Patents by Inventor Hung-Chi Su

Hung-Chi Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10442346
    Abstract: A lamp device includes a light source, a slide and a projection lens assembly. The light source generates an illumination beam, and the slide is disposed in a light path of the illumination beam. The slide has a profile image layer and a gradient layer, and the profile image layer and the gradient layer are disposed on two opposite sides of the slide. The profile image layer converts the illumination beam into profile image light without gradients, and the gradient layer converts the illumination beam into gradient light. The projection lens assembly receives and projects the gradient light and the profile image light.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: October 15, 2019
    Assignee: Young Optics Inc.
    Inventors: Wei-Hung Tsai, Ya-Ling Hsu, Hung-Chi Su
  • Publication number: 20190039509
    Abstract: A lamp device includes a light source, a slide and a projection lens assembly. The light source generates an illumination beam, and the slide is disposed in a light path of the illumination beam. The slide has a profile image layer and a gradient layer, and the profile image layer and the gradient layer are disposed on two opposite sides of the slide. The profile image layer converts the illumination beam into profile image light without gradients, and the gradient layer converts the illumination beam into gradient light. The projection lens assembly receives and projects the gradient light and the profile image light.
    Type: Application
    Filed: November 28, 2017
    Publication date: February 7, 2019
    Inventors: Wei-Hung TSAI, Ya-Ling HSU, Hung-Chi SU
  • Publication number: 20180142961
    Abstract: A heat dissipation element with a heat resistant mechanism is provided. The heat dissipation element is a heat pipe, a loop-type heat pipe or a vapor chamber. A heat resistant layer is properly formed on an inner side or an outer side of the heat dissipation element. Consequently, while the heat is transferred, the tactile temperature of the handheld electronic device is not influenced.
    Type: Application
    Filed: November 8, 2017
    Publication date: May 24, 2018
    Inventors: AN-CHIH WU, Hung-Chi Su, Chih-Wei Chen
  • Patent number: 7731029
    Abstract: A tray for loading substrates includes a base, an outer frame, plural lateral supporters and plural corner bumps. The base has an upper surface with one or more grooves. The outer frame is located around four edges of the upper surface to thereby form a first space, and has two oppositely arranged first cavities. The lateral supporters are arranged on the base at four edges defining the first space against the outer frame, have second cavities arranged on internal surfaces of the lateral supporters and corresponding to the grooves. The corner bumps are arranged at corners of the outer frame, and are adjacent to the lateral supporters, the base and the outer frame. The corner bumps each have buffer openings to prevent a loaded substrate from damage by collision with the corner bumps. A package box is also disclosed, which can save cost and space in carrying the trays.
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: June 8, 2010
    Assignee: AU Optronics Corp.
    Inventor: Hung-Chi Su
  • Publication number: 20080202980
    Abstract: A tray for loading substrates includes a base, an outer frame, plural lateral supporters and plural corner bumps. The base has an upper surface with one or more grooves. The outer frame is located around four edges of the upper surface to thereby form a first space, and has two oppositely arranged first cavities. The lateral supporters are arranged on the base at four edges defining the first space against the outer frame, have second cavities arranged on internal surfaces of the lateral supporters and corresponding to the grooves. The corner bumps are arranged at comers of the outer frame, and are adjacent to the lateral supporters, the base and the outer frame. The corner bumps each have buffer openings to prevent a loaded substrate from damage by collision with the corner bumps. A package box is also disclosed, which can save cost and space in carrying the trays.
    Type: Application
    Filed: August 16, 2007
    Publication date: August 28, 2008
    Applicant: AU Optronics Corp.
    Inventor: Hung-Chi Su