Patents by Inventor Hung Chi Chung

Hung Chi Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237228
    Abstract: An improved work function layer and a method of forming the same are disclosed. In an embodiment, the method includes forming a semiconductor fin extending from a substrate; depositing a dielectric layer over the semiconductor fin; depositing a first work function layer over the dielectric layer; and exposing the first work function layer to a metastable plasma of a first reaction gas, a metastable plasma of a generation gas, and a metastable plasma of a second reaction gas, the first reaction gas being different from the second reaction gas.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shao-Jyun Wu, Hung-Chi Wu, Chia-Ching Lee, Pin-Hsuan Yeh, Hung-Chin Chung, Hsien-Ming Lee, Chien-Hao Chen, Sheng-Liang Pan, Huan-Just Lin
  • Patent number: 12222754
    Abstract: A portable electronic device including a first body, a second body, and a light module is provided. The second body is pivotally connected to the first body. The light module is adjacent to the second body and is disposed on the first body. The light module includes a frame, a light guide plate, a light source, a patterned light guide film, and a light-transmitting cover plate. The frame is disposed on the first body. The light guide plate is disposed in the frame and has a light incident surface and a light emitting surface. The light source is disposed in the frame as corresponding to the light incident surface of the light guide plate. The patterned light guide film is detachably disposed on the light guide plate and covers the light emitting surface. The light-transmitting cover plate is detachably disposed on the frame and covers the patterned light guide film.
    Type: Grant
    Filed: November 20, 2023
    Date of Patent: February 11, 2025
    Assignee: Acer Incorporated
    Inventors: Hung-Chi Chen, Hsueh-Wei Chung, Pao-Ching Huang, Huei-Ting Chuang, Chao-Di Shen
  • Patent number: 11609148
    Abstract: A structural health monitoring system comprises a first set of sensors operable for coupling to a structure positioned under ground, the first set of sensors further configured to detect an impact upon the structure while the first set of sensors is positioned under the ground; a second set of sensors operable to be positioned on or proximate to a surface of the ground, the second set of sensors further configured to detect an audible event occurring at a distance from the second set of sensors and the structure; and a computer readable memory storing one or more audio signatures that may correspond to the audible event.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: March 21, 2023
    Assignee: ACELLENT TECHNOLOGIES, INC.
    Inventors: Hung Chi Chung, Franklin Li, Cas Cheung
  • Patent number: 10794867
    Abstract: A structural health monitoring apparatus is presented. According to an embodiment, the structural health monitoring apparatus comprises: a plurality of transducers configured for coupling to a structure, the structure comprising an outer structure surrounding and coupled to an inner structure, the transducers further configured for coupling to only the outer structure so as to transmit stress waves through the inner structure, and still further configured to receive the transmitted stress waves from the outer structure after they have passed through the inner structure; and an analyzer configured to detect damage within the inner structure according to the received transmitted stress waves from the outer structure.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: October 6, 2020
    Assignee: Acellent Technologies, Inc.
    Inventors: Hung Chi Chung, Mark Pappakostas, Irene J. Li
  • Publication number: 20180113049
    Abstract: A structural health monitoring system comprises a first set of sensors operable for coupling to a structure positioned under ground, the first set of sensors further configured to detect an impact upon the structure while the first set of sensors is positioned under the ground; a second set of sensors operable to be positioned on or proximate to a surface of the ground, the second set of sensors further configured to detect an audible event occurring at a distance from the second set of sensors and the structure; and a computer readable memory storing one or more audio signatures that may correspond to the audible event.
    Type: Application
    Filed: October 25, 2017
    Publication date: April 26, 2018
    Inventors: Hung Chi Chung, Franklin LI, Cas CHEUNG
  • Publication number: 20150346161
    Abstract: A structural health monitoring apparatus is presented. According to an embodiment, the structural health monitoring apparatus comprises: a plurality of transducers configured for coupling to a structure, the structure comprising an outer structure surrounding and coupled to an inner structure, the transducers further configured for coupling to only the outer structure so as to transmit stress waves through the inner structure, and still further configured to receive the transmitted stress waves from the outer structure after they have passed through the inner structure; and an analyzer configured to detect damage within the inner structure according to the received transmitted stress waves from the outer structure.
    Type: Application
    Filed: June 3, 2015
    Publication date: December 3, 2015
    Inventors: Hung Chi CHUNG, Mark PAPPAKOSTAS, Irene J. LI
  • Patent number: 8352201
    Abstract: A structural health monitoring system using ASICs for signal transmission, reception, and analysis. Incorporating structural health monitoring functionality into one or more ASICs provides a durable yet small, lightweight, low cost, and portable system that can be deployed and operated in field conditions. Such systems provide significant advantages, especially in applications such as armor structures.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: January 8, 2013
    Assignee: Acellent Technologies, Inc.
    Inventors: Xinlin Qing, Chang Zhang, Irene Li, Fu-kuo Chang, Hung Chi Chung
  • Publication number: 20120271563
    Abstract: A structural health monitoring system using ASICs for signal transmission, reception, and analysis. Incorporating structural health monitoring functionality into one or more ASICs provides a durable yet small, lightweight, low cost, and portable system that can be deployed and operated in field conditions. Such systems provide significant advantages, especially in applications such as armor structures.
    Type: Application
    Filed: February 9, 2012
    Publication date: October 25, 2012
    Inventors: Xinlin QING, Chang Zhang, Irene Li, Fu-kuo Chang, Hung Chi Chung
  • Patent number: 8265889
    Abstract: A structural health monitoring system using ASICs for signal transmission, reception, and analysis. Incorporating structural health monitoring functionality into one or more ASICs provides a durable yet small, lightweight, low cost, and portable system that can be deployed and operated in field conditions. Such systems provide significant advantages, especially in applications such as armor structures.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: September 11, 2012
    Assignee: Acellent Technologies, Inc.
    Inventors: Xinlin Qing, Chang Zhang, Irene Li, Fu-kuo Chang, Hung Chi Chung
  • Publication number: 20110035167
    Abstract: A structural health monitoring system using ASICs for signal transmission, reception, and analysis. Incorporating structural health monitoring functionality into one or more ASICs provides a durable yet small, lightweight, low cost, and portable system that can be deployed and operated in field conditions. Such systems provide significant advantages, especially in applications such as armor structures.
    Type: Application
    Filed: August 5, 2009
    Publication date: February 10, 2011
    Inventors: Xinlin QING, Chang Zhang, Irene Li, Fu-kuo Chang, Hung Chi Chung
  • Patent number: D1071935
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: April 22, 2025
    Assignee: Acer Incorporated
    Inventors: Cheng-Han Lin, Hsueh-Wei Chung, Hung-Chi Chen