Abstract: A single-wire multi-device cascade addressing system is provided. In the multi-device cascade addressing system, a plurality of devices are arranged sequentially and connected in series with each other, and a first device and a final device among the plurality of devices are connected to a controller. The first device addresses itself according to an addressing command packet having an individual device identification address from the controller and outputs the adjusted addressing command packet to the next device. Each of the plurality of devices except for the first device addresses itself according to the addressing command packet from the previous device. Each of the plurality of devices except for the first and final devices adjusts the addressing command packet from the previous device, and outputs the adjusted addressing command packet to the next device. The final device transmits the addressing command packet from the previous device to the controller.

Abstract: A multi-fan control system is provided. A controller, within each of a plurality of time intervals, outputs a control signal including a reading command to one of a plurality of fans, and outputs a control signal including a writing command to another of the plurality of fans. The controller, within each of the plurality of time intervals, only reads operation state data of the one of the plurality of fans that receives the control signal including the reading command, and writes operation control commands respectively into the plurality of fans.

Abstract: Precise analysis and description of movement and gestures by a human or other object are carried out by a computing device assisted by camera and distance sensors. The same gestures and movements of an object in different locations and in different orientations may be identified according to coordinates and offsets applied to coordinates, and gesture-making areas projected so as to surround the object. The techniques can accurately identify actions of movements of the human or other object.

Abstract: Precise analysis and description of movement and gestures by a human or other object are carried out by a computing device assisted by camera and distance sensors. The same gestures and movements of an object in different locations and in different orientations may be identified according to coordinates and offsets applied to coordinates, and gesture-making areas projected so as to surround the object. The techniques can accurately identify actions of movements of the human or other object.

Abstract: A method for logging into a number of applications of an electronic device includes obtaining a login facial image of a user when the user opens a first application of the number of applications, determining whether the login facial image matches a preset facial image stored in the electronic device, and logging into the first application when the login facial image matches the preset facial image. The preset facial image is linked to each of the number of applications. The electronic device automatically logs into the rest of the applications when the rest of the applications are opened, after the login facial image matches the preset facial image to log into the first application.

Abstract: Equipment for making IC shielding coating layer and a metal shielding layer of IC. The equipment comprises a base, a work support, a plurality of medium frequency magnetron targets and a plurality of multi-arc ion targets. The base comprises a chamber. The work support is disposed in the chamber and movably connected with a plurality of rotation axes. Each rotation axes comprises at least one fixture. The fixture is used to put at least one IC. Each medium frequency magnetron target and each multi-arc ion target are disposed in the chamber. The medium frequency magnetron targets and the multi-arc ion targets are used to sputter a metal material over the IC to form at least one metal shielding layer on a surface of the IC.

Abstract: A method for manufacturing shielding which uses multiple vacuum sputtering methods to produce shielding on single IC chip. The method comprises the following steps: using covering fixtures to cover a plurality of IC chips and fixing these IC chips on a work support; vacuumizing the chamber to a pretreatment vacuum level; keeping pumping an ionizable gas into the chamber and performing ion bombardment on the material for IC packaging on the surface of these IC chips in order to produce carbon dangling bond connection layer on the material when the vacuum level of the chamber reaches the work vacuum level; performing multiple vacuum sputtering method to sequentially form a first coating layer, a second coating layer and a third coating layer on the carbon dangling bond connection layer; and breaking the vacuum status of the chamber and taking out the coated IC chips.

Abstract: A manufacturing method for a metal mark plates is disclosed. In this manufacturing method, a welding flux layer is firstly disposed onto a metal base plate, and a plurality of metal mark parts are arranged on corresponding regions of the metal base plate on which the welding flux layer is disposed. Thereafter, a laser spot welding step is performed to assemble the metal mark parts with the metal base plate by heating the backside of the metal back plate at a location corresponding to the welding flux layer. This manufacturing method therefore provides a fast and stable welding way for manufacturing the metal mark plate. Besides, this manufacturing method can be applied for automatic production and precise mass production could thereby be accomplished.

Abstract: The present invention discloses a ceramic member and a manufacturing method thereof. The ceramic member comprises a ceramic substrate and an intermediate layer. Wherein, the intermediate layer is disposed on the ceramic substrate by vacuum depositing, and the intermediate layer is a carbonized metal (MxCy), an oxidized metal (MxOy) or a nitride metal (MxNy). Preferably, the intermediate layer could have a concentration gradient or a thickness gradient to further increase the adhesion between the metal layer deposited on the ceramic substrate.

Abstract: The present invention discloses a method for electrical connection between two surfaces of a ceramic substrate, and the method includes the steps of forming a through hole between the two surfaces of the ceramic substrate corresponding to electrical connection points of a circuit on the ceramic substrate, and then mounting a conductive assembly inside the through hole to form a conduction path between the two surfaces of the ceramic substrate. By this means, time cost of manufacturing of ceramic substrate circuit board could be largely decreased, and the manufacturing procedures could be much simplified as well.

Abstract: The present invention discloses a plastic member and a manufacturing method thereof, the manufacturing method comprises the steps of: providing a plastic substrate; bombarding the plastic substrate by plasma to break at least one carbon-hydrogen bond or at least one carbon-series bond of the plastic substrate, and generating at least one carbon dangling bond on the surface of the plastic substrate; depositing at least one metal atom to chemically react the metal atom with the carbon dangling bond and generate a bonding between the carbon and the metal.

Abstract: The present invention discloses a metal member and a manufacturing method thereof. The metal member comprises a metal substrate and an intermediate layer. Wherein, the intermediate layer is disposed on the metal substrate by vacuum depositing, and the intermediate layer is a carbonized metal. Preferably, the intermediate layer could have a composition gradient or a thickness gradient to further increase the adhesion between the metal layer deposited on the metal substrate.

Abstract: A manufacturing method for a metal mark plates is disclosed. In this manufacturing method, a welding flux layer is firstly disposed onto a metal base plate, and a plurality of metal mark parts are arranged on corresponding regions of the metal base plate on which the welding flux layer is disposed. Thereafter, a laser spot welding step is performed to assemble the metal mark parts with the metal base plate by heating the backside of the metal back plate at a location corresponding to the welding flux layer. This manufacturing method therefore provides a fast and stable welding way for manufacturing the metal mark plate. Besides, this manufacturing method can be applied for automatic production and precise mass production could thereby be accomplished.

Abstract: A solar cell with a superlattice structure and a fabricating method thereof are provided, which includes fabricating a superlattice structure of GaAsN/GaInAs, GaAsN/GaSbAs, or GaAsN/GaInSbAs between a base and an emitter of a middle cell of a triple junction solar cell by a strain-compensation technology. The provided solar cell not only decreases crystalline defects and increases the critical thickness of the crystal, but also makes the energy bandgap of GaAsN and GaInAs reach around the energy of 1.0 eV (electron volt). Hence, the absorption region can be raised to around the energy of 1.0 eV to enhance the efficiency of the solar cell.

Abstract: A method of fabricating a chip package structure includes the steps of providing a lead frame having a die pad, plural leads and at least one structure enhancement element. A chip is then disposed on the die pad and plural bonding wires are formed to electrically connect the chip to the leads. Then, an upper encapsulant and a first lower encapsulant are formed on an upper surface and a lower surface of the lead frame, respectively. The first lower encapsulant has plural concaves to expose the structure enhancement element. Finally, the structure enhancement element is etched with use of the first lower encapsulant as an etching mask until the die pad and one of the leads connected by the structure enhancement element, or two of the adjacent leads connected thereby are electrically insulated.

Abstract: A method of fabricating a chip package is provided. A thin metal plate having a first protrusion part, a second protrusion part and a plurality of third protrusion parts are provided. A chip is disposed on the thin metal plate, and a plurality of bonding wires for electrically connecting the chip to the second protrusion part and the second protrusion part to the third protrusion parts is formed. An upper encapsulant and a lower encapsulant are formed on the upper surface and the lower surface of the thin metal plate respectively. The lower encapsulant has a plurality of recesses for exposing a portion of the thin metal plate at locations where the first protrusion part, the second protrusion part and the third protrusion parts are connected to one another. Finally, the thin metal plate is etched by using the lower encapsulant as an etching mask.

Abstract: A thermal module and a method of manufacturing the same are disclosed. The thermal module includes a first heat dissipation member, a second heat dissipation member, a binding layer, and a metal layer. The first heat dissipation member can be a heat dissipating substrate, and the second heat dissipation member can be a heat pipe or a heat dissipating substrate. The metal layer is coated on the first heat dissipation member through a metal spray process. The binding layer can be a solder paste. By providing the spray-coated metal layer, the thermal module can have upgraded heat dissipation efficiency, increased pull strength, and reduced manufacturing cost.

Abstract: A chip package structure including a chip, a lead frame, first bonding wires and second bonding wires is provided. The chip has an active surface and chip bonding pads disposed thereon. The lead frame is fixed on the chip and the lead frame includes inner leads, at least one bus bar, an insulating layer and transfer bonding pads. The bus bar is located between the chip bonding pads and the inner leads. The insulating layer is disposed on the bus bar and the transfer bonding pads are disposed thereon. The inner leads and the bus bar are located above the active surface. The chip and the insulating layer are located respectively on two opposite surfaces of the bus bar. The first bonding wires respectively connect the chip bonding pads and the transfer bonding pads. The second bonding wires respectively connect the transfer bonding pads and the inner leads.

Abstract: A memory card and a non-volatile memory controller thereof are provided. The non-volatile memory controller includes a firmware download port group, a memory interface unit, a processing unit, and a host interface unit. The firmware download port group is used for coupled to a firmware update fixture. The memory interface unit includes at least one tri-state buffer component, and the memory interface unit is coupled to a non-volatile memory and the firmware download port group through the tri-state buffer component, wherein the tri-state buffer component determines whether to operate in a high-impedance mode or a normal mode according to a mode single. The processing unit accesses the non-volatile memory through the memory interface unit. When the tri-state buffer component operates in the high-impedance mode according to the mode single, the firmware update fixture writes a new firmware into the non-volatile memory through the firmware download port group.

Abstract: The present invention discloses a heat dissipation module and a manufacturing method thereof. The heat dissipation module comprises a metal base, a porous metal layer and a metal plate member. The porous metal layer is disposed on one side of the metal base and includes a plurality of micropores. Parts of the plurality of micropores contain a metal medium. The metal plate member is disposed on one side of the porous metal layer. Heat is rapidly conducted from the metal base through the metal plate member to the environment by means of the porous metal layer and the metal medium.