Patents by Inventor Hung-Chun Chu

Hung-Chun Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7852632
    Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: December 14, 2010
    Assignee: ASUSTeK Computer Inc.
    Inventors: Hung-Chun Chu, Hsi-Feng Lin, Zhi-Houng Pan
  • Publication number: 20090190303
    Abstract: A gap adjusting jig for heat dissipation is suitable to hold at least a heat source of a plate-shaped module. The gap adjusting jig for heat dissipation includes a first heat dissipation plate and a second heat dissipation plate and at least a gap adjusting element. A gap is formed between the first and second heat dissipation plates. The heat source is suitable to be provided in the gap and lean against the first and second heat dissipation plates. The gap adjusting element is connected between the first and second heat dissipation plates. The gap adjusting element is suitable to adjust the gap between the first and second heat dissipation plates to enable the first and second heat dissipation plates to hold the heat source.
    Type: Application
    Filed: June 3, 2008
    Publication date: July 30, 2009
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Hung-Chun Chu, Chun-Teng Chiu, Zhi-Kai Chen, Chien-Han Kao
  • Patent number: 7508667
    Abstract: An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source. The heat sink backplate module includes a body having a plurality of holes, at least a heat pipe, a fins assembly, and a heat spreader. The pluralities of fixing elements of the heat sink are fixed in the holes such that the heat sink is disposed firmly on the heat source. The heat spreader is disposed on a surface close to the circuit board. The heat pipe passing through the body is suitable for heat conducting from the bottom of the circuit board to the fins assembly so that the temperature of the bottom of the circuit board is decreased.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: March 24, 2009
    Assignee: ASUSTeK Computer Inc.
    Inventors: Chun-Chieh Wu, Hung-Chun Chu
  • Publication number: 20090040722
    Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 12, 2009
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Hung-Chun Chu, Hsi-Feng Lin, Zhi-Houng Pan
  • Patent number: 7436667
    Abstract: An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically connected together. The second circuit board is electrically connected to the first circuit board; the first heat sink is electrically connected to the second circuit board; and the first air ventilation duct is connected to the first fan and the first heat sink. The first heat sink introduce the heat generated by the electronic element on the second circuit board to the first fan for better cooling performance. Therefore, the present invention requires only the first fan and the second fan, but is able to provide high cooling efficiencies with a low noise signature.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: October 14, 2008
    Assignee: Asustek Computer, Inc.
    Inventors: Chun-Chieh Wu, Hung-Chun Chu, Hsi-Feng Lin
  • Publication number: 20080123295
    Abstract: An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source. The heat sink backplate module includes a body having a plurality of holes, at least a heat pipe, a fins assembly, and a heat spreader. The pluralities of fixing elements of the heat sink are fixed in the holes such that the heat sink is disposed firmly on the heat source. The heat spreader is disposed on a surface close to the circuit board. The heat pipe passing through the body is suitable for heat conducting from the bottom of the circuit board to the fins assembly so that the temperature of the bottom of the circuit board is decreased.
    Type: Application
    Filed: August 10, 2007
    Publication date: May 29, 2008
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chun-Chieh Wu, Hung-Chun Chu
  • Publication number: 20080024993
    Abstract: An electronic device includes a circuit board and a heat spreader. The circuit board has a first surface, a second surface, and an electronic component. The first surface is opposite to the second surface, and the electronic component is located on the first surface. The heat spreader is disposed on the circuit board has a first portion, a second portion, and a third portion. The first portion is located on the first surface of the circuit board and contacts the electronic component. The second portion is located on the second surface of the circuit board, and the third portion is connected between the first portion and the second portion.
    Type: Application
    Filed: July 26, 2007
    Publication date: January 31, 2008
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Hung-Chun Chu, Chun-Chieh Wu, Hsi-Feng Lin
  • Publication number: 20070289719
    Abstract: A cooling apparatus for dissipating a heat from a heat source by a fluid includes a cooling fin set, a water-cooling pipe, and a heat tube. The water-cooling pipe and the heat tube are penetrating through the cooling fin set. The cooling apparatus further includes a base, and the heat tube is coupled on the base for supporting the cooling pipe and the cooling fins. The cooling pipe further includes an influent combined with the base. A part of the heat from the fluid is transferred to the heat tube from the base and transferred to the cooling fin set from the heat tube and then dissipated. Another part of the heat is transferred to the cooling fin set from the water-cooling pipe. A cooling system with the cooling apparatus is also disclosed.
    Type: Application
    Filed: May 22, 2007
    Publication date: December 20, 2007
    Inventors: Hung-Chun Chu, Chun-Chieh Wu
  • Publication number: 20070268670
    Abstract: An electronic device with a heat dissipation device is described. A printed circuit board has a first electronic component and a second electronic component thereon. The first dissipation device is attached to the first electronic component. The second dissipation device is attached to the second electronic component. At least one heat pipe includes a first straight section, a second straight section and a bent section between the former two. The heat pipe penetrates the first dissipation device and the second dissipation device, wherein the second dissipation device has at least one side engraved slot for securing the heat pipe inside.
    Type: Application
    Filed: May 14, 2007
    Publication date: November 22, 2007
    Inventors: Hung-Chun Chu, Chun-Chieh Wu
  • Publication number: 20070217156
    Abstract: An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically connected together. The second circuit board is electrically connected to the first circuit board; the first heat sink is electrically connected to the second circuit board; and the first air ventilation duct is connected to the first fan and the first heat sink. The first heat sink introduce the heat generated by the electronic element on the second circuit board to the first fan for better cooling performance. Therefore, the present invention requires only the first fan and the second fan, but is able to provide high cooling efficiencies with a low noise signature.
    Type: Application
    Filed: October 11, 2006
    Publication date: September 20, 2007
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chun-Chieh Wu, Hung-Chun Chu, Hsi-Feng Lin