Patents by Inventor Hung Chuan-Cheng

Hung Chuan-Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10895372
    Abstract: A light source board includes a substrate; a metal reactive layer disposed on the substrate; a metal conductive layer disposed on the metal reactive layer; a metal alloy layer disposed on the metal conductive layer; and at least one light source disposed on the metal alloy layer. A material of the metal reactive layer is a Sn—Bi type alloy or a Sn—Ag—Cu type alloy, and arrangements of materials of the metal reactive layer and the metal conductive layer are respectively an arrangement of silver paste and copper, an arrangement of silver paste and nickel, an arrangement of silver paste and silver, an arrangement of copper paste and copper, an arrangement of copper paste and nickel, or an arrangement of copper paste and silver.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: January 19, 2021
    Assignee: Darfon Electronics Corp.
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho, Tsai-Yu Chen, Hung-Chuan Cheng
  • Patent number: 10727009
    Abstract: A light source board includes a substrate, a composite circuit layer on the substrate, a first protective layer on the composite circuit layer, and a plurality of light sources on the pad portions, respectively. The substrate has a long side, a first short side, and a second short side. The composite circuit layer includes a first conductive trace layer and a second conductive trace layer stacked on the first conductive trace layer. A conductivity of the second conductive trace layer is higher than a conductivity of the first conductive trace layer. The composite circuit layer has a wire portion formed of at least the first conductive trace layer and a plurality of pad portions each formed of at least the first conductive trace layer and the second conductive trace layer. The wire portion is electrically coupled to the pad portions. The first protective layer exposes the pad portions.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: July 28, 2020
    Assignee: Darfon Electronics Corp.
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho, Tsai-Yu Chen, Hung-Chuan Cheng
  • Patent number: 10720289
    Abstract: A light emitting keyboard includes a bottom board, keyswitches, and a lighting board. The lighting board is disposed between the bottom board and the keyswitches or under the bottom board and includes a flexible substrate having a first hole, multiple-light emitting diodes corresponding to the keyswitches, first and second silver-paste circuit layers formed on upper and lower surfaces of the flexible substrate respectively, a via pillar formed in the first hole to be coupled to the first and second silver-paste circuit layers, a copper layer plated on the first and second silver-paste circuit layers, and a first protection layer coated on the copper layer and having second holes. Each multiple-light emitting diode is disposed on the copper layer plated on the first silver-paste circuit layer through the corresponding second hole to be coupled to the first silver-paste circuit layer.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 21, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Hsin-Cheng Ho, Heng-Yi Huang, Tsai-Yu Chen, Hung-Chuan Cheng, Yang-Cheng Wu
  • Patent number: 10692663
    Abstract: A light source board includes a substrate, a composite circuit layer on the substrate, a first protective layer on the composite circuit layer, and a plurality of light sources on the pad portions, respectively. The substrate has a long side, a first short side, and a second short side. The composite circuit layer includes a first conductive trace layer and a second conductive trace layer stacked on the first conductive trace layer. A conductivity of the second conductive trace layer is higher than a conductivity of the first conductive trace layer. The composite circuit layer has a wire portion formed of at least the first conductive trace layer and a plurality of pad portions each formed of at least the first conductive trace layer and the second conductive trace layer. The wire portion is electrically coupled to the pad portions. The first protective layer exposes the pad portions.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: June 23, 2020
    Assignee: Darfon Electronics Corp.
    Inventors: Heng-Yi Huang, Hsin-Cheng Ho, Tsai-Yu Chen, Hung-Chuan Cheng
  • Publication number: 20190368706
    Abstract: A light source board includes a substrate; a metal reactive layer disposed on the substrate; a metal conductive layer disposed on the metal reactive layer; a metal alloy layer disposed on the metal conductive layer; and at least one light source disposed on the metal alloy layer. A material of the metal reactive layer is a Sn—Bi type alloy or a Sn—Ag—Cu type alloy, and arrangements of materials of the metal reactive layer and the metal conductive layer are respectively an arrangement of silver paste and copper, an arrangement of silver paste and nickel, an arrangement of silver paste and silver, an arrangement of copper paste and copper, an arrangement of copper paste and nickel, or an arrangement of copper paste and silver.
    Type: Application
    Filed: January 31, 2019
    Publication date: December 5, 2019
    Applicant: Darfon Electronics Corp.
    Inventors: Heng-Yi HUANG, Hsin-Cheng HO, Tsai-Yu CHEN, Hung-Chuan CHENG
  • Publication number: 20190371537
    Abstract: A light source board includes a substrate, a composite circuit layer on the substrate, a first protective layer on the composite circuit layer, and a plurality of light sources on the pad portions, respectively. The substrate has a long side, a first short side, and a second short side. The composite circuit layer includes a first conductive trace layer and a second conductive trace layer stacked on the first conductive trace layer. A conductivity of the second conductive trace layer is higher than a conductivity of the first conductive trace layer. The composite circuit layer has a wire portion formed of at least the first conductive trace layer and a plurality of pad portions each formed of at least the first conductive trace layer and the second conductive trace layer. The wire portion is electrically coupled to the pad portions. The first protective layer exposes the pad portions.
    Type: Application
    Filed: December 4, 2018
    Publication date: December 5, 2019
    Applicant: Darfon Electronics Corp.
    Inventors: Heng-Yi HUANG, Hsin-Cheng HO, Tsai-Yu CHEN, Hung-Chuan CHENG
  • Publication number: 20190371538
    Abstract: A light source board includes a substrate, a composite circuit layer on the substrate, a first protective layer on the composite circuit layer, and a plurality of light sources on the pad portions, respectively. The substrate has a long side, a first short side, and a second short side. The composite circuit layer includes a first conductive trace layer and a second conductive trace layer stacked on the first conductive trace layer. A conductivity of the second conductive trace layer is higher than a conductivity of the first conductive trace layer. The composite circuit layer has a wire portion formed of at least the first conductive trace layer and a plurality of pad portions each formed of at least the first conductive trace layer and the second conductive trace layer. The wire portion is electrically coupled to the pad portions. The first protective layer exposes the pad portions.
    Type: Application
    Filed: December 4, 2018
    Publication date: December 5, 2019
    Applicant: Darfon Electronics Corp.
    Inventors: Heng-Yi HUANG, Hsin-Cheng HO, Tsai-Yu CHEN, Hung-Chuan CHENG
  • Publication number: 20070166504
    Abstract: The present invention provides an optical disc which includes a substrate and a multi-layer structure. Furthermore, the multi-layer structure is formed above the substrate, and at least one layer of the multi-layer structure contains an anti-oxidant material.
    Type: Application
    Filed: May 31, 2006
    Publication date: July 19, 2007
    Inventors: Chen Peng, Hung-Chuan Cheng, Yao-Wen Chang
  • Publication number: 20070128433
    Abstract: The present invention is to provide an optical disc which comprises a substrate and a multi-layer structure. The multi-layer structure is formed over the substrate, and at least one layer of the multi-layer structure contains an indicating material. Furthermore, the indicating material has a respective color changeable in response to permeation of oxygen or moisture into the layer containing the indicating material.
    Type: Application
    Filed: May 31, 2006
    Publication date: June 7, 2007
    Inventors: Chen Peng, Hung-Chuan Cheng, Yao-Wen Chang
  • Publication number: 20060121233
    Abstract: An optical recording medium comprises a substrate, a recording layer overlying the substrate, and a phosphorus layer overlying the recording layer, wherein the phosphorus layer can be excited to illuminate by irradiation of a laser beam.
    Type: Application
    Filed: December 1, 2005
    Publication date: June 8, 2006
    Inventors: Chia-Sheng Lin, Hung-Chuan Cheng
  • Patent number: 6170557
    Abstract: An automatic machine is designed to test performances of green sand molding and composed of a machine support, a feeding device, a vibration device, a testing device, a detecting device, and a catching device. The green sand is extracted by the feeding device and then screened in the vibration device The selected green sand is received and carried by a test piece sleeve of the catching device. The test piece sleeve is driven to move to the testing device for testing the compatibility of the green sand, to the detecting device for testing the permeability of the green sand, and to the loadcell for testing the green compressive strength of the green sand.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: January 9, 2001
    Assignee: Metal Industries Research & Development Centre
    Inventors: Lin Ching-Fu, Hung Chuan-Cheng, Tseng Chien-Ming, Chang Chao-Chi, Ou Yu-Jen, Kang Chin-Hsing