Abstract: Trenches in which to form a back side isolation structure for an array of CMOS image sensors are formed by a cyclic process that allows the trenches to be kept narrow. Each cycle of the process includes etching to add a depth segment to the trenches and coating the depth segment with an etch-resistant coating. The following etch step will break through the etch-resistant coating at the bottom of the trench but the etch-resistant coating will remain in the upper part of the trench to limit lateral etching and substrate damage. The resulting trenches have a series of vertically spaced nodes. The process may result in a 10% increase in photodiode area and a 30-40% increase in full well capacity.

Abstract: A recharging cable is disclosed, applicable to a smart recharging environment capable of self-detection and self-diagnosis, comprising: a cable; a plug, coupled to the cable, and having at least a power line set, and at least a communication line set, the at least power line set having a power line and a ground line, and the at least communication line set providing real-time communication between the recharging cable and a charging control end and a charged end; an electronic chip, located at one of the cable and the plug, the electronic chip being able to detect real-time information of the material property and device property at the charged end to estimate a real-time impedance information of the cable, and in combination with a historic impedance changes of the cable, to estimate an impedance reflection point of the cable related to ageing.

Abstract: A signal processing system and a method thereof are disclosed, using a differential amplifier to extract sensed signals associated with headphone wear status generated by the diaphragm of a headphone and transmitted to a sense ADC for digitization. To exclude residual music signal in the extracted sensed signals for subsequent processing, a temporary memory is provided to match and synchronize a round-trip delay in the signal processing system. The round-trip delay is computed to adjust the depth and clock speed of a buffer/FIFO of the temporary memory to eliminate residual music signal in order to separate the sensed signal of the headphone unit diaphragm displacement and use the extracted sensed signal as a reference source for subsequent analysis and auto-control and/or signal compensation.

Abstract: A signal processing system and a method thereof are disclosed, using a differential amplifier to extract the sensed signals associated with the headphones wear status generated by the diaphragm of the headphone and push back to the sense ADC for digitization. Because the differential amplifier is non-ideal, certain residual music signal will exist. To exclude residual music signal for subsequent processing, a temporary memory is provided to match and synchronize the original playback signal retainment and the round-trip delay of external signal. The round-trip delay is computed to adjust the depth and clock speed of the buffer/FIFO of the temporary memory to, after synchronized with the total external propagation delay, eliminate residual music signal in a function block in order to separate the sense signal of the headphone driver unit diaphragm displacement and use the extracted sense signal for subsequent analysis and auto-control and/or signal compensation reference source.

Abstract: According to one embodiment of a system for measuring a load impedance, comprising: a switch module, a first reference impedance, a second reference impedance, and a control module, wherein the switch module connects the first reference impedance, the second reference impedance, and the load impedance, respectively; the control module connects the switch module; the control module connects the first reference impedance via controlling the switch module to obtain a first voltage value; the control module connects the second reference impedance via controlling the switch module to obtain a second voltage value; the control module connects the load impedance via controlling the switch module to obtain a load voltage value; and the control module calculates the measured value of the load impedance according to the first voltage value, the second voltage value, and the load voltage value.

Abstract: The invention provides a MEMS package including: a MEMS chip including a first surface, a second surface, a first cavity, and a sensing device, the sensing device defining a first end of the first cavity; a leadframe including a second cavity and being electrically connected to the first surface of the MEMS chip, the second cavity being adjacent to the sensing device of the MEMS chip; a conductive layer disposed on the second surface of the MEMS chip to define a second end of the first cavity and grounded via the leadframe that is electrically connected to the conductive layer so as to provide electromagnetic shielding to the MEMS chip; and an encapsulant covering the MEMS chip, the leadframe, and the conductive layer to define an shape of the MEMS package and allowing outer surfaces of the leadframe to emerge from the MEMS package.