Abstract: A system and method for monitoring a multi-vendor microwave network accesses a cell site router (CSR) to obtain IP addresses of radio units, establishes direct Secure Shell (SSH) connections to these units, and retrieves performance data from multiple vendors' equipment. The data is processed to generate unified performance metrics, stored in a cloud-based system, and presented via a web-based graphical user interface. The system compares metrics to predefined thresholds, generates alerts, and presents graphical trends. It detects integrity values of microwave links, identifies high-priority links, and alerts relevant teams. The system provides a vendor-agnostic technique that enables real-time monitoring, automated health checks, and customizable alerts across diverse network equipment.

Abstract: Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

Abstract: In one embodiment, a network security device configured to monitor a communication session between a first device and a second device generates a first empty acknowledgment packet specifying a first sequence number and sends the first empty acknowledgment packet to the first device. The network security device may thereafter determine that a response from the first device has not been received within a threshold amount of time and generate, at least partly in response, a second empty acknowledgment packet specifying a second sequence number. The network security device may send the second empty acknowledgment packet to the first device and receive, from the first device, a third empty acknowledgment packet specifying a third sequence number. The network security device may then store the third sequence number in association with the communication session between the first device and the second device.

Abstract: In one embodiment, a network security device configured to monitor a communication session between a first device and a second device generates a first empty acknowledgment packet specifying a first sequence number and sends the first empty acknowledgment packet to the first device. The network security device may thereafter determine that a response from the first device has not been received within a threshold amount of time and generate, at least partly in response, a second empty acknowledgment packet specifying a second sequence number. The network security device may send the second empty acknowledgment packet to the first device and receive, from the first device, a third empty acknowledgment packet specifying a third sequence number. The network security device may then store the third sequence number in association with the communication session between the first device and the second device.

Abstract: Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for the preparation of a variety of electronic devices, such as flip chip packages, stacked dies, hybrid memory cubes, through-silica via (TSV) devices, and the like. In certain embodiments of the invention, there are provided assemblies comprising a first article permanently adhered to a second article by a cured aliquot of a formulation as described herein. In certain embodiments of the invention, there are provided methods for adhesively attaching a first article to a second article. In certain embodiments of the present invention, there are provided methods for improving heat dissipation by electronic devices assembled employing thermally conductive, but electrically non-conductive adhesive.

Abstract: Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

Abstract: Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for the preparation of a variety of electronic devices, such as flip chip packages, stacked dies, hybrid memory cubes, through-silica via (TSV) devices, and the like. In certain embodiments of the invention, there are provided assemblies comprising a first article permanently adhered to a second article by a cured aliquot of a formulation as described herein. In certain embodiments of the invention, there are provided methods for adhesively attaching a first article to a second article. In certain embodiments of the present invention, there are provided methods for improving heat dissipation by electronic devices assembled employing thermally conductive, but electrically non-conductive adhesive.

Abstract: Method and system for providing detection of dead or failed network communication session connections (such as TCP or UDP) in a data network by an intermediary node in the data network coupled to the end nodes (such as the client terminal and the server terminal) are provided.