Abstract: A throttle control method for a mobile device include collecting input data, generating a first set of user experience indices according to the input data, and checking whether a user experience index of the first set of user experience indices satisfies a UEI threshold. The input data includes common information data, current configuration data and a plurality of throttle control parameters. Each user experience index of the first set of user experience indices is corresponding to at least one of throttle control parameter of the plurality of throttle control parameters.

Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.

Abstract: A sample analyzing method and a sample preparing method are provided. The sample analyzing method includes a sample preparing step, a placing step, and an analyzing step. The sample preparing step includes an obtaining step implemented by obtaining an identification information; and a marking and placing step implemented by placing a sample carrying component having a sample disposed thereon into a marking equipment, allowing the marking equipment to utilize the identification information to form an identification structure on the sample carrying component, and placing the sample carrying component into one of the accommodating slots according to the identification information. The placing step is implemented by taking out the sample carrying component from one of the accommodating slots and placing the sample carrying component into an electron microscope equipment. The analyzing step is implemented by utilizing the electron microscope equipment to photograph the sample to generate an analyzation image.

Abstract: A method includes forming a first low-dimensional layer over an isolation layer, forming a first insulator over the first low-dimensional layer, forming a second low-dimensional layer over the first insulator, forming a second insulator over the second low-dimensional layer, and patterning the first low-dimensional layer, the first insulator, the second low-dimensional layer, and the second insulator into a protruding fin. Remaining portions of the first low-dimensional layer, the first insulator, the second low-dimensional layer, and the second insulator form a first low-dimensional strip, a first insulator strip, a second low-dimensional strip, and a second insulator strip, respectively. A transistor is then formed based on the protruding fin.

Abstract: An uninterruptible power apparatus is coupled between a power grid and a load. The uninterruptible power apparatus includes a bypass path, a power conversion module, and a control module. The bypass path is coupled to the power grid through a grid terminal, and coupled to the load through a load terminal. The control module turns off a first thyristor and a second thyristor by injecting a second voltage into the load terminal during a forced commutation period. The control module calculates a magnetic flux offset amount based on an error amount between the second voltage and a voltage command, and provides a compensation command in response to the magnetic flux offset amount. The control module controls the DC/AC conversion circuit to provide a third voltage to the load terminal based on the compensation command and the voltage command.

Abstract: A semiconductor device comprises a fin structure disposed over a substrate; a gate structure disposed over part of the fin structure; a source/drain structure, which includes part of the fin structure not covered by the gate structure; an interlayer dielectric layer formed over the fin structure, the gate structure, and the source/drain structure; a contact hole formed in the interlayer dielectric layer; and a contact material disposed in the contact hole. The fin structure extends in a first direction and includes an upper layer, wherein a part of the upper layer is exposed from an isolation insulating layer. The gate structure extends in a second direction perpendicular to the first direction. The contact material includes a silicon phosphide layer and a metal layer.

Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.

Abstract: An electronic device includes a host, a display, a sliding plate, and a keyboard. The host has an operating surface. The display is pivoted to the host. The sliding plate is slidably disposed in the host, where the display is mechanically coupled to the sliding plate, and the sliding plate includes a plat portion and a recess portion that are arranged side by side. The keyboard is integrated to the host. The keyboard includes a key structure, where the key structure includes a key cap and a reciprocating element, and the key cap is exposed from the operating surface of the host. The reciprocating element is disposed between the key cap and the sliding plate and has a first end connected to the key cap and a second end contacting the sliding plate. The second end is located on a sliding path of the plat portion and the recess portion.

Abstract: A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system comprises a valve box module, a controller, a purge gas source and at least one semiconductor manufacturing tool. The valve box module includes at least one stick and a first gas line in fluid communication with the at least one stick. Further, the first gas line includes a pneumatic valve and a pressure transmitter downstream of the pneumatic valve. The controller connects to the pneumatic valve and the pressure transmitter of the first gas line. The purge gas source is in fluid communication with the first gas line. The at least one semiconductor manufacturing tool is coupled to the at least one stick.

Abstract: The present invention provides a light projection structure, in which an auxiliary lamp device is disposed on one side of a main lamp device. The main lamp device projects a first light pattern and the auxiliary lamp device projects a second light pattern. The second light pattern includes a gap. The first light pattern projected by the main lamp device is projected onto the gap, so that the main lamp device and the auxiliary lamp device combined can broaden the light projection range, and hence producing more uniform light patterns as well as increasing the light illumination area.

Abstract: A process of manufacturing a heat resistant and low carbon plate for a circuit breaker includes preparing a heat resistant and low carbon plate for a circuit breaker; coating the heat resistant and low carbon plate with organic material; coating the organic material with inorganic material; and heating and drying the heat resistant and low carbon plate. The process continuously grips each of heat resistant and low carbon plates conveyed on a conveyor with a coat application device being used for the coating steps. A circuit breaker having the heat resistant and low carbon plate is also provided.

Abstract: A process of manufacturing a heat resistant and low carbon plate for a circuit breaker includes preparing a heat resistant and low carbon plate for a circuit breaker; coating the heat resistant and low carbon plate with organic material; coating the organic material with inorganic material; and heating and drying the heat resistant and low carbon plate. The process continuously grips each of heat resistant and low carbon plates conveyed on a conveyor with a coat application device being used for the coating steps. A circuit breaker having the heat resistant and low carbon plate is also provided.

Abstract: A magnetic windblown device has a housing, a windblown assembly, a magnetic assembly, a power assembly, a decoration, and at least one magnetic element. The windblown assembly and the magnetic assembly are mounted inside the housing. The power assembly is mounted in the housing and is electrically connected to the windblown assembly and the magnetic assembly. The decoration and the magnetic element are mounted in the housing. The windblown assembly generates airflow to make the decoration swing. The magnetic assembly changes the magnetic field to rotate and move the magnetic element. Office staff feels relaxed and inspired by watching the swinging decoration and the rotating/moving magnetic element.

Abstract: A high-power heat dissipation module for cooling down electronic components comprises a heat exchange element with a sealed cavity, in which a powder sintering portion and a working liquid is provided. The heat exchange element further has a flat section for mounting the electronic component, and a fixing structure. The heat dissipation module further comprises a heat sink with a central hole portion and a heat dissipation structure around the central hole portion. The heat generated by the electronic component is transferred to the heat sink by the heat exchange element, and then quickly dissipated into the air surrounding by the heat dissipation structure. The heat dissipation modules can handle the heat dissipation task for the electronic components with a power of 100 Watts or more and are suitable for cooling high-power electronic components.

Abstract: A hair trimming device has a first knife, a second knife, a first protective cover, a pair of movable plates, an elastic element and a second protective cover. The first protective cover covers the first knife and has a first comb installed at a front end of the first knife, and the pair of movable plates are linked with both external sides of the second knife and the first knife, and the second protective cover is installed at a front end of the pair of movable plates, and a second comb is disposed between the first comb and the cutting blade, such that the movable plate is linked to the second comb. When use, hairs of different lengths are bent and fixed and then cut to achieve layered hair styling without any discomfort caused by tearing the hair.

Abstract: The invention discloses an LED projection lamp, which comprises a heat sink, a lamp cup, an LED module, a lens, a first heat conduction component, a fastening device and a second heat conduction component, wherein the heat sink is cylindrical and provided with a trumpet-shaped inner cavity on the front and a cylindrical inner cavity at the rear; the lamp cup is arranged inside the trumpet-shaped inner cavity; the LED module is disposed on a small opening portion of the lamp cup; the lens is used by the LED module for light transmission; the first heat conduction component comprises a plurality of U-shaped first heat pipes; the fastening device is sleeved at the rear end of the cylindrical inner cavity; the second heat conduction component comprises a plurality of U-shaped second heat pipes.

Abstract: The invention discloses a replaceable LED street lamp module, including at least one module portion and a clamping sheet set. The module portion includes an LED module, a lens, an inner radiator, an outer radiator and a heat pipe set, the inner radiator and the outer radiator are sleeved with each other, the heat pipe set is bent and located between the inner radiator and the outer radiator and supports and fixes the LED module, the lens protects the LED module and allows light to be emitted from the LED module, notches are arranged on the outer circle of the outer radiator, and the clamping sheet set is clamped in the notch via two clamping sheets in order to clamp and fix the module portion, thereby being assembled on the opening of the street lamp housing.

Abstract: A LED projection lamp includes a heat sink, a lamp cup, an LED module, a lens, a first heat conduction component, a fastening device and a second heat conduction component. The heat sink is cylindrical and provided with a trumpet-shaped inner cavity on the front and a cylindrical inner cavity at the rear. The lamp cup is arranged inside the trumpet-shaped inner cavity and the LED module is disposed on a small opening portion of the lamp cup. The lens is used by the LED module for light transmission, the first heat conduction component includes a first vapor chamber, the fastening device is sleeved at the rear end of the cylindrical inner cavity, and the second heat conduction component includes a second vapor chamber.

Abstract: A hair trimming device has a first knife, a second knife, a first protective cover, a pair of movable plates, an elastic element and a second protective cover. The first protective cover covers the first knife and has a first comb installed at a front end of the first knife, and the pair of movable plates are linked with both external sides of the second knife and the first knife, and the second protective cover is installed at a front end of the pair of movable plates, and a second comb is disposed between the first comb and the cutting blade, such that the movable plate is linked to the second comb. When use, hairs of different lengths are bent and fixed and then cut to achieve layered hair styling without any discomfort caused by tearing the hair.

Abstract: The invention discloses an LED lighting fixture, which comprises a heat sink, a reflection cup, an LED module, a supporting member, a heat pipe and a vapor chamber, wherein the heat sink is provided with a center hole section and radiating sections; a concave opening is formed at the front end by the surrounding of the radiating section; the reflection cup is arranged at the concave opening; the outside of the reflection cup is surrounded by the heat pipe and makes contact with the radiating section; the LED module is arranged at the bottom of the reflection cup; the supporting member makes contact with the LED module and is arranged at the tail end of the heat pipe; and the vapor chamber is provided with a smoothing section for receiving the LED module and interposing sections for being interposed into the center hole section of the heat sink.