Patents by Inventor Hung Chen

Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11950016
    Abstract: The present invention provides a control method of a receiver. The control method includes the steps of: when the receiver enters a sleep/standby mode, continually detecting an auxiliary signal from an auxiliary channel to generate a detection result; and if the detection result indicates that the auxiliary signal has a preamble or a specific pattern, generating a wake-up control signal to wake up the receiver before successfully receiving the auxiliary signal having a wake-up command.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: April 2, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chun-Chia Chen, Chih-Hung Pan, Chia-Chi Liu, Shun-Fang Liu, Meng-Kun Li, Chao-An Chen
  • Patent number: 11947914
    Abstract: In embodiments of the present disclosure, there is provided an approach for fact checking based on semantic graphs. According to embodiments of the present disclosure, after obtaining a text to be fact checked, a plurality of evidence sentences related to the text are retrieved from an evidence database. Then, semantic graphs of the text and the evidence sentences are constructed based on the semantic analysis, and a veracity of a statement in the text can be determined based on the semantic graphs. Embodiments of the present disclosure propose a graph-based reasoning approach for fact checking, and use the constructed semantic graphs to facilitate verification of the truthfulness of the text, thereby improving the accuracy for fact checking.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 2, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Duyu Tang, Nan Duan, Ming Zhou, Jiun-Hung Chen, Pengcheng Wang, Ying Qiao
  • Patent number: 11950513
    Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first metal interconnection and a second metal interconnection in the first IMD layer; forming a channel layer on the first metal interconnection and the second metal interconnection; forming a magnetic tunneling junction (MTJ) stack on the channel layer; and removing the MTJ stack to form a MTJ.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: April 2, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Wei Chen, Po-Kai Hsu, Yu-Ping Wang, Hung-Yueh Chen
  • Publication number: 20240102561
    Abstract: A proportional valve includes a casing and a valve trim. The casing has at least one fluid inlet, a fluid outlet, at least one first connection passageway, at least one second connection passageway and an accommodating space. The first connection passageway is connected with the fluid inlet. The second connection passageway is connected with the fluid outlet. The valve trim is located in the accommodating space, including a flow splitter an adjusting rotor. The flow splitter has at least one third connection passageway and at least one fourth connection passageway. The third connection passageway is connected with the first connection passageway. The fourth connection passageway is connected with the second connection passageway. The adjusting rotor has a channel and at least one blocking portion. The adjusting rotor is rotatably disposed on the flow splitter so that the blocking portion blocks a part of the third connection passageway.
    Type: Application
    Filed: November 3, 2022
    Publication date: March 28, 2024
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chiu Yu YEH, Wen-Hsien LIN, Wen-Hung CHEN
  • Publication number: 20240103378
    Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Tai-Yu CHEN, Tzu-Jung PAN, Kuan-Hung CHEN, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
  • Publication number: 20240105530
    Abstract: In an embodiment, a device includes: an integrated circuit package including: a package component; and a package stiffener attached to the package component; and a heat spreader attached to the integrated circuit package, a main portion of the heat spreader disposed above the package stiffener, a protruding portion of the heat spreader extending through the package stiffener; an elastic adhesive material between the main portion of the heat spreader and the package stiffener; and a thermal interface material between the protruding portion of the heat spreader and the package component, the thermal interface material different from the elastic adhesive material.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 28, 2024
    Inventors: Wensen Hung, Tsung-Yu Chen
  • Publication number: 20240105644
    Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 28, 2024
    Inventors: Tsung-Hao YEH, Chien Hung LIU, Hsien Jung CHEN, Hsin Heng WANG, Kuo-Ching HUANG
  • Publication number: 20240107087
    Abstract: The subject application relates to a server, terminal and non-transitory computer-readable medium. The server for handling streaming data for a live streaming, comprising one or a plurality of processors, wherein the one or plurality of processors execute a machine-readable instruction to perform: recording the streaming data for the live streaming; storing the streaming data as archive contents with first identifier; receiving interaction information during the live streaming; storing the interaction information as contexts with second identifier, transmitting the archive contents with first identifier to a first user terminal; and transmitting the contexts to the first user terminal according to the first identifier and the second identifier. According to the subject application, the archive contents may be more immersive and the user experience may be enhanced.
    Type: Application
    Filed: June 26, 2023
    Publication date: March 28, 2024
    Inventors: Yu-Chuan CHANG, Kun-Ze LI, Che-Wei LIU, Chieh-Min CHEN, Kuan-Hung LIU
  • Publication number: 20240103752
    Abstract: Disclosed is a system comprising a memory device and a processing device, operatively coupled with the memory device, to perform operations including identifying a group of memory cells corresponding to a first range of logical block addresses (LBAs). The operations performed by the processing device further include receiving a memory access command with respect to the group of memory cells. The operations performed by the processing device further include responsive to determining that a data structure associated with the group of memory cells references a second range of LBAs, blocking the memory access command; responsive to determining that the first range of LBAs does not include each LBA of the second range of LBAs, performing, on the group of memory cells, a trim operation; and responsive to determining that the data structure indicates the completion of the trim operation, performing a memory access operation specified by the memory access command.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Inventors: Yueh-Hung Chen, Fangfang Zhu, Horia Simionescu, Chih-Kuo Kao, Jiangli Zhu
  • Publication number: 20240100656
    Abstract: A ratchet wrench has a force-applying arm and a working head connected to each other, the working head is formed with an insertion hole, the insertion hole is used for accommodating a driving member and a positioning member, the positioning member is injection-molded with plastic material, an external force is applied to the positioning member, the positioning member is deformed by the external force, so that the positioning member is assembled with the working head, and the driving member is positioned on the working head. Thereby, manufacturing cost is reduced, and components can be easily assembled.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Inventor: Hung-Chen Chen
  • Patent number: 11942993
    Abstract: An optical transmission device includes: a control module generate a control signal output which includes a slope adjust signal and a bias voltage offset adjust signal according to an input signal indicating a dispersion amount an electrical level adjust signal; a multi-level pulse amplitude modulator; and an asymmetrical optical modulator which is controlled by the slope adjust signal to be operated at one of a positive slope and a negative slope of a transfer function of the asymmetrical optical modulator itself, and is controlled by the bias voltage offset adjust signal of the control signal output to offset a bias voltage point of the asymmetrical optical modulator itself from a quadrature point of the transfer function, and modulates the multi-level pulse amplitude modulation signal to an optical signal to generate an optical modulate signal having a chirp.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: March 26, 2024
    Assignee: Molex, LLC
    Inventors: Kuen-Ting Tsai, Wei-Hung Chen, Zuon-Min Chuang, Yao-Wen Liang
  • Patent number: 11943935
    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
  • Patent number: 11940737
    Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
  • Patent number: 11938595
    Abstract: A flex head tool includes a first body and a second body and a. retaining device adapted to position the second body at various angular positions with respect to the first body. The retaining device includes a retainer and an actuator adapted to move the retainer in a first position and a second position. The retainer and the actuator respectively have a first interacting structure and a second interacting structure abutting each other. The second interacting structure has a first and a second position at which the first interacting structure respectively abuts when the actuator is at a first position and a second position. The first and the second positions of the second interacting structure are at different distances from the end of the actuator.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: March 26, 2024
    Assignee: INFAR INDUSTRIAL CO., LTD.
    Inventor: Tai Hung Chen
  • Patent number: 11942385
    Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: March 26, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sheng-Yu Chen, Chang-Lin Yeh, Ming-Hung Chen
  • Patent number: 11943807
    Abstract: Wireless communication devices are adapted to facilitate a random access procedure. According to one example, scheduled entity can transmit a first transmission that is received by a scheduling entity. The first transmission may include a physical random access channel (PRACH) preamble sequence and a first message including information for determining a device-specific network identifier for the scheduled entity. The scheduling entity may transmit a second transmission that is received by the scheduled entity. The second transmission may include information on a physical downlink control channel (PDCCH) addressed to the device-specific network identifier for the scheduled entity, and a second message on a physical downlink shared channel (PDSCH). Other aspects, embodiments, and features are also included.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: March 26, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Renqiu Wang, Wanshi Chen, Hao Xu, Hung Dinh Ly, Heechoon Lee
  • Patent number: 11942546
    Abstract: A method includes forming an interfacial layer over a substrate; forming a quasi-antiferroelectric (QAFE) layer over the interfacial layer, in which forming the QAFE layer comprises performing an atomic layer deposition (ALD) cycle, and the ALD cycle includes performing a first sub-cycle for X time(s), in which the first sub-cycle comprises providing a Zr-containing precursor; performing a second sub-cycle for Y time(s), in which the second sub-cycle comprises providing a Hf-containing precursor; and performing a third sub-cycle for Z time(s), in which the third sub-cycle comprises providing a Zr-containing precursor, and in which X+Z is at least three times Y; and forming a gate electrode over the QAFE layer.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: March 26, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY, NATIONAL TAIWAN NORMAL UNIVERSITY
    Inventors: Kuan-Ting Chen, Shu-Tong Chang, Min-Hung Lee
  • Patent number: 11943715
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive, from a wireless network device (e.g., a base station or a transmission reception point (TRP) of the base station), a first control message comprising an indication of a set of energy saving modes of the wireless network device. The UE may receive a second control message indicating a first energy saving mode from the set of energy saving modes, where the first energy saving mode may be indicative of a number of channel state information (CSI) reference signal (CSI-RS) resources used by the wireless network device. The UE may monitor one or more of the CSI-RS resources for a CSI-RS in accordance with the first energy saving mode, and transmit, to the wireless network device, CSI feedback determined based on measurements made by the UE of the CSI-RS.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: March 26, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Muhammad Sayed Khairy Abdelghaffar, Wanshi Chen, Peter Gaal, Gokul Sridharan, Hung Dinh Ly
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240097323
    Abstract: In some examples, a device can include an antenna to emit waves in a radiation pattern having a first beamwidth, a directional radiation control device located in a path of the waves, where the directional radiation control device is to receive the waves from the antenna and is shaped to cause the waves to be directed in a different radiation pattern having a second beamwidth that is larger than the first beamwidth.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Inventors: Chin-Hung Ma, Pai-Cheng Huang, Po Chao Chen, Shih-Huang Wu