Patents by Inventor Hung-Chih LEE
Hung-Chih LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Package structure comprising buffer layer for reducing thermal stress and method of forming the same
Patent number: 11961777Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.Type: GrantFiled: June 27, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao -
Patent number: 11936238Abstract: An uninterruptible power apparatus is coupled between a power grid and a load. The uninterruptible power apparatus includes a bypass path, a power conversion module, and a control module. The bypass path is coupled to the power grid through a grid terminal, and coupled to the load through a load terminal. The control module turns off a first thyristor and a second thyristor by injecting a second voltage into the load terminal during a forced commutation period. The control module calculates a magnetic flux offset amount based on an error amount between the second voltage and a voltage command, and provides a compensation command in response to the magnetic flux offset amount. The control module controls the DC/AC conversion circuit to provide a third voltage to the load terminal based on the compensation command and the voltage command.Type: GrantFiled: June 15, 2022Date of Patent: March 19, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Hsin-Chih Chen, Hung-Chieh Lin, Chao-Lung Kuo, Yi-Ping Hsieh, Chien-Shien Lee
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Patent number: 11930573Abstract: A power supply device is provided. The power supply device includes a power converter and a controller. The controller controls the power converter to generate an output power. The controller includes a first detection circuit and a second detection circuit. The first detection circuit detects the output power to obtain a first detection result. The first detection result is a variation of an output current value of the output power. The second detection circuit detects electrical characteristics other than the output current value to obtain a second detection result. The controller determines whether to limit output of the output power according to a relationship between the first detection result and the second detection result.Type: GrantFiled: October 5, 2022Date of Patent: March 12, 2024Assignee: Power Forest Technology CorporationInventors: Rong-Jie Tu, Hung-Chih Chiu, Chien-Lung Lee
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Patent number: 11928416Abstract: A method of process technology assessment is provided. The method includes: defining a scope of the process technology assessment, the scope comprising an original process technology and a first process technology; modeling a first object in an integrated circuit into a resistance domain and a capacitance domain; generating a first resistance scaling factor and a first capacitance scaling factor based on the modeling, the original process technology, and the first process technology; and utilizing, by an electronic design automation (EDA) tool, the first resistance scaling factor and the first capacitance scaling factor for simulation of the integrated circuit.Type: GrantFiled: March 1, 2023Date of Patent: March 12, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hung-Chih Ou, Kuo-Fu Lee, Wen-Hao Chen, Keh-Jeng Chang, Hsiang-Ho Chang
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Patent number: 11553096Abstract: A flip-cover multifunctional image forming device includes a lower body, a first image forming module, a cover body, at least one pivoting mechanism, an upper body and a second image forming module. The first image forming module is disposed inside the lower body. The at least one pivoting mechanism is connected to the lower body and the cover body and for pivoting the cover body relative to the lower body between a folded position and an unfolded position. The upper body is detachably disposed on a side of the cover body away from the lower body. The upper body is driven by the cover body to move relative to the lower body when the cover body pivots relative to the lower body. The second image forming module is disposed inside the upper body. The present invention has advantages of simple structure, easy operation and flexibility in use.Type: GrantFiled: September 23, 2021Date of Patent: January 10, 2023Assignee: AVISION INC.Inventors: Min-Hao Chang, Hung-Chih Lee, Chao-Yu Peng
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Patent number: 11476199Abstract: A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.Type: GrantFiled: March 14, 2021Date of Patent: October 18, 2022Assignee: Unimicron Technology Corp.Inventors: Yi Lin, Chun-Ming Chiu, Hung-Chih Lee, Chang-Fu Chen
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Publication number: 20220159136Abstract: A flip-cover multifunctional image forming device includes a lower body, a first image forming module, a cover body, at least one pivoting mechanism, an upper body and a second image forming module. The first image forming module is disposed inside the lower body. The at least one pivoting mechanism is connected to the lower body and the cover body and for pivoting the cover body relative to the lower body between a folded position and an unfolded position. The upper body is detachably disposed on a side of the cover body away from the lower body. The upper body is driven by the cover body to move relative to the lower body when the cover body pivots relative to the lower body. The second image forming module is disposed inside the upper body. The present invention has advantages of simple structure, easy operation and flexibility in use.Type: ApplicationFiled: September 23, 2021Publication date: May 19, 2022Applicant: AVISION INC.Inventors: Min-Hao Chang, Hung-Chih Lee, Chao-Yu Peng
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Publication number: 20210202394Abstract: A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.Type: ApplicationFiled: March 14, 2021Publication date: July 1, 2021Inventors: Yi LIN, Chun-Ming CHIU, Hung-Chih LEE, Chang-Fu CHEN
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Patent number: 10978401Abstract: A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.Type: GrantFiled: June 6, 2018Date of Patent: April 13, 2021Assignee: Unimicron Technology Corp.Inventors: Yi Lin, Chun-Ming Chiu, Hung-Chih Lee, Chang-Fu Chen
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Publication number: 20190279936Abstract: A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.Type: ApplicationFiled: June 6, 2018Publication date: September 12, 2019Inventors: Yi LIN, Chun-Ming CHIU, Hung-Chih LEE, Chang-Fu CHEN