Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: A semiconductor package includes a first semiconductor substrate, an array of conductive bumps, a second semiconductor substrate, and a spacing pattern. The first semiconductor substrate includes a pad region and an array of first pads disposed within the pad region. The array of conductive bumps is disposed on the array of first pads respectively. The second semiconductor substrate is disposed over the first semiconductor substrate and includes an array of second pads bonded to the array of conductive bumps respectively. The spacing pattern is disposed between the first semiconductor substrate and the second semiconductor substrate, wherein the spacing pattern is located at a periphery of the pad region.

Abstract: A semiconductor chip includes a physical layer and a processing circuit. The physical layer includes an input/output circuit, at least one sequence checking circuit and at least one signal transmission path, wherein the at least one sequence checking circuit is configured to generate at least one test result signal according to a clock signal transmitted through the input/output circuit and at least one test data signal transmitted through the at least one signal transmission path. The processing circuit is electrically coupled to the physical layer and is configured to determine an operation status of the at least one signal transmission path according to a voltage level of the at least one test result signal.

Abstract: A vacuum processing apparatus (110) for deposition of a material on a substrate is provided. The vacuum processing apparatus (110) includes a vacuum chamber comprising a processing area (111); a deposition apparatus (112) within the processing area (111) of the vacuum chamber; a cooling surface (113) inside the vacuum chamber; and one or more movable shields (220) between the cooling surface (113) and the processing area (111).

Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.

Abstract: In one embodiment, a static random access memory (SRAM) device is provided. The SRAM device includes a memory cell, a bit line couple to the memory cell, a voltage supply line coupled to the memory cell, a control circuitry. The control circuitry is configured to charge a voltage supply line while the voltage supply line is electrically isolated from a bit line. A portion of the charge is transferred from the voltage supply line to the bit line. The voltage supply line is recharged while the voltage supply line is electrically isolated from the bit line storing the transferred portion of the charge. The memory cell is accessed using the recharge on the voltage supply line.

Abstract: An interface device and a signal transceiving method thereof are provided. The interface device includes a slave circuit and a master circuit. The slave circuit is coupled to the master circuit and includes a first programmable delay line, a first output clock generator, and a first phase detector. The first programmable delay line provides a first adjusting delay amount according to a first adjust signal, and generates a first delayed clock signal by delaying a first clock signal according to the first adjusting delay amount. The first output clock generator generates a second clock signal according to the first delayed clock signal. The first phase detector detects a phase difference of the first clock signal and the second clock signal to generate first phase lead or lag information. The first adjust signal is generated according to the first phase lead or lag information.

Abstract: Semiconductor devices and methods of manufacturing are presented in which inner spacers for nanostructures are manufactured. In embodiments a dielectric material is deposited for the inner spacer and then treated. The treatment may add material and cause an expansion in volume in order to close any seams that can interfere with subsequent processes.

Abstract: A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.

Abstract: A backlight dimming method for backlighting an LCD panel having a variable refresh rate with an LED module, the variable refresh rate having a maximum refresh rate, the LED module having at least one LED sub-zone, the LED sub-zone including a plurality of LEDs, and the method including: using a controller to generate a secondary synchronizing signal having a frequency higher than the maximum refresh rate; and using the controller to update dimming values for the at least one LED sub-zone at one or more pulses of the secondary synchronizing signal with current dimming data after the controller has received the current dimming data from a scaler.

Abstract: Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.

Abstract: Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.

Abstract: A computation apparatus, a resource allocation method thereof and a communication system are provided. The communication system includes at least two computation apparatuses and an integration apparatus. The computation apparatuses transmit request contents, and each of the request contents is related to data computation. The integration apparatus integrates the request contents of the computation apparatuses into a computation demand, and broadcasts the computation demand. Each of the computation apparatuses obtains a resource allocation of all of the computation apparatuses according to the computation demand. Moreover, each of the computation apparatuses performs the data computation related to the request content according to a resource allocation of itself. In this way, a low-latency service is achieved, and reliability is improved.

Abstract: A communication device and a control method thereof are applied to a movable apparatus. The communication device includes a number of directional signal transceivers and a processor wherein aiming directions of the directional signal transceivers are different from on another. The processor is electrically connected to the directional signal transceivers, and configured to determine whether an intermediate communication device exists according to a wireless signal received by a part of the directional signal transceivers. When the intermediate communication device exists, the processor selects one of the directional signal transceivers for transmitting the apparatus information of the movable apparatus according to a position of the intermediate communication device.

Abstract: Portable electronic device and method for controlling the same are provided. The portable electronic device includes a user interactive touch panel and a controller. The touch panel displays a screen object and a virtual touchpad. When the virtual touchpad is dragged and dropped from a first location to a second location, the touchpad is moved and displayed on the second location accordingly. When contact gestures are implemented on the virtual touchpad, the screen object is manipulated according to the contact gestures.

Abstract: An electronic device capable of simplifying user operation includes a shell having an opening; a displaying device disposed on the opening; and at least one lateral touch panel, disposed on one or more lateral parts of the shell, for generating a touch control signal according to a gesture applied on the at least one lateral touch panel; wherein the one or more lateral parts are connected to a plane where the opening is located and the external surface thereof is not parallel to the plane, and the electronic device executes a predefined function according to the touch control signal.

Abstract: A power strip device includes a casing and a plurality of socket modules. The casing has a casing body and a plurality of aligned retaining parts formed in the casing body. The socket modules are disposed respectively in the retaining parts. Each of the socket modules has a main body and a socket unit that is formed in the main body. The main body of at least one of the socket modules is movable between a first position to be aligned with the main body of the rest of the socket modules, and a second position to be misaligned with the main body of the rest of the socket modules.

Abstract: A power strip device includes a casing and a plurality of socket modules. The casing has a casing body and a plurality of aligned retaining parts formed in the casing body. The socket modules are disposed respectively in the retaining parts. Each of the socket modules has a main body and a socket unit that is formed in the main body. The main body of at least one of the socket modules is movable between a first position to be aligned with the main body of the rest of the socket modules, and a second position to be misaligned with the main body of the rest of the socket modules.

Abstract: A fluid magnetizer having magnets that are arranged at the two sides of the route of the fluid. Two magnets are arranged on one side such that the N-pole of both magnets are faced toward each other and joined to form a N-magnetic packet, and two magnets are arranged at the other side such that the S-pole of both magnets are faced toward each other and joined to form a S-magnetic flux. Through the attraction caused by the opposite magnetism of the magnetic fluxes at the two sides, magnetic lines of forces having stronger strengths are generated and then linearly penetrated through the section of the fluid. Therefore, the fluid is fully magnetized when passing through the magnetizing segment, thereby increasing the magnetization efficiency of the fluid.

Abstract: The present invention comprises two magnets and two “T” shaped metal plate structures, magnets placed between the protruding sections of the metal plates, so that the said magnets fit into the indented space made by the two protruding sections, and, moreover, the poles of the two magnets are placed so that each pole faces a pole with the same magnetic pole, and the inner curved area of protruding sections of the metal plates is made to fit against the piping. Because each of the metal plates is fitted with magnets with differing magnetic poles, the magnetic field is able to more effectively penetrate the piping, so that when the liquid is flowing in a lengthwise motion through the area of the magnetizer, the effectiveness of the magnetization process is increased.