Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A lamp device includes a light source, a slide and a projection lens assembly. The light source generates an illumination beam, and the slide is disposed in a light path of the illumination beam. The slide has a profile image layer and a gradient layer, and the profile image layer and the gradient layer are disposed on two opposite sides of the slide. The profile image layer converts the illumination beam into profile image light without gradients, and the gradient layer converts the illumination beam into gradient light. The projection lens assembly receives and projects the gradient light and the profile image light.

Abstract: A lamp device includes a light source, a slide and a projection lens assembly. The light source generates an illumination beam, and the slide is disposed in a light path of the illumination beam. The slide has a profile image layer and a gradient layer, and the profile image layer and the gradient layer are disposed on two opposite sides of the slide. The profile image layer converts the illumination beam into profile image light without gradients, and the gradient layer converts the illumination beam into gradient light. The projection lens assembly receives and projects the gradient light and the profile image light.

Abstract: A heat dissipation element with a heat resistant mechanism is provided. The heat dissipation element is a heat pipe, a loop-type heat pipe or a vapor chamber. A heat resistant layer is properly formed on an inner side or an outer side of the heat dissipation element. Consequently, while the heat is transferred, the tactile temperature of the handheld electronic device is not influenced.

Abstract: A tray for loading substrates includes a base, an outer frame, plural lateral supporters and plural corner bumps. The base has an upper surface with one or more grooves. The outer frame is located around four edges of the upper surface to thereby form a first space, and has two oppositely arranged first cavities. The lateral supporters are arranged on the base at four edges defining the first space against the outer frame, have second cavities arranged on internal surfaces of the lateral supporters and corresponding to the grooves. The corner bumps are arranged at corners of the outer frame, and are adjacent to the lateral supporters, the base and the outer frame. The corner bumps each have buffer openings to prevent a loaded substrate from damage by collision with the corner bumps. A package box is also disclosed, which can save cost and space in carrying the trays.

Abstract: A tray for loading substrates includes a base, an outer frame, plural lateral supporters and plural corner bumps. The base has an upper surface with one or more grooves. The outer frame is located around four edges of the upper surface to thereby form a first space, and has two oppositely arranged first cavities. The lateral supporters are arranged on the base at four edges defining the first space against the outer frame, have second cavities arranged on internal surfaces of the lateral supporters and corresponding to the grooves. The corner bumps are arranged at comers of the outer frame, and are adjacent to the lateral supporters, the base and the outer frame. The corner bumps each have buffer openings to prevent a loaded substrate from damage by collision with the corner bumps. A package box is also disclosed, which can save cost and space in carrying the trays.