Abstract: A silicon photonic test plug-in module includes a carrier board, a floating moving device, a mating connector and an accommodating seat. The floating moving device is movably installed on the carrier board, the mating connector is floatingly installed in the floating moving device, and the accommodating seat is located adjacent to the carrier board to fix a silicon photonic device, and the mating connector is automatically aligned with a silicon photonic device connector of the silicon photonic device. In addition, a silicon photonic test equipment including the silicon photonic test plug-in module is also disclosed herein.

Abstract: A pressing module capable of multi-point force application and multi-point temperature control and a semiconductor packaging component testing device having the same are provided. The pressing module is capable of simultaneously applying a plurality of forces, which may be the same or different, to a plurality of chips on a semiconductor packaging component, and simultaneously producing same or different temperature control effects on the chips. The device utilizes a plurality of force-generating units to drive a plurality of pressing blocks to respectively apply forces to the chips on the semiconductor packaging component, and utilizes respective temperature regulating units on the pressing blocks to respectively heat or cool the chips.

Abstract: A semiconductor package and its fabrication method are disclosed. The fabrication method has the steps of: providing at least a lead frame having a plurality of terminal leads formed with flat portions and contacting portions, providing at least a circuit board having a plurality of electrical connection pads, mounting the contacting portions on and electrically connecting to the electrical connection pads, attaching and electrically connecting electronic elements to the circuit board, forming an encapsulant for encapsulating the lead frames and the electronic elements but uncovering the flat portions of the terminal leads, and cutting around the circuit board along a cutting path that crosses through each of the terminal leads so as to allow each of the terminal leads to be electrically independent, wherein the terminal leads are employed to act as the electrical terminals of USB memory cards for storing or retrieving data.

Abstract: A circuit card module and a method for fabricating the same are disclosed. The present invention includes the steps of providing a carrier having at least a first carrying region and a second carrying region that are co-planar; respectively mounting a substrate electrically connected to a first chip on the first carrying region, and a second chip electrically connected the substrate on the second carrying region, wherein the substrate is provided with at least an area of electrical connecting portion for being connected with external devices so as to reduce areas required for mounting a larger substrate or another substrate, thereby allowing a circuit card module to be fabricated with a minimized substrate.