Patents by Inventor Hung-Chi Kuo

Hung-Chi Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130043
    Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Yen TING, Pao-Nan LEE, Hung-Chun KUO, Jung Jui KANG, Chang Chi LEE
  • Patent number: 11942417
    Abstract: A device includes a sensor die having a sensing region at a top surface of the sensor die, an encapsulant at least laterally encapsulating the sensor die, a conductive via extending through the encapsulant, and a front-side redistribution structure on the encapsulant and on the top surface of the sensor die, wherein the front-side redistribution structure is connected to the conductive via and the sensor die, wherein an opening in the front-side redistribution structure exposes the sensing region of the sensor die, and wherein the front-side redistribution structure includes a first dielectric layer extending over the encapsulant and the top surface of the sensor die, a metallization pattern on the first dielectric layer, and a second dielectric layer extending over the metallization pattern and the first dielectric layer.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Chi Chu, Sih-Hao Liao, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo
  • Publication number: 20240088056
    Abstract: A method includes encapsulating a device die in an encapsulating material, forming a first dielectric layer over the device die and the encapsulating material, forming first redistribution lines extending into the first dielectric layer to electrically couple to the device die, forming an alignment mark over the first dielectric layer, wherein the alignment mark includes a plurality of elongated strips, forming a second dielectric layer over the first redistribution lines and the alignment mark, and forming second redistribution lines extending into the second dielectric layer to electrically couple to the first redistribution lines. The second redistribution lines are formed using the alignment mark for alignment.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Inventors: Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo
  • Patent number: 10742379
    Abstract: A method of uplink control information (UCI) transmission over physical uplink control channel (PUCCH) is proposed. The UCI may include different information and being transmitted using different PUCCH formats. Under certain scenarios, the coded UCI bitstream size may not be assigned to an integer number of modulated symbols. To eliminate unnecessary processing as well as to utilize every bit in a modulated resource element, it is proposed to adjust the UCI codeword size to be a multiple of PUCCH modulation order.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: August 11, 2020
    Assignee: MEDIATEK INC.
    Inventors: Wei-De Wu, Hung-Chi Kuo, Xiu-Sheng Li, Yuan-Hwui Chung
  • Publication number: 20190222387
    Abstract: A method of uplink control information (UCI) transmission over physical uplink control channel (PUCCH) is proposed. The UCI may include different information and being transmitted using different PUCCH formats. Under certain scenarios, the coded UCI bitstream size may not be assigned to an integer number of modulated symbols. To eliminate unnecessary processing as well as to utilize every bit in a modulated resource element, it is proposed to adjust the UCI codeword size to be a multiple of PUCCH modulation order.
    Type: Application
    Filed: January 9, 2019
    Publication date: July 18, 2019
    Inventors: Wei-De Wu, Hung-Chi Kuo, Xiu-Sheng Li, Yuan-Hwui Chung
  • Patent number: 9667456
    Abstract: Disclosed are a compressive sensing system based on a personalized basis and a method thereof; first a sensing end senses an original signal and transmits the original signal to a reconstruction end; the reconstruction end generates a personalized basis by means of a dictionary learning method; next, the sensing end is made to sample the original signal according to a sampling matrix to generate a compressed signal and transmit the compressed signal to the reconstruction end, so that the reconstruction end executes a compressive sensing reconstruction algorithm according to the personalized basis and the compressed signal to recover the compressed signal into the original signal, thereby achieving an effect of improving signal recovering quality and a compression ratio.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: May 30, 2017
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Yu-Min Lin, Yi Chen, Hung-Chi Kuo, An-Yeu Wu
  • Publication number: 20170041166
    Abstract: Disclosed are a compressive sensing system based on a personalized basis and a method thereof; first a sensing end senses an original signal and transmits the original signal to a reconstruction end; the reconstruction end generates a personalized basis by means of a dictionary learning method; next, the sensing end is made to sample the original signal according to a sampling matrix to generate a compressed signal and transmit the compressed signal to the reconstruction end, so that the reconstruction end executes a compressive sensing reconstruction algorithm according to the personalized basis and the compressed signal to recover the compressed signal into the original signal, thereby achieving an effect of improving signal recovering quality and a compression ratio.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 9, 2017
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Yu-Min LIN, Yi CHEN, Hung-Chi KUO, An-Yeu WU
  • Publication number: 20040107244
    Abstract: A scalable and intelligent network platform for distributed system has at least one application server and multiple connected endpoint machines, which is capable of supporting commonly used data formats and message exchange protocols. This network platform enables endpoint machines running on different operating systems and using different message exchange protocols to perform downloading or access network drives. The network platform also allows remote clients in different domain to log onto the application server cross platform to obtain a copy of the frequently used program software for downloading. The present invention provides a management model for computer resources in the Intranet environment with a highly flexible architecture.
    Type: Application
    Filed: December 2, 2002
    Publication date: June 3, 2004
    Inventors: Hung-Chi Kuo, Fong-Jung Kuo, Ming-Chang Kao, Chia-Ming Lee