Abstract: The present disclosure, in some embodiments, relates an integrated chip. The integrated chip includes a substrate. A through-substrate-via (TSV) extends through the substrate. A dielectric liner separates the TSV from the substrate. The dielectric liner is along one or more sidewalls of the substrate. The TSV includes a horizontally extending surface and a protrusion extending outward from the horizontally extending surface. The TSV has a maximum width along the horizontally extending surface.

Abstract: This invention is related to a new heat spreading packaging design and the constituting method, especially mounting a heat spreader into an electronic device, so that it can reduce the internal temperature of device and make uniform surface temperature effectively.

Abstract: An electrical connector which has improved durability is provided. The housing of the connector has a first surface mounted on a mother board and a second surface on which a daughter board is mounted and which is disposed opposed to the first surface. On both ends of the first surface mounting legs are provided for receiving an edge of the mother board. On both ends of the second surface latch members for holding the daughter board and stoppers slightly spaced from the latch members are provided. When the daughter board is mounted on the connector, the latch members are prevented from being flexed excessively due to the contact of the latch members with the stop members. The daughter board and the connector are arranged in series and connected to each other such that the height of the assembly of the daughter board and the connector is lowered.