Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.

Abstract: A gap adjusting jig for heat dissipation is suitable to hold at least a heat source of a plate-shaped module. The gap adjusting jig for heat dissipation includes a first heat dissipation plate and a second heat dissipation plate and at least a gap adjusting element. A gap is formed between the first and second heat dissipation plates. The heat source is suitable to be provided in the gap and lean against the first and second heat dissipation plates. The gap adjusting element is connected between the first and second heat dissipation plates. The gap adjusting element is suitable to adjust the gap between the first and second heat dissipation plates to enable the first and second heat dissipation plates to hold the heat source.

Abstract: An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source. The heat sink backplate module includes a body having a plurality of holes, at least a heat pipe, a fins assembly, and a heat spreader. The pluralities of fixing elements of the heat sink are fixed in the holes such that the heat sink is disposed firmly on the heat source. The heat spreader is disposed on a surface close to the circuit board. The heat pipe passing through the body is suitable for heat conducting from the bottom of the circuit board to the fins assembly so that the temperature of the bottom of the circuit board is decreased.

Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.

Abstract: An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically connected together. The second circuit board is electrically connected to the first circuit board; the first heat sink is electrically connected to the second circuit board; and the first air ventilation duct is connected to the first fan and the first heat sink. The first heat sink introduce the heat generated by the electronic element on the second circuit board to the first fan for better cooling performance. Therefore, the present invention requires only the first fan and the second fan, but is able to provide high cooling efficiencies with a low noise signature.

Abstract: An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source. The heat sink backplate module includes a body having a plurality of holes, at least a heat pipe, a fins assembly, and a heat spreader. The pluralities of fixing elements of the heat sink are fixed in the holes such that the heat sink is disposed firmly on the heat source. The heat spreader is disposed on a surface close to the circuit board. The heat pipe passing through the body is suitable for heat conducting from the bottom of the circuit board to the fins assembly so that the temperature of the bottom of the circuit board is decreased.

Abstract: An electronic device includes a circuit board and a heat spreader. The circuit board has a first surface, a second surface, and an electronic component. The first surface is opposite to the second surface, and the electronic component is located on the first surface. The heat spreader is disposed on the circuit board has a first portion, a second portion, and a third portion. The first portion is located on the first surface of the circuit board and contacts the electronic component. The second portion is located on the second surface of the circuit board, and the third portion is connected between the first portion and the second portion.

Abstract: A cooling apparatus for dissipating a heat from a heat source by a fluid includes a cooling fin set, a water-cooling pipe, and a heat tube. The water-cooling pipe and the heat tube are penetrating through the cooling fin set. The cooling apparatus further includes a base, and the heat tube is coupled on the base for supporting the cooling pipe and the cooling fins. The cooling pipe further includes an influent combined with the base. A part of the heat from the fluid is transferred to the heat tube from the base and transferred to the cooling fin set from the heat tube and then dissipated. Another part of the heat is transferred to the cooling fin set from the water-cooling pipe. A cooling system with the cooling apparatus is also disclosed.

Abstract: An electronic device with a heat dissipation device is described. A printed circuit board has a first electronic component and a second electronic component thereon. The first dissipation device is attached to the first electronic component. The second dissipation device is attached to the second electronic component. At least one heat pipe includes a first straight section, a second straight section and a bent section between the former two. The heat pipe penetrates the first dissipation device and the second dissipation device, wherein the second dissipation device has at least one side engraved slot for securing the heat pipe inside.

Abstract: An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically connected together. The second circuit board is electrically connected to the first circuit board; the first heat sink is electrically connected to the second circuit board; and the first air ventilation duct is connected to the first fan and the first heat sink. The first heat sink introduce the heat generated by the electronic element on the second circuit board to the first fan for better cooling performance. Therefore, the present invention requires only the first fan and the second fan, but is able to provide high cooling efficiencies with a low noise signature.