In some examples, the mounting plate includes mounting holes disposed in a rectangular pattern on the mounting plate to mount a device to the mounting plate. In some examples, the mount includes an adjustment mechanism disposed within a depression of the mounting plate. In some examples, the mount includes a coupler to couple the mounting plate to a support.

Abstract: A device includes a substrate; semiconductor fins extending from the substrate; a liner layer on sidewalls of the semiconductor fins; an etch stop layer over the substrate and extending laterally from a first portion of the liner layer on a first one of the semiconductor fins to a second portion of the line layer on a second one of the semiconductor fins; an isolation structure over the etch stop layer, wherein the etch stop layer and the isolation structure include different materials; a gate dielectric layer over a top surface of the isolation structure; and a dielectric feature extending through the gate dielectric layer and into the isolation structure, wherein the isolation structure and the dielectric feature collectively extend laterally from the first portion of the liner layer to the second portion of the line layer.

Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.

Abstract: In an embodiment, a method includes forming a first fin and a second fin within an insulation material over a substrate, the first fin and the second fin includes different materials, the insulation material being interposed between the first fin and the second fin, the first fin having a first width and the second fin having a second width; forming a first capping layer over the first fin; and forming a second capping layer over the second fin, the first capping layer having a first thickness, the second capping layer having a second thickness different from the first thickness.

Abstract: The invention refers to a diffusion plate and a backlight module having the diffusion plate. The diffusion plate comprises a plate-body and a plurality of pyramid-like structures arranged on a surface of the plate-body. Each pyramid-like structure has a bottom surface, a first convex portion and a second convex portion. The first convex portion and the second convex portion have different vertex angles, and therefore the pyramid-like structure can also be called as “pyramid-like structure with multiple vertex angles”. The pyramid-like structures with multiple vertex angles can increase the light splitting points, which can improve the light splitting effect of the diffusion plate. The light source of a single light-emitting diode can be divided into eight point-light sources (light splitting points) or more, which is double the number of light splitting points compared with the traditional pyramid structure with single vertex, and thus can greatly improve the light diffusion effect.

Abstract: According to an example, a display mount comprises a mount base to attach to a work surface, a body member having a first lateral side lateral to and wider than a second side, and a movable member to receive the body member. The movable member comprises a support element to attach to a display and a locking mechanism aligned with the second side of the body member and movable between an unlocked position in which the movable member is movable along a length of the body member and a locked position in which the locking mechanism fixes the movable member with respect to the body member.

Abstract: A docking station includes a network interface controller (NIC), a dock-side controller and a dock-side connector interface. The NIC is configured to transmit one or more management component transport protocol (MCTP) packets via a system management bus (SMbus). The dock-side controller is electrically coupled to the SMbus, and configured to encode the one or more MCTP packets to one or more vendor specific protocol (VSP) packets. The dock-side connector interface is electrically coupled to the dock-side controller, and configured to transmit the one or more VSP packets to an electrical device to control a basic input output system (BIOS) of the electrical device on the condition that the electrical device is connected to the docking station via the dock-side connector interface.

Abstract: An eyes measurement system, a method and a computer-readable medium are provided, including a client device with a measurement application and a cloud processing device, where the cloud processing device receives the subject's eye images uploaded by the measurement application. After pre-processing the eye images, the cloud processing device uses a prediction model to obtain the predicted eye measure of the subject such as an MRD1, an MRD2 and an LF, and presents the predicted eye measure of the MRD1, the MRD2 and the LF to the clinicians as a basis for diagnosis. Therefore, the eye images are taken without restricting to the places, and the prediction model is used to accurately obtain the subject's eye measure, thereby providing the clinicians with a clear basis for diagnosis.

Abstract: A docking station includes a network interface controller (NIC), a dock-side controller and a dock-side connector interface. The NIC is configured to transmit one or more management component transport protocol (MCTP) packets via a system management bus (SMbus). The dock-side controller is electrically coupled to the SMbus, and configured to encode the one or more MCTP packets to one or more vendor specific protocol (VSP) packets. The dock-side connector interface is electrically coupled to the dock-side controller, and configured to transmit the one or more VSP packets to an electrical device to control a basic input output system (BIOS) of the electrical device on the condition that the electrical device is connected to the docking station via the dock-side connector interface.

Abstract: A chip package is provided. The chip package includes a first chip including a carrier substrate and a device substrate thereon. A second chip is mounted on the device substrate. A portion of the device substrate extends outward from the edge of the second chip, so as to be exposed from the second chip. A conductive pad is between the device substrate and the second chip. A polymer protective layer conformally covers the second chip, the exposed portion of the device substrate, and the edge of the carrier substrate. A redistribution layer is disposed on the polymer protective layer and extends into a first opening that passes through the polymer protective layer and the second chip and exposes the conductive pad, so as to be electrically connected to the conductive pad.

Abstract: A method of mounting a self-adhesive substrate on an electronic device comprising steps of: (S01) providing a base for mounting at least one self-adhesive substrate thereon, wherein each self-adhesive substrate includes a copper circuit layer formed thereon, an insulated adhering layer adhered with the copper circuit layer and made of glue with thermal conductive powders, and a release layer attached with the insulated adhering layer; (S02) forming the at least one self-adhesive substrate on the base based on a profile or a circuit configuration of a fixing portion of an accommodating member of an electronic device; (S03) welding a plurality of electronic elements on the copper circuit layer of each self-adhesive substrate; (S04) removing each self-adhesive substrate; (S05) removing the release layer from each self-adhesive substrate to adhere each self-adhesive substrate on the fixing portion of the accommodating member of the electronic device.

Abstract: An omnidirectional LED lamp contains a holder. The holder includes an electrical connecting member couple with an external power supply; an accommodating connector having a LED driving module and plural orifices; plural lighting tubes inserted into the plural orifices, and each lighting tube having an opening; a plurality of self-adhesive substrates, each having a first circuit layer, a bending portion, and a second circuit layer electrically connected with the first circuit layer; plural first LED elements arranged on plural fixing plates and electrically connected with plural first circuit layers; plural second LED elements arranged on plural bending portions and electrically connected with plural second circuit layers; wherein the LED driving module controls the plural first LED elements and the plural second LED elements to illuminate lights; and a transparent lid covered on plural openings of the plural lighting tubes.

Abstract: A LED lighting tube contains: a body, an explosion-proof protecting film, a fixing member, a plurality of LED elements, and two caps. The body includes an outer wall and an inner wall, the explosion-proof protecting film covers the body, the fixing member includes at least one circuit layer electrically connected with two LED driving modules and an adhesive layer adhered with the inner wall of the body. The plurality of LED elements are arranged on the at least one circuit layer and are electrically connected with the two LED driving modules via the at least one circuit layer, the two caps are mounted on two ends of the body, and each cap has an electrical terminal set, wherein a first end of the electrical terminal set is electrically connected with an external power, and a second end of the electrical terminal set is electrically coupled with each LED driving module.

Abstract: An omnidirectional LED lamp contains a holder. The holder includes an electrical connecting member couple with an external power supply; an accommodating connector having a LED driving module and plural orifices; plural lighting tubes inserted into the plural orifices, and each lighting tube having an opening; a plurality of self-adhesive substrates, each having a first circuit layer, a bending portion, and a second circuit layer electrically connected with the first circuit layer; plural first LED elements arranged on plural fixing plates and electrically connected with plural first circuit layers; plural second LED elements arranged on plural bending portions and electrically connected with plural second circuit layers; wherein the LED driving module controls the plural first LED elements and the plural second LED elements to illuminate lights; and a transparent lid covered on plural openings of the plural lighting tubes.

Abstract: A method of mounting a self-adhesive substrate on an electronic device comprising steps of: (S01) providing a base for mounting at least one self-adhesive substrate thereon, wherein each self-adhesive substrate includes a copper circuit layer formed thereon, an insulated adhering layer adhered with the copper circuit layer and made of glue with thermal conductive powders, and a release layer attached with the insulated adhering layer; (S02) forming the at least one self-adhesive substrate on the base based on a profile or a circuit configuration of a fixing portion of an accommodating member of an electronic device; (S03) welding a plurality of electronic elements on the copper circuit layer of each self-adhesive substrate; (S04) removing each self-adhesive substrate; (S05) removing the release layer from each self-adhesive substrate to adhere each self-adhesive substrate on the fixing portion of the accommodating member of the electronic device.

Abstract: A LED lighting tube contains: a body, an explosion-proof protecting film, a fixing member, a plurality of LED elements, and two caps. The body includes an outer wall and an inner wall, the explosion-proof protecting film covers the body, the fixing member includes at least one circuit layer electrically connected with two LED driving modules and an adhesive layer adhered with the inner wall of the body. The plurality of LED elements are arranged on the at least one circuit layer and are electrically connected with the two LED driving modules via the at least one circuit layer, the two caps are mounted on two ends of the body, and each cap has an electrical terminal set, wherein a first end of the electrical terminal set is electrically connected with an external power, and a second end of the electrical terminal set is electrically coupled with each LED driving module.

Abstract: A semiconductor structure includes a substrate, a dam element, a first isolation layer, a second isolation layer, and a conductive layer. The substrate has a conductive pad, a trench, a sidewall, a first surface, and a second surface opposite to the first surface. The conductive pad is located on the second surface. The trench has a first opening at the first surface, and has a second opening at the second surface. The dam element is located on the second surface and covers the second opening. The dam element has a concave portion that is at the second opening. The first isolation layer is located on a portion of the sidewall. The second isolation layer is located on the first surface and the sidewall that is not covered by the first isolation layer, such that an interface is formed between the first and second isolation layers.

Abstract: A semiconductor structure includes a substrate, a dam element, a first isolation layer, a second isolation layer, and a conductive layer. The substrate has a conductive pad, a trench, a sidewall, a first surface, and a second surface opposite to the first surface. The conductive pad is located on the second surface. The trench has a first opening at the first surface, and has a second opening at the second surface. The dam element is located on the second surface and covers the second opening. The dam element has a concave portion that is at the second opening. The first isolation layer is located on a portion of the sidewall. The second isolation layer is located on the first surface and the sidewall that is not covered by the first isolation layer, such that an interface is formed between the first and second isolation layers.

Abstract: A semiconductor element includes: a transparent substrate; a stack structure formed on the transparent substrate and having a metal oxide layer partially exposed through sidewalls of the stack structure; a plurality of leads spacingly formed on the stack structure and extending to the sidewalls of the stack structure; an insulating film covering the exposed portions of the metal oxide layer; a metal film formed on the leads; and a solder mask layer disposed on the metal film, the stack structure and the insulating film. As such, the insulating film prevents short circuits from occurring between adjacent leads so as to improve the product yield.