Abstract: In a semiconductor manufacturing method, a mask is disposed on a semiconductor layer or semiconductor substrate. The semiconductor layer or semiconductor substrate is etched in an area delineated by the mask to form a cavity. With the mask disposed on the semiconductor layer or semiconductor substrate, the cavity is lined to form a containment structure. With the mask disposed on the semiconductor layer or semiconductor substrate, the containment structure is filled with a base semiconductor material. After filling the containment structure with the base semiconductor material, the mask is removed. At least one semiconductor device is fabricated in and/or on the base semiconductor material deposited in the containment structure.

Abstract: A method includes: forming a first conductive structure in a first dielectric layer; forming a conductive protection structure that is coupled to at least part of the first conductive structure; forming a second dielectric layer over the first dielectric layer; forming a via hole extending through at least part of the second dielectric layer to expose a portion of the conductive protection structure; cleaning the via hole; and refilling the via hole with a conductive material to form a via structure.

Abstract: A semiconductor device includes: a metal thin film disposed on a semiconductor substrate; and first and second contact structures disposed on the metal thin film, wherein the first and second contact structures are laterally spaced from each other by a dummy layer that comprises at least one polishing resistance material.

Abstract: A method for storing positions of tires and a system for the same are disclosed. The method includes inputting information for a tire by a hand held tool. Transmitting the information for the tire and a storing position of the tire to a remote server, and generating an index information including the storing position of the tire by the remote server. Accordingly, the storing position of the tire can be conveniently inquired, such that the time-consuming of changing the tires of vehicle can be effectively reduced.

Abstract: A vehicle message managing method includes: providing an operation message of a tire through a tire sensor; receiving the operation message through the tire sensor setting tool, or receiving at least one outer message through the tire sensor setting tool; transmitting at least one of the operation message and the outer message to a remote server; storing and analyzing at least one of the operation message and the outer message and generating an analyzing result.

Abstract: In a semiconductor manufacturing method, a mask is disposed on a semiconductor layer or semiconductor substrate. The semiconductor layer or semiconductor substrate is etched in an area delineated by the mask to form a cavity. With the mask disposed on the semiconductor layer or semiconductor substrate, the cavity is lined to form a containment structure. With the mask disposed on the semiconductor layer or semiconductor substrate, the containment structure is filled with a base semiconductor material. After filling the containment structure with the base semiconductor material, the mask is removed. At least one semiconductor device is fabricated in and/or on the base semiconductor material deposited in the containment structure.

Abstract: A semiconductor device includes: a plurality of vertical conductive structures, wherein each of the plurality of vertical conductive structures extends through an isolation layer; and an insulated extension disposed horizontally between a first one and a second one of the plurality of vertical conductive structures.

Abstract: A method includes: forming a first conductive structure in a first dielectric layer; forming a conductive protection structure that is coupled to at least part of the first conductive structure; forming a second dielectric layer over the first dielectric layer; forming a via hole extending through at least part of the second dielectric layer to expose a portion of the conductive protection structure; cleaning the via hole; and refilling the via hole with a conductive material to form a via structure.

Abstract: A semiconductor device includes: a metal thin film disposed on a semiconductor substrate; and first and second contact structures disposed on the metal thin film, wherein the first and second contact structures are laterally spaced from each other by a dummy layer that comprises at least one polishing resistance material.

Abstract: In a semiconductor manufacturing method, a mask is disposed on a semiconductor layer or semiconductor substrate. The semiconductor layer or semiconductor substrate is etched in an area delineated by the mask to form a cavity. With the mask disposed on the semiconductor layer or semiconductor substrate, the cavity is lined to form a containment structure. With the mask disposed on the semiconductor layer or semiconductor substrate, the containment structure is filled with a base semiconductor material. After filling the containment structure with the base semiconductor material, the mask is removed. At least one semiconductor device is fabricated in and/or on the base semiconductor material deposited in the containment structure.

Abstract: A semiconductor device includes: a plurality of vertical conductive structures, wherein each of the plurality of vertical conductive structures extends through an isolation layer; and an insulated extension disposed horizontally between a first one and a second one of the plurality of vertical conductive structures.

Abstract: A system includes detecting devices secured respectively on wheels of a vehicle at different angular positions, sensors assigned respectively to the wheels and a control unit. Each detecting device emits a detecting signal when disposed at a first position and a second position different from the first position by a first angle. The first position where each detecting device emits the detecting signal during a current rotation cycle of the respective wheel differs from that during a next rotation cycle of the respective wheel by a second angle. The control device analyzes the detecting signals and tooth number signals from the sensors to associate the detecting devices respectively with the sensors.

Abstract: A semiconductor device includes: a plurality of vertical conductive structures, wherein each of the plurality of vertical conductive structures extends through an isolation layer; and an insulated extension disposed horizontally between a first one and a second one of the plurality of vertical conductive structures.

Abstract: The present disclosure discloses a burning tool of a tire pressure sensor includes a carrier having at least one USB connector, an IC module and a transmission port. The USB connector is capable of externally matching a tire pressure sensor. The IC module includes a memory unit and a processing unit. The memory unit stores at least one communication protocol relative to a vehicle model. The processing unit is electrically connected to the memory unit and the USB connector, while the USB connector is in connection with the tire pressure sensor, the processing unit reads the communication protocol stored in the memory unit, and thereafter burns it into the tire pressure sensor. The transmission port is electrically connected with the IC module and capable of connecting with an external device, thus the IC module is controllable by the external device to burn the communication protocol aforesaid.

Abstract: A semiconductor device includes: a metal thin film disposed on a semiconductor substrate; and first and second contact structures disposed on the metal thin film, wherein the first and second contact structures are laterally spaced from each other by a dummy layer that comprises at least one polishing resistance material.

Abstract: A method includes: forming a first conductive structure in a first dielectric layer; forming a conductive protection structure that is coupled to at least part of the first conductive structure; forming a second dielectric layer over the first dielectric layer; forming a via hole extending through at least part of the second dielectric layer to expose a portion of the conductive protection structure; cleaning the via hole; and refilling the via hole with a conductive material to form a via structure.

Abstract: A method includes: forming a first conductive structure in a first dielectric layer; forming a conductive protection structure that is coupled to at least part of the first conductive structure; forming a second dielectric layer over the first dielectric layer; forming a via hole extending through at least part of the second dielectric layer to expose a portion of the conductive protection structure; cleaning the via hole; and refilling the via hole with a conductive material to form a via structure.

Abstract: A semiconductor device includes: a metal thin film disposed on a semiconductor substrate; and first and second contact structures disposed on the metal thin film, wherein the first and second contact structures are laterally spaced from each other by a dummy layer that comprises at least one polishing resistance material.

Abstract: A virtual reality system having adaptive controlling function and a controlling method thereof. The controlling method of a virtual reality system includes the following steps: A sensing signal is obtained by a head-mounted display device. A procedure of transmitting a virtual reality content to the head-mounted display device is adaptively controlled by a host according to the sensing signal.

Abstract: A virtual reality system having adaptive controlling function and a controlling method thereof. The controlling method of a virtual reality system includes the following steps: A sensing signal is obtained by a head-mounted display device. A procedure of transmitting a virtual reality content to the head-mounted display device is adaptively controlled by a host according to the sensing signal.